Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2012
11/14/2012CN202534638U Test tool for bipolar semiconductor chip
11/14/2012CN202534637U Solar cell panel appearance inspection device
11/14/2012CN202534636U Test device for semiconductor-packaging distance piece
11/14/2012CN202534635U Semiconductor device
11/14/2012CN1915572B Laser irradiation method and laser irradiation device and method of manufacturing semiconductor device
11/14/2012CN1825616B Display device, electronic equipment, and manufacturing method of display device
11/14/2012CN1670624B Etching composition
11/14/2012CN1458665B Laminate layer transfer method and method for producing semiconductor device
11/14/2012CN102782859A Method for manufacturing semiconductor device
11/14/2012CN102782858A Field-effect transistor, semiconductor memory, display element, image display device, and system
11/14/2012CN102782857A 半导体装置 Semiconductor device
11/14/2012CN102782850A Semiconductor-metal-on-insulator structures, methods of forming such structures, and semiconductor devices including such structures
11/14/2012CN102782849A Device having memristive memory
11/14/2012CN102782848A Thyristor-based memory cells, devices and systems including the same and methods for forming the same
11/14/2012CN102782845A 半导体装置 Semiconductor device
11/14/2012CN102782842A Systems and methods providing arrangements of vias
11/14/2012CN102782835A 半导体装置 Semiconductor device
11/14/2012CN102782834A Through silicon via lithographic alignment and registration
11/14/2012CN102782833A Semiconductor structure made using improved ion implantation process
11/14/2012CN102782832A Grounded chuck
11/14/2012CN102782831A 静电吸盘 Electrostatic chuck
11/14/2012CN102782830A A method for imaging workpiece surfaces at high robot transfer speeds with reduction or prevention of motion-induced distortion
11/14/2012CN102782829A Non-uniform vacuum profile die attach tip
11/14/2012CN102782828A Metrology system for imaging workpiece surfaces at high robot transfer speeds
11/14/2012CN102782827A Mobile electrostatic carriers for thin wafer processing
11/14/2012CN102782826A Apparatus and method for transporting substrates
11/14/2012CN102782825A Interconnect pattern for high performance interfaces
11/14/2012CN102782824A Electroless nickel and gold plating in semiconductor device
11/14/2012CN102782823A Silicon carbide semiconductor device and method for manufacturing same
11/14/2012CN102782822A Semiconductor device and method for manufacturing semiconductor device
11/14/2012CN102782821A Vertical transistor including reentrant profile
11/14/2012CN102782820A Method for manufacturing silicon carbide semiconductor device and apparatus for manufacturing silicon carbide semiconductor device
11/14/2012CN102782819A Structure and method to form a thermally stale silicide in narrow dimension gate stacks
11/14/2012CN102782818A Conductivity based selective etch for gan devices and applications thereof
11/14/2012CN102782817A Plasma processing device and method
11/14/2012CN102782816A Method and apparatus for single step selective nitridation
11/14/2012CN102782815A Closed-loop control of CMP slurry flow
11/14/2012CN102782814A Pad conditioning sweep torque modeling to achieve constant removal rate
11/14/2012CN102782813A Film for wafer processing, and method for manufacturing semiconductor device using film for wafer processing
11/14/2012CN102782812A Semiconductor wafer having scribe lane alignment marks for reducing crack propagation
11/14/2012CN102782811A Method and apparatus for enhanced lifetime and performance of ion source in an ion implantation system
11/14/2012CN102782810A Methods of forming a low resistance silicon metal contact
11/14/2012CN102782809A Epitaxial wafer, light-receiving element, optical sensor device, and method for manufacturing epitaxial wafer and light-receiving element
11/14/2012CN102782808A P-type AlGaN layer, method for producing same and group III nitride semiconductor light-emitting element
11/14/2012CN102782807A Substrate treatment device and substrate treatment method
11/14/2012CN102782806A Stage device
11/14/2012CN102782805A Semiconductor manufacturing system
11/14/2012CN102782804A Semiconductor chip, semiconductor wafer and semiconductor chip manufacturing method
11/14/2012CN102782580A Pattern forming method
11/14/2012CN102782579A Negative photosensitive resin composition, interlayer insulating film and method of formation of same
11/14/2012CN102782446A Substrate-inspecting device
11/14/2012CN102782195A Semiconductor epitaxial substrate
11/14/2012CN102782184A Cleaning solvent and cleaning method for metallic compound
11/14/2012CN102782113A Cleaning solution for sidewall polymer of damascene processes
11/14/2012CN102782074A Resin composition for adhesive agent, adhesive agent comprising the resin composition, adhesive sheet, and printed wiring board involving the adhesive sheet as adhesive layer
11/14/2012CN102782050A Curable composition, hardened material, and method for using curable composition
11/14/2012CN102781861A Glass composition for semiconductor junction protection, production method for semiconductor device, and semiconductor device
11/14/2012CN102781637A Method for making holes using a fluid jet
11/14/2012CN102781628A Polishing pad and production method therefor, and production method for semiconductor device
11/14/2012CN102781627A Polishing pad, manufacturing method therefor, and method for manufacturing a semiconductor device
11/14/2012CN102781626A Polishing pad
11/14/2012CN102779893A Solar battery substrate automatic shunting device
11/14/2012CN102779858A Power diode device and preparation method thereof
11/14/2012CN102779857A Edge termination structures for silicon carbide devices and methods of fabricating silicon carbide devices incorporating same
11/14/2012CN102779855A Double-schottky-junction zinc oxide semiconductor film transistor and manufacturing method
11/14/2012CN102779854A 半导体装置 Semiconductor device
11/14/2012CN102779853A Tunneling transistor made on silicon germanium epitaxial layer and making method of tunneling transistor
11/14/2012CN102779849A Semiconductor device and method for manufacturing semiconductor device
11/14/2012CN102779845A Laminated metallic oxide gate dielectric layer and preparation method thereof
11/14/2012CN102779843A Transistor and forming method thereof
11/14/2012CN102779841A Protuberant structure and method for making the same
11/14/2012CN102779838A Silicon base tensile strain substrate structure and preparation method of silicon base tensile strain substrate structure
11/14/2012CN102779837A Six-transistor static random access memory unit and manufacturing method thereof
11/14/2012CN102779835A Protuberant structure and method for making the same
11/14/2012CN102779833A Organic electro-luminescence display device and method for fabricating the same
11/14/2012CN102779832A Structure, manufacture method and drive circuit of organic light-emitting pixel
11/14/2012CN102779830A Metallic oxide display device and manufacturing method thereof
11/14/2012CN102779822A One-time programmable devices and methods of forming the same
11/14/2012CN102779813A Semiconductor device and manufacturing method thereof, and semiconductor module using the same
11/14/2012CN102779811A Chip package and chip packaging method
11/14/2012CN102779810A MOS test structure, method for forming MOS test structure
11/14/2012CN102779809A Chip package and method for forming the same
11/14/2012CN102779808A Integrated circuit package and packaging methods
11/14/2012CN102779807A RDL (radiological defense laboratory) technology-compatible inductive component and manufacture method
11/14/2012CN102779805A Board-level package with tuned mass damping structure
11/14/2012CN102779803A 集成电路芯片封装及其制造方法 Integrated circuit chip package and manufacturing method
11/14/2012CN102779802A Semiconductor packaging structure and manufacturing method thereof
11/14/2012CN102779800A Chip package and method for forming the same
11/14/2012CN102779795A Semiconductor device and method for manufacturing the same
11/14/2012CN102779794A Method and structure for controlling package warpage
11/14/2012CN102779793A Electronic element packaging structure, electronic device and manufacturing method thereof
11/14/2012CN102779792A Die seal for integrated circuit device
11/14/2012CN102779791A Bump structure and fabrication method thereof
11/14/2012CN102779790A Method for manufacturing semiconductor device
11/14/2012CN102779789A Manufacturing method of semiconductor devices
11/14/2012CN102779788A Method for integrating processes of double-gate pole and double-multi-crystal silicon capacitor
11/14/2012CN102779787A Preparation method of III-nitride semiconductor devices
11/14/2012CN102779786A Splitting method for optical device wafer
11/14/2012CN102779785A Organic thin film transistor array substrate and manufacturing method thereof, and display device
11/14/2012CN102779784A Thin film transistor array substrate manufacturing method
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