Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2012
11/21/2012CN202549812U Loading frame for plastic package material of quad flat no lead (QFN) encapsulation process
11/21/2012CN202549811U Ejector pin cover structure
11/21/2012CN202549810U Vertically stacking type automatic buffering system
11/21/2012CN202549809U Nitrogen dryer
11/21/2012CN202549808U Split structure of rotary loading wheel of diode consistent machine
11/21/2012CN202549807U Silicon chip stopper
11/21/2012CN202549806U Guide device for guiding solar silicon wafer and detection machine of guide device
11/21/2012CN202549805U Novel crystalline silicon solar cell single-welding heating table
11/21/2012CN202549804U Novel semiconductor arranging die
11/21/2012CN202549803U Silicon wafer transfer system based on image detection and positioning
11/21/2012CN202549802U Force amplifier used for automatic cutting-bending forming machine
11/21/2012CN202549801U Cell slice inspection observation device
11/21/2012CN202549800U Pay-off system for wire welding machine
11/21/2012CN202549799U Automatic lead oscillating device
11/21/2012CN202549798U Novel semiconductor packaging die
11/21/2012CN202548531U Metal photomask
11/21/2012CN202547297U PFA (Polyfluoroalkoxy) wafer rack for drying silicon polished wafer in isopropanol
11/21/2012CN202539739U Ultrasonic degassing machine
11/21/2012CN102792783A Surface treatment device
11/21/2012CN102792478A 磁性隧道结元件 Magnetic tunnel junction element
11/21/2012CN102792452A Production method for semiconductor device and semiconductor device
11/21/2012CN102792451A Oxide for semiconductor layer of thin film transistor, sputtering target, and thin film transistor
11/21/2012CN102792449A 半导体晶体管 Transistors
11/21/2012CN102792446A Method for producing silicon carbide semiconductor device
11/21/2012CN102792444A Semiconductor device and method for manufacturing semiconductor device
11/21/2012CN102792439A Reducing susceptibility to electrostatic discharge damage during die-to-die bonding for 3-D packaged integrated circuits
11/21/2012CN102792438A Method for finishing a substrate of the semiconductor-on-insulator type
11/21/2012CN102792437A Electrostatic chuck
11/21/2012CN102792436A A method for imaging workpiece surfaces at high robot transfer speeds with correction of motion-induced distortion
11/21/2012CN102792435A Substrate storage container
11/21/2012CN102792434A Stackable substrate carriers
11/21/2012CN102792433A Assembly and method for IC unit engagement
11/21/2012CN102792432A Semiconductor device and method of fabricating same
11/21/2012CN102792431A Post deposition wafer cleaning formulation
11/21/2012CN102792430A Semiconductor substrate, method for manufacturing semiconductor substrate, electronic device, and method for manufacturing electronic device
11/21/2012CN102792429A Methods of forming an array of memory cells, methods of forming a plurality of field effect transistors, methods of forming source/drain regions and isolation trenches, and methods of forming a series of spaced trenches into a substrate
11/21/2012CN102792428A Inorganic rapid alternating process for silicon etch
11/21/2012CN102792427A Dielectric window for plasma processing device, plasma processing device, and method for attaching dielectric window for plasma processing device
11/21/2012CN102792426A Apparatus and methods for cyclical oxidation and etching
11/21/2012CN102792425A Apparatus and methods for cyclical oxidation and etching
11/21/2012CN102792424A Post-CMP cleaning brush
11/21/2012CN102792423A Low damage photoresist strip method for low-K dielectric
11/21/2012CN102792422A Semiconductor transistor production method
11/21/2012CN102792421A Grounding structure, and heater and chemical vapor deposition apparatus having the same
11/21/2012CN102792420A Single crystal substrate, production method for single crystal substrate, production method for single crystal substrate with multilayer film, and device production method
11/21/2012CN102792419A Process and structure for high temperature selective fusion bonding
11/21/2012CN102792356A Display device and process for producing same
11/21/2012CN102791903A Tantalum coil for sputtering and method for processing the coil
11/21/2012CN102791820A Adhesive composition, use thereof, connection structure for circuit members, and method for producing same
11/21/2012CN102791769A Wire wrap compositions and methods relating thereto
11/21/2012CN102791454A Method for producing molds and method for producing products with superfine concave-convex structures on surface
11/21/2012CN102791452A Resin mold
11/21/2012CN102791440A System and method for picking and placement of chip dies
11/21/2012CN102791427A Wire saw
11/21/2012CN102791426A Method of cutting workpiece with wire saw, and wire saw
11/21/2012CN102791391A Method and apparatus for treating substrates
11/21/2012CN102791359A Ventilation gas management systems and processes
11/21/2012CN102791356A Exhaust-gas treatment system
11/21/2012CN102791082A Component built-in module, and manufacturing method for component built-in module
11/21/2012CN102791075A Manufacture method of loader with three-dimensional inductance and structure of loader
11/21/2012CN102790169A Method for producing ferroelectric thin film
11/21/2012CN102790143A Taking mechanism for full-automatic die bonder
11/21/2012CN102790142A Clamping positioning mechanism for full-automatic die bonder
11/21/2012CN102790139A Method for manufacturing film gallium nitride (GaN) chip based on sapphire stripping
11/21/2012CN102790097A Power diode device and preparation method thereof
11/21/2012CN102790096A Film transistor as well as manufacturing method thereof, array substrate and display equipment
11/21/2012CN102790086A LDMOS device with stepped multiple discontinuous filed plate and manufacturing method for LDMOS device
11/21/2012CN102790085A Semi-conductor device and production method thereof
11/21/2012CN102790084A Germanium and III-V mixed coplanar silicon on insulator (SOI) semi-conductor structure and preparation method thereof
11/21/2012CN102790083A Improved silicon-controlled structure and production process thereof
11/21/2012CN102790081A Self-aligned metal silicide Ge-Si heterojunction bipolar transistor and preparation method thereof
11/21/2012CN102790080A Self-aligning lifting base region silicon germanium heterojunction bipolar transistor and manufacturing method thereof
11/21/2012CN102790079A Metal silicide self-aligned germanium silicon heterojunction bipolar transistor and preparation method thereof
11/21/2012CN102790078A Semiconductor device and method for manufacturing the same
11/21/2012CN102790076A Semiconductor device, and method of manufacturing the same
11/21/2012CN102790056A Array substrate, manufacturing method of array substrate, manufacturing method of GOA unit and display device
11/21/2012CN102790055A Dram structure with buried word lines and fabrication thereof, and ic structure and fabrication thereof
11/21/2012CN102790054A Germanium and III-V mixed coplanar semi-conductor structure and preparation method thereof
11/21/2012CN102790053A Combined substrate high-k metal gate device and oxide-polysilicon gate device, and process of fabricating same
11/21/2012CN102790052A Tri-strain BiCMOS (Bipolar Complementary Metal Oxide Semiconductor) integrated device based on SiGe HBT (Heterojunction Bipolar Transistor) and preparation method
11/21/2012CN102790051A Array substrate and preparation method and display device thereof
11/21/2012CN102790049A Integrated circuit having silicon resistor and method of forming the same
11/21/2012CN102790047A Series grounded-gate N-channel metal oxide semiconductor (ggNMOS) transistor, preparation method thereof and multiple voltage drain drain (VDD)-voltage source source (VSS) chip
11/21/2012CN102790035A Bump structure and process
11/21/2012CN102790034A Semiconductor apparatus with radiator
11/21/2012CN102790033A Package structure and manufacturing method thereof
11/21/2012CN102790032A Interconnection structure and forming method thereof
11/21/2012CN102790030A Semiconductor structure having offset passivation to reduce electromigration
11/21/2012CN102790021A Radiating unit and manufacture method thereof and radiating module
11/21/2012CN102790019A Semiconductor device, manufacturing method thereof, and mobile telephone
11/21/2012CN102790017A Semiconductor component and method of manufacturing a semiconductor component
11/21/2012CN102790016A Bump structure and producing process thereof
11/21/2012CN102790015A Method for manufacturing memory device
11/21/2012CN102790014A Stressed semiconductor device and method of manufacturing
11/21/2012CN102790013A Fabrication method of CMOS (complementary metal-oxide-semiconductor transistor) transistor
11/21/2012CN102790012A Array substrate and manufacturing method thereof as well as display equipment
11/21/2012CN102790011A Method of repairing organic el display
11/21/2012CN102790010A Preparation method of copper interconnected layer for improving reliability and semiconductor device
11/21/2012CN102790009A Method for reducing fringe effect in copper plating process and manufacturing method of copper interconnection structure
11/21/2012CN102790008A Method for forming contact plug