Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2012
11/22/2012US20120292699 Semiconductor apparatus and manufacturing method thereof
11/22/2012US20120292698 Lateral double diffused metal oxide semiconductor device and method of manufacturing the same
11/22/2012US20120292694 High switching trench mosfet
11/22/2012US20120292690 Method of manufacturing semiconductor device
11/22/2012US20120292689 Semiconductor Structure and Method for Operating the Same
11/22/2012US20120292688 Highly integrated mos device and the manufacturing method thereof
11/22/2012US20120292687 Super junction transistor and fabrication method thereof
11/22/2012US20120292684 Non-volatile memory device and method for fabricating the same
11/22/2012US20120292682 Electrically Erasable Programmable Non-Volatile Memory
11/22/2012US20120292679 Semiconductor device and manufacturing method thereof
11/22/2012US20120292678 Bi-directional self-aligned fet capacitor
11/22/2012US20120292674 Semiconductor device and manufacturing method thereof
11/22/2012US20120292673 Semiconductor Device and Manufacturing Method Thereof
11/22/2012US20120292672 Finfet integrated circuits and methods for their fabrication
11/22/2012US20120292671 Method of Forming Spacers That Provide Enhanced Protection for Gate Electrode Structures
11/22/2012US20120292670 Post-Silicide Process and Structure For Stressed Liner Integration
11/22/2012US20120292669 Field effect transistor structure and method of forming same
11/22/2012US20120292666 Semiconductor device
11/22/2012US20120292665 High performance multigate transistor
11/22/2012US20120292664 Integrated Circuit (IC) Chip Having Both Metal and Silicon Gate Field Effect Transistors (FETs) and Method of Manufacture
11/22/2012US20120292649 Semiconductor light emitting device, wafer, and method for manufacturing nitride semiconductor crystal layer
11/22/2012US20120292648 Nitride semiconductor device, nitride semiconductor wafer, and method for manufacturing nitride semiconductor layer
11/22/2012US20120292642 Functional element and manufacturing method of same
11/22/2012US20120292641 Semiconductor device having at least one contact, and manufacturing method for a semiconductor device having at least one contact
11/22/2012US20120292639 Stressed semiconductor device and method of manufacturing
11/22/2012US20120292638 Process for manufacturing stress-providing structure and semiconductor device with such stress-providing structure
11/22/2012US20120292637 Dual Cavity Etch for Embedded Stressor Regions
11/22/2012US20120292632 Nitride semiconductor device, nitride semiconductor wafer and method for manufacturing nitride semiconductor layer
11/22/2012US20120292628 Thin film transistor, array substrate and preparation method thereof
11/22/2012US20120292617 In-Ga-O OXIDE SINTERED BODY, TARGET, OXIDE SEMICONDUCTOR THIN FILM, AND MANUFACTURING METHODS THEREFOR
11/22/2012US20120292615 Semiconductor memory device and manufacturing method thereof
11/22/2012US20120292612 Backplane for flat panel display apparatus, flat panel display apparatus, and method of manufacturing the backplane
11/22/2012US20120292610 Oxide semiconductor devices, methods of manufacturing oxide semiconductor devices, display devices having oxide semiconductor devices, methods of manufacturing display devices having oxide semiconductor devices
11/22/2012US20120292593 Nitride semiconductor device, nitride semiconductor wafer, and method for manufacturing nitride semiconductor layer
11/22/2012US20120292590 Optical component
11/22/2012US20120292589 Nonvolatile memory element and method of manufacturing the nonvolatile memory element
11/22/2012US20120292585 Continuous plane of thin-film materials for a two-terminal cross-point memory
11/22/2012US20120291955 Large area icp source for plasma application
11/22/2012US20120291952 Method and system for monitoring an etch process
11/22/2012US20120291267 Joint apparatus
11/22/2012DE202012009416U1 Leuchtvorrichtung Lighting device
11/22/2012DE112011100462T5 Feintröpfchen-Zerstäuber für die Flüssigprekursor-Verdampfung Fine droplet sprayer for Flüssigprekursor evaporation
11/22/2012DE112011100332T5 Oxidverdampfungsmaterial, dampfabgeschiedene dünnschicht und solarzelle Oxidverdampfungsmaterial, vapor-deposited thin-film solar cell and
11/22/2012DE112010005011T5 Polymerblockgehäuse mit Durchkontakten Polymer block housing with vias
11/22/2012DE112010004324T5 Mehrfache Breiten-Merkmale in integrierten Schaltkreisen Multiple-width features in integrated circuits
11/22/2012DE112010004307T5 Silicium-auf Isolator-Hybridwafer mit Doppel-Box-Rückgate und Kanälen mit verbesserter Beweglichkeit Silicon-on-insulator wafer-hybrid double-box back gate and canals with improved mobility
11/22/2012DE112010003836T5 Behandlungslösung zur Verhinderung eines Musterzusammenbruchs in einem feinen Metallstrukturkörper und Verfahren zur Herstellung eines feinen Metallstrukturkörpers, bei dem diese eingesetzt wird Treatment solution for preventing a pattern collapse in a fine metal structure body and method for producing a fine metal structure body in which it is used
11/22/2012DE10339990B4 Verfahren zur Herstellung einer Metallleitung mit einer erhöhten Widerstandsfähigkeit gegen Elektromigration entlang einer Grenzfläche einer dielektrischen Barrierenschicht mittels Implantieren von Material in die Metalleitung A method of manufacturing a metal pipe with an increased resistance to electromigration along a boundary surface of a dielectric barrier layer by implanting material into the metal line
11/22/2012DE10323224B4 Verfahren zum Wiederherstellen von Kontaktflächen einer Elektrode Methods to Recover contact surfaces of an electrode
11/22/2012DE10254927B4 Verfahren zur Herstellung von leitfähigen Strukturen auf einem Träger und Verwendung des Verfahrens A process for preparing conductive structures on a carrier, and use of the method
11/22/2012DE102012206998A1 Halbleiterbauelemente mit eingekapselten Isolationsgebieten und zugehörige Fertigungsverfahren Semiconductor devices encapsulated insulation areas and associated manufacturing processes
11/22/2012DE102012206478A1 Extrem-dünner-Halbleiter-auf-Isolator(ETSOI)-FET mit einem Rück-Gate und verringerter Parasitärkapazität sowie Verfahren zu dessen Herstellung Ultra-thin semiconductor-on-insulator (ETSOI)-FET having a back gate and a reduced parasitic capacitance, as well as method for its preparation
11/22/2012DE102012104304A1 Verfahren zur Herstellung einer Metallschicht auf einem Substrat und Bauelement A process for preparing a metal layer on a substrate and component
11/22/2012DE102012104270A1 Halbleiterkomponente und Verfahren zum Herstellen einer Halbleiterkomponente Semiconductor component and method of manufacturing a semiconductor component
11/22/2012DE102012103571A1 Halbleiterstruktur mit Passivierung durch Versatz zur Verringerung der Elektromigration Semiconductor structure with passivation by offset in order to reduce the electromigration
11/22/2012DE102011107072B3 Verfahren zum ausbilden einer oxidschicht auf einem substrat bei tiefen temperaturen A method of forming an oxide layer on a substrate at low temperatures
11/22/2012DE102011076185A1 Halbleiterbauelemente mit reduzierter STI-Topographie durch Anwenden elner chemischen Oxidabtragung Semiconductor devices with reduced STI topography by applying Elner chemical Oxidabtragung
11/22/2012DE102011075888A1 Halbleitervorrichtung mit mindestens einem Kontakt und Herstellungsverfahren für eine Halbleitervorrichtung mit mindestens einem Kontakt A semiconductor device having at least one contact and manufacturing method of a semiconductor device having at least one contact
11/22/2012DE102011055767A1 Halbleitervorrichtung mit Bonding-Fläche und Verfahren zur Herstellung derselben A semiconductor device having bonding surface and method of making same
11/22/2012DE102011055736A1 Halbleitervorrichtung mit einer Bonding-Fläche und einer Abschirmungsstruktur und Verfahren zur Herstellung derselben A semiconductor device having a bonding surface and a shield structure and method of manufacturing the same
11/22/2012DE102011051024A1 Verfahren zum stoffschlüssigen Verbinden von Elementen A process for the cohesive joining members
11/22/2012DE102010005904B4 Verfahren zur Herstellung einer Halbleiterscheibe A process for producing a semiconductor wafer
11/22/2012DE102009038776B4 Halbleitervorrichtung mit einem internen Isoliertgatebipolartransistor A semiconductor device comprising an internal Isoliertgatebipolartransistor
11/22/2012DE102008049725B4 CMOS-Bauelement mit NMOS-Transistoren und PMOS-Transistoren mit stärkeren verformungsinduzierenden Quellen und Metallsilizidgebieten mit geringem Abstand und Verfahren zur Herstellung des Bauelements CMOS device with NMOS transistors and PMOS transistors with increased strain-inducing source and metal silicide at a small distance and processes for producing the component
11/22/2012DE102007040587B4 Halbleitervorrichtung und Herstellungsverfahren derselben A semiconductor device and manufacturing method thereof
11/22/2012DE102005017288B4 Verfahren zur Herstellung einer Halbleitervorrichtung mit einem Graben in einem Siliziumcarbid-Halbleitersubstrat A method of manufacturing a semiconductor device having a trench in a silicon carbide semiconductor substrate
11/22/2012DE10052721B4 Integrierte Schaltung und Verfahren zum Testen einer integrierten Schaltung Integrated circuit and method for testing an integrated circuit
11/21/2012EP2525431A2 Fuel cell and power chip technology
11/21/2012EP2525416A2 Method for rear point contact fabrication for solar cells
11/21/2012EP2525410A1 Insulated gate bipolar transistor and manufacturing method thereof
11/21/2012EP2525407A2 Nitride semiconductor device, nitride semiconductor wafer, and method for manufacturing nitride semiconductor layer
11/21/2012EP2525403A1 Waterfall wire bonding
11/21/2012EP2525396A2 Combined substrate high-k metal gate device and oxide-polysilicon gate device, and process of fabricating same
11/21/2012EP2525395A1 Machine for manufacturing electrode tapes
11/21/2012EP2525394A1 Thermally enhanced semiconductor package with exposed conductive clip
11/21/2012EP2525393A2 Method for producing ferroelectric thin film
11/21/2012EP2525392A1 Method for forming metal oxide thin film pattern using nanoimprint and manufacturing method of led element using same
11/21/2012EP2525391A2 Method for producing ferroelectric thin film
11/21/2012EP2525390A1 Bonded wafer manufacturing method
11/21/2012EP2525389A1 Electrostatic clamp and method of making said electrostatic clamp
11/21/2012EP2524979A1 Single-crystal substrate, group iii element nitride crystal obtained using same, and process for produicng group iii element nitride crystal
11/21/2012EP2524975A1 System of thin film forming apparatus, and thin film forming method
11/21/2012EP2524905A1 In-Ga-O OXIDE SINTERED BODY, TARGET, OXIDE SEMICONDUCTOR THIN FILM, AND MANUFACTURING METHODS THEREFOR
11/21/2012EP2524399A1 Semiconductor light emitting device with layer compensating for the thermal expansion of the substrate
11/21/2012EP2524392A1 Reclaiming usable integrated circuit chip area near through-silicon vias
11/21/2012EP2524391A1 Wafer unloading system and wafer processing equipment including the same
11/21/2012EP2524389A2 Semiconductor sensor component
11/21/2012EP2523744A2 Ventilation gas management systems and processes
11/21/2012CN202549938U Multiplatform glass substrate conveying equipment
11/21/2012CN202549911U LED (Light-Emitting Diode) chip carrier positioning adsorption device
11/21/2012CN202549910U Absorbing device for locating LED chip carrier
11/21/2012CN202549909U Novel die bonder with ejector pin structure
11/21/2012CN202549906U Solar cell carrying device
11/21/2012CN202549900U Transmission carrier plate for solar silicon chip manufacturing process
11/21/2012CN202549895U Solar cell substrate feeding and blanking device of plasma enhanced CVD system
11/21/2012CN202549817U Elastic hand grasping device for carrying diodes
11/21/2012CN202549816U Vacuum manipulator structure for conveying wafer in integrated circuit
11/21/2012CN202549815U Device for clamping planar disc
11/21/2012CN202549814U Multi-layer chip-mounted sucking disc
11/21/2012CN202549813U Device for orienting precision positioning and moving platform of semiconductor equipment
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