Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2012
11/15/2012US20120289019 Methods of forming a pattern and methods of manufacturing a semiconductor device using the same
11/15/2012US20120289018 SOI SiGe-BASE LATERAL BIPOLAR JUNCTION TRANSISTOR
11/15/2012US20120289017 Method of manufacturing semiconductor device
11/15/2012US20120289016 Localized compressive strained semiconductor
11/15/2012US20120289015 Method for fabricating semiconductor device with enhanced channel stress
11/15/2012US20120289014 Method for fabricating transistor with high-k dielectric sidewall spacer
11/15/2012US20120289013 Semiconductor device and method for fabricating the same
11/15/2012US20120289012 Fabrication method of semiconductor device
11/15/2012US20120289011 Semiconductor integrated circuit device and manufacturing method thereof
11/15/2012US20120289010 Semiconductor Device and Method of Making Same
11/15/2012US20120289009 Manufacturing method for semiconductor structure
11/15/2012US20120289008 Manufacturing method of semiconductor device
11/15/2012US20120289007 Manufacturing method for thin film transistor with polysilicon active layer
11/15/2012US20120289006 Method of manufacturing poly-silicon tft array substrate
11/15/2012US20120289005 Method for manufacturing semiconductor device
11/15/2012US20120289004 Fabrication method of germanium-based n-type schottky field effect transistor
11/15/2012US20120289003 Method for Forming a Semiconductor Device
11/15/2012US20120289002 Flexible interconnect pattern on semiconductor package
11/15/2012US20120289001 Method for Making Solder-top Enhanced Semiconductor Device of Low Parasitic Packaging Impedance
11/15/2012US20120289000 Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device
11/15/2012US20120288999 Method for manufacturing semiconductor modules
11/15/2012US20120288998 Wafer level ic assembly method
11/15/2012US20120288997 Method for fabricating stacked semiconductor system with encapsulated through wire interconnects (twi)
11/15/2012US20120288996 Methods and apparatus for applying an adhesive to a circuit board
11/15/2012US20120288995 Semiconductor Wafer Bonding Incorporating Electrical and Optical Interconnects
11/15/2012US20120288994 Thin film transistors using multiple active channel layers
11/15/2012US20120288993 Semiconductor device and method for manufacturing the same
11/15/2012US20120288988 Method for Manufacturing Semiconductor Layer, Method for Manufacturing Photoelectric Conversion Device, and Semiconductor Layer Forming Solution
11/15/2012US20120288976 Methods for manufacturing low noise chemically-sensitive field effect transistors
11/15/2012US20120288970 Heat treatment method and heat treatment apparatus for heating substrate by irradiating substrate with light
11/15/2012US20120288969 Manufacturing method of semiconductor device and semiconductor manufacturing apparatus
11/15/2012US20120288968 Method for repairing a semiconductor structure having a current-leakage issue
11/15/2012US20120288967 Method for processing circuit in package
11/15/2012US20120288966 Method for decapsulating integrated circuit package
11/15/2012US20120288965 Semiconductor device and manufacturing method thereof
11/15/2012US20120288964 Spin-torque based memory device with read and write current paths modulated with a non-linear shunt resistor
11/15/2012US20120288698 Method of fabrication, device structure and submount comprising diamond on metal substrate for thermal dissipation
11/15/2012US20120288626 Templated Monolayer Polymerization and Replication
11/15/2012US20120288355 Method for storing wafers
11/15/2012US20120288352 System and method using multiple component pane handlers configured to handle and transfer component panes
11/15/2012US20120288348 Automated Material Handling System for Semiconductor Manufacturing Based on a Combination of Vertical Carousels and Overhead Hoists
11/15/2012US20120288347 Conveying device and vacuum apparatus
11/15/2012US20120288083 Systems and methods for forming isolated devices in a handle wafer
11/15/2012US20120287956 Semiconductor laser
11/15/2012US20120287715 Zero Cost NVM Cell Using High Voltage Devices in Analog Process
11/15/2012US20120287709 Non volatile semiconductor memory device and manufacturing method thereof
11/15/2012US20120287695 Semiconductor memory device
11/15/2012US20120287583 Embedded chip package
11/15/2012US20120287579 Board-Level Package With Tuned Mass Damping Structure
11/15/2012US20120287552 Substrate temperature adjusting-fixing device
11/15/2012US20120287094 Thin film transistor, method for manufacturing same, and display apparatus
11/15/2012US20120286819 Mos test structure, method for forming mos test structure and method for performing wafer acceptance test
11/15/2012US20120286814 3D IC Testing Apparatus
11/15/2012US20120286434 Blank including a composite panel with semiconductor chips and plastic package molding compound and method and mold for producing the same
11/15/2012US20120286433 Robust FEBOL and UBM Structure of C4 Interconnects
11/15/2012US20120286432 Integrated circuit packaging system with interconnect and method of manufacture thereof
11/15/2012US20120286431 Integrated Circuit Die Stacks Having Initially Identical Dies Personalized With Switches
11/15/2012US20120286430 Method of Producing a Semiconductor Device and Semiconductor Device Having a Through-Wafer Interconnect
11/15/2012US20120286429 Semiconductor Device and Method of Singulating Thin Semiconductor Wafer on Carrier Along Modified Region Within Non-Active Region Formed by Irradiating Energy
11/15/2012US20120286428 Formation of through-silicon via (tsv) in silicon substrate
11/15/2012US20120286427 Semiconductor device and a manufacturing method thereof
11/15/2012US20120286425 Package having mems element and fabrication method thereof
11/15/2012US20120286424 Die stacking with an annular via having a recessed socket
11/15/2012US20120286422 Semiconductor Device and Method of Forming Interconnect Structure for Encapsulated Die having Pre-Applied Protective Layer
11/15/2012US20120286421 Chip package and method for forming the same
11/15/2012US20120286420 Chip package and method for forming the same
11/15/2012US20120286419 Semiconductor package with interposer block therein
11/15/2012US20120286418 Semiconductor Device and Method of Forming Dummy Pillars Between Semiconductor Die and Substrate for Maintaining Standoff Distance
11/15/2012US20120286417 Method and structure for controlling package warpage
11/15/2012US20120286416 Semiconductor chip package assembly and method for making same
11/15/2012US20120286415 Method of producing semiconductor module and semiconductor module
11/15/2012US20120286413 Integrated circuit package and packaging methods
11/15/2012US20120286412 Semiconductor deveice and method for manufacturing the same
11/15/2012US20120286411 Semiconductor device and manufacturing method thereof, and semiconductor module using the same
11/15/2012US20120286410 Semiconductor device packaging method and semiconductor device package
11/15/2012US20120286409 Utilizing a jumper chip in packages with long bonding wires
11/15/2012US20120286408 Wafer level package with thermal pad for higher power dissipation
11/15/2012US20120286407 Semiconductor Device and Method of Forming Leadframe with Conductive Bodies for Vertical Electrical Interconnect of Semiconductor Die
11/15/2012US20120286406 Semiconductor device with staggered leads
11/15/2012US20120286405 Semiconductor device and method for manufacturing the same
11/15/2012US20120286404 Semiconductor Device and Method of Dual-Molding Die Formed on Opposite Sides of Build-Up Interconnect Structure
11/15/2012US20120286402 Protuberant structure and method for making the same
11/15/2012US20120286400 Semiconductor Device with Optical Sensor and Method of Forming Interconnect Structure on Front and Backside of the Device
11/15/2012US20120286399 Leadframe and method for packaging semiconductor die
11/15/2012US20120286397 Die Seal for Integrated Circuit Device
11/15/2012US20120286395 Embedded capacitor device and methods of fabrication
11/15/2012US20120286392 Suppression of diffusion in epitaxial buried plate for deep trenches
11/15/2012US20120286390 Electrical fuse structure and method for fabricating the same
11/15/2012US20120286388 Solid state image pickup device and method of producing solid state image pickup device
11/15/2012US20120286384 Semiconductor package, semiconductor device manufacturing method, and solid-state imaging device
11/15/2012US20120286383 Efficiently injecting spin-polarized current into semiconductors by interfacing crystalline ferromagnetic oxides directly on the semiconductor material
11/15/2012US20120286382 Co/Ni multilayers with improved out-of-plane anisotropy for magnetic device applications
11/15/2012US20120286381 Electronic mems device comprising a chip bonded to a substrate and having cavities and manufacturing process thereof
11/15/2012US20120286380 Processes and mounting fixtures for fabricating electromechanical devices and devices formed therewith
11/15/2012US20120286378 Microelectromechanical system with balanced center of mass
11/15/2012US20120286377 Nanoelectromechanical Structures Exhibiting Tensile Stress And Techniques For Fabrication Thereof
11/15/2012US20120286376 Semiconductor device and method for fabricating the same
11/15/2012US20120286375 Preserving stress benefits of uv curing in replacement gate transistor fabrication
11/15/2012US20120286373 Gate structure and method for manufacturing the same
11/15/2012US20120286372 Reliability of high-K gate dielectric layers
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