Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2012
11/07/2012CN102768987A Airspace manufacturing method for damascene process
11/07/2012CN102768986A Method for manufacturing air space in damascene process
11/07/2012CN102768985A Damascus manufacturing method with air clearances
11/07/2012CN102768984A Method for repairing metastable state chemical bond on surface of wafer tungsten connecting layer
11/07/2012CN102768983A Method for preparing mixed crystal orientation substrate with insulating buried layer
11/07/2012CN102768982A Method for preparing mixed crystallographic direction substrate with insulating buried layer
11/07/2012CN102768981A Method for preparing substrate with insulating buried layer
11/07/2012CN102768980A Method for treating surface of substrate and method for manufacturing substrate with insulating buried layer
11/07/2012CN102768979A Method for fabricating nonvolatile memory device
11/07/2012CN102768978A Method for increasing adhesion between polysilazane and silicon nitride
11/07/2012CN102768977A Manipulator, atmospheric transmission unit and wafer transmission method
11/07/2012CN102768976A Prealignment device and method for substrate
11/07/2012CN102768975A Cassette positioning mechanism and chamber device with same
11/07/2012CN102768974A Wafer cleaning equipment
11/07/2012CN102768973A Laser auxiliary device for ion injection and using method for laser auxiliary device
11/07/2012CN102768972A Wafer drying device
11/07/2012CN102768971A Etcher table for eliminating crystalline condensation defect
11/07/2012CN102768970A Multi-nanometer-projection apparatus for lithography, oxidation, inspection, and measurement
11/07/2012CN102768969A Light spot suppression method in bright field defect scanning
11/07/2012CN102768968A Method for detecting diffusivity of wellblock implantation ions in different concentrations
11/07/2012CN102768967A Method for monitoring homogeneity and stability of F element ion injection process
11/07/2012CN102768966A Cleaning sheet, cleaning member, cleaning method and continuity test apparatus
11/07/2012CN102768965A Semiconductor device and manufacturing method of the same
11/07/2012CN102768964A Method of manufacturing semiconductor component
11/07/2012CN102768963A Circuit structure and manufacturing method thereof
11/07/2012CN102768962A Integrated circuit package and assembling method therefor
11/07/2012CN102768961A Method for producing wafer level package and corresponding semiconductor package
11/07/2012CN102768960A Package structure and manufacturing method thereof
11/07/2012CN102768959A Integrated circuit packaging system with routed circuit lead array and method of manufacture thereof
11/07/2012CN102768958A Integrated circuit packaging system with pad connection and method of manufacture thereof
11/07/2012CN102768957A Fin-type field-effect transistor and manufacturing method thereof
11/07/2012CN102768956A Method for manufacturing thin line with relatively small edge roughness
11/07/2012CN102768955A Method for forming low-loading-effect thin film
11/07/2012CN102768954A Polishing liquid for CMP and polishing method
11/07/2012CN102768953A Process for eliminating side wall width load effect
11/07/2012CN102768952A Method for reprocessing unqualified monocrystalline silicon wafers after diffusion
11/07/2012CN102768951A Method for preparing black silicon by metallic copper ion auxiliary etching
11/07/2012CN102768950A Method for forming holes in substrate of nitride device by mixing type etching
11/07/2012CN102768949A Surface treatment method for substrate with insulating buried layer
11/07/2012CN102768948A Method for manufacturing reinforced trench IGBT (insulated gate bipolar translator) reliability device
11/07/2012CN102768947A Power semiconductor device with junction termination extension structure and manufacturing method of junction termination extension structure
11/07/2012CN102768946A Rapid annealing method for ohmic contact on back side of carborundum device
11/07/2012CN102768945A Method for producing indium gallium zinc oxide semiconductor thin film by using sol-gel method
11/07/2012CN102768944A Method for repairing layer-removed sample
11/07/2012CN102768943A Method for restoring surface charge imbalance of wafer tungsten connection layer
11/07/2012CN102768942A Substrate cleaning and manufacturing technology
11/07/2012CN102768941A Method and device for dispatching to batch machine
11/07/2012CN102768940A Method and device for selecting operation machines on production line
11/07/2012CN102768848A Semiconductor device, semiconductor module and method of manufacturing the same
11/07/2012CN102768697A Adaptive fin design for FinFETs
11/07/2012CN102768432A Color filter array substrate and manufacturing method thereof
11/07/2012CN102768017A Line width measuring device and method
11/07/2012CN102766409A Polishing liquid for CMP and polishing method
11/07/2012CN102766407A Polishing agent and method for polishing substrate using the polshing agent
11/07/2012CN102765166A S-shaped flow path plastic packaging component for four groups of MGP moulds
11/07/2012CN102764742A Rinsing device for silicon wafer fragments
11/07/2012CN102300419B Welding method of coaxial diode and circuit board
11/07/2012CN102263133B Low-gate charge low-on resistance deep trench power metal oxide semiconductor field effect transistor (MOSFET) device and manufacturing method
11/07/2012CN102231363B Manufacturing method for ohmic contact with low specific contact resistance and low roughness
11/07/2012CN102214689B Terminal protection structure of super junction device and manufacturing method of terminal protection structure
11/07/2012CN102214641B Wafer-level semiconductor device packages with stacking functionality
11/07/2012CN102201406B Bipolar CMOS DMOS (BCD) integrated device based on N type extension layer and manufacture method thereof
11/07/2012CN102201390B Chip on film (COF) packaging substrate for high-pixel camera module and manufacturing method thereof
11/07/2012CN102184842B Method for patterning sapphire by combining wet etching and dry etching
11/07/2012CN102148130B Method for improving control capability of surface photoetching process sensitive to external environment
11/07/2012CN102130167B Double diffused drain metal oxide semiconductor (DDDMOS) device and method for manufacturing same
11/07/2012CN102130162B Laterally diffused MOSFET (LDMOS) and method for manufacturing same
11/07/2012CN102130155B Manufacturing method of silicon control rectifier structure
11/07/2012CN102130028B Lower hot-pressing device on RFID (radio frequency identification) flip packaging device
11/07/2012CN102130014B Method for manufacturing FinFET (field effect transistor)
11/07/2012CN102129971B Method and system for etching graphical sapphire substrate
11/07/2012CN102117827B Parasitic vertical PNP device in bipolar complementary metal oxide semiconductor (BiCMOS) process
11/07/2012CN102117762B Shallow trench isolation channel
11/07/2012CN102117740B Method for improving shape of germanium-silicon or germanium-silicon-carbon monocrystal and polycrystal interface
11/07/2012CN102110627B Three-rod quartz boat for vertical oxidation furnace tube
11/07/2012CN102104015B Chip picking and position aligning confirmation method for ink dot-free test
11/07/2012CN102103993B Preparation method of grid in groove metal oxide semiconductor (MOS) device
11/07/2012CN102097465B Parasitic vertical PNP triode in BiCMOS process and manufacturing method thereof
11/07/2012CN102097299B Saturated doping process of thick polycrystalline resistor
11/07/2012CN102088024B 半导体存储器装置 The semiconductor memory device
11/07/2012CN102082082B Epitaxial technique for filling high aspect ratio groove
11/07/2012CN102074464B Boron-aluminum dispersion process for high-power transistor chip
11/07/2012CN102070119B Bending and forming method of thin silicon wafer
11/07/2012CN102064097B Preparation method for mixed crystal material and semiconductor element prepared from same
11/07/2012CN102057463B Method for manufacturing nitrogen compound semiconductor substrate, nitrogen compound semiconductor substrate, method for manufacturing single crystal SiC substrate, and single crystal SiC substrate
11/07/2012CN102054785B Manufacturing method of high-voltage BCD semiconductor device
11/07/2012CN102054715B Method of fabricating backside-illuminated image sensor
11/07/2012CN102054667B Method for applying photoresist lifting-off technology to protect photoetching alignment marks
11/07/2012CN102047391B Techniques and system for uniformity tuning of ion beam
11/07/2012CN102047382B External electrode discharge lamp and ultraviolet ray irradiating apparatus using the same
11/07/2012CN102044520B Package carrier plate, package structure and manufacturing process of package carrier plate
11/07/2012CN102034722B Mold for PLCC (plastic leaded chip carrier)
11/07/2012CN102013420B Semiconductor encapsulating structure and encapsulating method thereof
11/07/2012CN102007576B Nitride-based semiconductor device and method for fabricating the same
11/07/2012CN101996915B Driving device and die bonder
11/07/2012CN101989602B Trench MOSFET
11/07/2012CN101983413B Ion implanter, ion implantation method
11/07/2012CN101982878B Embedded type assembly substrate and manufacturing method thereof
11/07/2012CN101971234B Active matrix substrate, display device, and method for manufacturing active matrix substrate
11/07/2012CN101960385B Multi-photon exposure system
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