Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2012
11/21/2012CN101990703B High throughput chemical mechanical polishing system
11/21/2012CN101990697B Method for manufacturing bonded substrate
11/21/2012CN101981665B Colloidal silica with modified surface and polishing composition for CMP containing the same
11/21/2012CN101981654B Method for producing SOI substrate
11/21/2012CN101980798B Plasma cleaning apparatus for a semiconductor panel with cleaning chambers
11/21/2012CN101978469B Thermal anneal of block copolymer films with top interface constrained to wet both blocks with equal preference
11/21/2012CN101971302B Microwave introducing mechanism, microwave plasma source and microwave plasma processing apparatus
11/21/2012CN101971096B Radiation-sensitive resin composition
11/21/2012CN101964326B Manufacturing method of high-voltage semiconductor device
11/21/2012CN101960564B Heated valve manifold for ampoule
11/21/2012CN101958292B Printed circuit board, encapsulation piece and manufacture methods thereof
11/21/2012CN101958258B Ball filling device and method
11/21/2012CN101957560B Patterning method and stacking structure for patterning
11/21/2012CN101952935B Vacuum processing device, method for maintaining vacuum processing device and vacuum processing factory
11/21/2012CN101939396B Adhesive composition for electronic components and adhesive sheet for electronic components using the same
11/21/2012CN101930904B Assembly of wafer ejector and imaging device
11/21/2012CN101908488B Ditching type metal-oxide semiconductor assembly manufacturing method
11/21/2012CN101903993B Method for forming semiconductor thin film and method for manufacturing thin film semiconductor device
11/21/2012CN101897001B Process of treating defects during the bonding of wafers
11/21/2012CN101894807B TFT-LCD (Thin Film Transistor-Liquid Crystal Display) array base plate and manufacturing method thereof
11/21/2012CN101889343B Hybrid microscale-nanoscale neuromorphic integrated circuit
11/21/2012CN101868852B Photosensitive adhesive, semiconductor device and method for manufacturing semiconductor device
11/21/2012CN101866880B Method for separating base plate and semiconductor layer
11/21/2012CN101861643B Photovoltaic cell manufacturing
11/21/2012CN101859770B 半导体结构及其形成方法 And a method for forming a semiconductor structure
11/21/2012CN101853854B Groove power MOS component with improved type terminal structure and manufacturing method thereof
11/21/2012CN101847648B Active matrix organic light-emitting diode pixel structure and manufacturing method thereof
11/21/2012CN101840934B Bottom-drain LDMOS power MOSFET structure having a top drain strap and manufacture method thereof
11/21/2012CN101828187B Semiconductor device metal programmable pooling and dies
11/21/2012CN101825788B Touch display, TFT-LCD (Thin Film Transistor Liquid Crystal Display) array substrate and manufacture method thereof
11/21/2012CN101819361B TFT-LCD (Thin Film Transistor Liquid Crystal Display) array substrate and manufacture method thereof
11/21/2012CN101814511B TFT-LCD (Thin Film Transistor Liquid Crystal Display) array substrate and manufacture method thereof
11/21/2012CN101809716B Methods of low-K dielectric and metal process integration
11/21/2012CN101783397B Organic el device manufacture apparatus, deposition apparatus and deposition method thereof, liquid crystal display manufacture apparatus, alignment apparatus and alignment method
11/21/2012CN101777586B Hybrid junction source/drain field effect transistor and preparation method thereof
11/21/2012CN101770121B Thin film transistor liquid crystal display (TFT-LCD) array substrate and manufacturing method thereof
11/21/2012CN101752344B Contact plug electric fuse structure and method for manufacturing contact plug electric fuse device
11/21/2012CN101752273B Method of manufacturing semiconductor device
11/21/2012CN101746605B System for keeping and supplying substrate
11/21/2012CN101743618B Epitaxial methods and templates grown by the methods
11/21/2012CN101728267B Method for manufacturing semiconductor device
11/21/2012CN101681867B Treating apparatus
11/21/2012CN101675505B Hardmask open and etch profile control with hardmask open
11/21/2012CN101650503B Thin film transistor array substrate and LCD
11/21/2012CN101632330B Plasma processing apparatus, power supply apparatus and method for using plasma processing apparatus
11/21/2012CN101617388B Nitride semiconductor substrate
11/21/2012CN101587862B Method for forming insulating structure and semiconductor structure
11/21/2012CN101573792B Preferentially deposited lubricant to prevent anti-stiction in micromechanical systems
11/21/2012CN101572214B Tin ball removing method of semiconductor packaging element
11/21/2012CN101571677B Lithographic projection apparatus and a method of operating the same
11/21/2012CN101562144B Method for manufacturing a semiconductor device, method and structure for mounting the semiconductor device
11/21/2012CN101556946B Method of forming a semiconductor package and structure thereof
11/21/2012CN101533824B Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same
11/21/2012CN101529576B Apparatus and method for substrate electroless plating
11/21/2012CN101506946B Method for manufacturing group III nitride compound semiconductor light-emitting device, group III nitride compound semiconductor light-emitting device, and lamp
11/21/2012CN101470343B Mask blank manufacturing method and coater
11/21/2012CN101461062B Power ic device and method for manufacturing the same
11/21/2012CN101440259B Metal polishing solution and polishing method
11/21/2012CN101437918B Compositions and methods for cmp of semiconductor materials
11/21/2012CN101431035B Component mounting device
11/21/2012CN101419957B Semiconductor device and fabrication process thereof
11/21/2012CN101409277B Assembly comprising an electromagnetically screened SMD component, method and use
11/21/2012CN101402808B Conductive pattern formation ink, conductive pattern and wiring substrate
11/21/2012CN101378032B Microlens and method of fabricating thereof
11/21/2012CN101359646B Semiconductor wafer and manufacturing method for semiconductor device
11/21/2012CN101355067B Improved electrical connections for multichip modules
11/21/2012CN101331092B Notch stop pulsing process for plasma processing system
11/21/2012CN101322219B Means to establish orientation of ion beam to wafer and correct angle errors
11/21/2012CN101291551B Life estimating method and treating system for heater wire, heating apparatus, and storage medium
11/21/2012CN101275057B Metal-polishing liquid and polishing method
11/21/2012CN101266372B Pixel structure and method of manufacture
11/21/2012CN101236356B Photoresist composition, thin film patterning method using the same, and method of fabricating liquid crystal display using the same
11/21/2012CN101207059B Container transport system and measurement container
11/21/2012CN101192604B Integrated circuit element, chip and method of manufacture
11/21/2012CN101145560B Semiconductor device and method of manufacturing the same
11/20/2012USRE43819 Thin film transistor array substrate and method of fabricating the same
11/20/2012USRE43818 Fabrication of an integrated circuit package
11/20/2012US8316328 Apparatus for manufacturing a photomask
11/20/2012US8315730 Methods for non lot-based integrated circuit manufacturing
11/20/2012US8315101 Non-volatile memory and semiconductor device
11/20/2012US8315029 ESC high voltage control and methods thereof
11/20/2012US8314930 Inspection device and inspection method
11/20/2012US8314870 Solid-state imaging device and electronic apparatus
11/20/2012US8314635 Methods for forming programmable transistor array comprising basic transistor units
11/20/2012US8314479 Leadframe package with recessed cavity for LED
11/20/2012US8314478 Semiconductor memory device and manufacturing the same
11/20/2012US8314477 Deposited semiconductor structure to minimize N-type dopant diffusion and method of making
11/20/2012US8314474 Under bump metallization for on-die capacitor
11/20/2012US8314473 Die backside standoff structures for semiconductor devices
11/20/2012US8314472 Semiconductor structure comprising pillar
11/20/2012US8314466 Silicon structure, method for manufacturing the same, and sensor chip
11/20/2012US8314465 Dielectric layer for semiconductor device and method of manufacturing the same
11/20/2012US8314452 MIM capacitors in semiconductor components
11/20/2012US8314450 Solid-state imaging device and method for manufacturing same
11/20/2012US8314449 MIS transistor and CMOS transistor
11/20/2012US8314445 Plasmonic device, system, and methods
11/20/2012US8314443 Semiconductor light emitting device with a contact formed on a textured surface
11/20/2012US8314440 Light emitting diode chip and method of fabricating the same
11/20/2012US8314439 Light emitting diode with nanostructures and method of making the same
11/20/2012US8314430 Optoelectronic component and method for the manufacture of a plurality of optoelectronic components
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