Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2012
11/28/2012CN102804343A Apparatus for wetting pretreatment for enhanced damascene metal filling
11/28/2012CN102804342A Semiconductor device and manufacturing method therefor
11/28/2012CN102804341A Method for producing electronic device, electronic device, semiconductor device, and transistor
11/28/2012CN102804340A Chemical vapor deposition apparatus
11/28/2012CN102804339A Vapor Deposition Device
11/28/2012CN102804338A Remote plasma processing of interface surfaces
11/28/2012CN102804337A A method of bonding by molecular bonding
11/28/2012CN102804336A Methods Of Utilizing Block Copolymer To Form Patterns
11/28/2012CN102804335A Extreme flow rate and/or high temperature fluid delivery substrates
11/28/2012CN102804334A Semiconductor substrate, method for manufacturing semiconductor substrate, semiconductor device, and method for manufacturing semiconductor device
11/28/2012CN102804333A Method of fabricating micro-devices
11/28/2012CN102804332A Integrated cleaner and dryer
11/28/2012CN102804331A Process Module For The Inline-treatment Of Substrates
11/28/2012CN102804074A Resist stripping compositions and methods for manufacturing electrical devices
11/28/2012CN102804070A Lithographic apparatus and device manufacturing method
11/28/2012CN102804065A Radiation-sensitive resin composition
11/28/2012CN102803888A 散热器及其制造方法 And a method of manufacturing the heat sink
11/28/2012CN102803562A Methods of wet etching a self-assembled monolayer patterned substrate and metal patterned articles
11/28/2012CN102803559A Method for producing semiconductive layers
11/28/2012CN102803558A Apparatus
11/28/2012CN102803552A Plasma treatment method
11/28/2012CN102803549A System of thin film forming apparatus, and thin film forming method
11/28/2012CN102803345A Thin film transistor compositions, and methods relating thereto
11/28/2012CN102803274A Silane coupling agent, negative-type photosensitive resin composition, curable film and touch panel component
11/28/2012CN102803171A Glass frit for formation of electrode, and electrically conductive paste for formation of electrode and solar cell each utilizing same
11/28/2012CN102802875A Dispersion comprising cerium oxide and silicon dioxide
11/28/2012CN102802873A 保持垫 Holding pad
11/28/2012CN102802871A Polishing apparatus, polishing pad, and polishing information management system
11/28/2012CN102802846A Bonding material and bonding method using same
11/28/2012CN102802352A Easy-to-be-electroplated COB (chip on board) substrate and manufacturing method thereof
11/28/2012CN102800805A Phase change storage unit and forming method thereof
11/28/2012CN102800770A Semiconductor light emitting device, nitride semiconductor layer, and method for forming nitride semiconductor layer
11/28/2012CN102800708A 半导体元件及其制作方法 Semiconductor device and manufacturing method thereof
11/28/2012CN102800707A Semiconductor device and manufacturing method thereof
11/28/2012CN102800705A Method for manufacturing metal oxide semiconductor thin film transistor
11/28/2012CN102800704A Trench MOS (Metal Oxide Semiconductor) transistor and manufacture method thereof, and integrated circuit
11/28/2012CN102800701A Semiconductor device having a super junction structure and method of manufacturing the same
11/28/2012CN102800700A Transistor and forming method thereof
11/28/2012CN102800699A Semiconductor structure and forming method thereof
11/28/2012CN102800696A Semiconductor element and manufacturing method thereof
11/28/2012CN102800695A 3-dimensional non-volatile memory device and method of manufacturing the same
11/28/2012CN102800693A Semiconductor devices and related methods
11/28/2012CN102800690A Non-volatile memory device and method for fabricating the same
11/28/2012CN102800689A Nonvolatile memory device and method for fabricating the same
11/28/2012CN102800681A Silicon on insulator (SOI) SiGe bipolar complementary metal oxide semiconductor (BiCMOS) integrated device and preparation method thereof
11/28/2012CN102800680A Mixed crystal face vertical channel Si-based BiCMOS integrated device and preparation method thereof
11/28/2012CN102800678A Field side sub-bitline NOR flash array and method of fabricating the same
11/28/2012CN102800676A Non-volatile memory device and method for fabricating the same
11/28/2012CN102800675A Charge trapping non-volatile memory and manufacturing method thereof
11/28/2012CN102800674A 半导体器件 Semiconductor devices
11/28/2012CN102800672A Strain SiGe HBT (Heterojunction Bipolar Transistor) vertical channel BiCMOS integrated device and preparation method thereof
11/28/2012CN102800671A Semiconductor device and method of manufacturing the same
11/28/2012CN102800668A Thin-film field effect transistor array substrate and manufacturing method thereof
11/28/2012CN102800665A Integrated circuit with sensor and method of manufacturing such an integrated circuit
11/28/2012CN102800662A Layered semiconductor device and manufacturing method thereof
11/28/2012CN102800660A Module and method of manufacturing a module
11/28/2012CN102800659A Resin-sealed electronic controller and method of fabricating the same
11/28/2012CN102800657A Alignment structure
11/28/2012CN102800656A Chip package, method for forming the same, and package wafer
11/28/2012CN102800651A Semiconductor device and method of manufacturing semiconductor device
11/28/2012CN102800650A Uniformity control for ic passivation structure
11/28/2012CN102800647A Three-dimensional spiral inductor and forming method thereof
11/28/2012CN102800644A Double data rate (DDR) signal wiring encapsulation substrate and DDR signal wiring encapsulation method
11/28/2012CN102800643A Conductive via structure
11/28/2012CN102800641A Semiconductor flip chip combining structure and method
11/28/2012CN102800639A Mixed integrated packaging structure
11/28/2012CN102800636A Electronic component package and manufacturing method thereof
11/28/2012CN102800634A Mounting structure of semiconductor package component and manufacturing method therefor
11/28/2012CN102800633A Semiconductor component and method of fabricating the same
11/28/2012CN102800632A Manufacturing method of charge trapping non-volatile memory
11/28/2012CN102800631A Method for forming complementary metal oxide semiconductor (CMOS) transistor
11/28/2012CN102800630A Array substrate and preparation method and display device thereof
11/28/2012CN102800629A Manufacturing method of organic thin-film transistor array substrate
11/28/2012CN102800628A Method for producing dual damascene structure capable of preventing pattern collapsing
11/28/2012CN102800627A Method for producing electronic programmable fuse device
11/28/2012CN102800626A Method for preparing dielectric film on dual damascene structure through etching forming process
11/28/2012CN102800625A Method for manufacturing memory device
11/28/2012CN102800624A Method for via formation in a semiconductor device
11/28/2012CN102800623A Method of forming double-embedding structure
11/28/2012CN102800622A Method for forming dielectric layer
11/28/2012CN102800621A Method for forming embolism structure and semiconductor device
11/28/2012CN102800620A Semiconductor device and manufacturing method thereof
11/28/2012CN102800619A Disk clamping device
11/28/2012CN102800618A Clamping device and method for reducing deformation of horizontally arranged glass substrate
11/28/2012CN102800617A Six-wheel eccentric-connecting-rod central positioning mechanism
11/28/2012CN102800616A Calibration mechanism and method for calibrating solar cell
11/28/2012CN102800615A Vacuum process device and vacuum process method
11/28/2012CN102800614A Semiconductor wafer mounting method and semiconductor wafer mounting apparatus
11/28/2012CN102800613A Apparatus for delivering semiconductor components to a substrate during semiconductor package manufacturing
11/28/2012CN102800612A Transfer box
11/28/2012CN102800611A Method of dielectric film treatment
11/28/2012CN102800610A Device for splitting substrat with obstacle detection means
11/28/2012CN102800609A Method for monitoring production of air bridge of schottky diode
11/28/2012CN102800608A Device and method for detecting center line deviation of wafer
11/28/2012CN102800607A Method for improving process capability
11/28/2012CN102800606A Stress sensor transfer method used for measuring wafer level packaging stress
11/28/2012CN102800605A System and method for monitoring copper barrier layer preclean process
11/28/2012CN102800604A Method for obtaining parameters of ion implantation technology, monitoring wafer and manufacturing method thereof
11/28/2012CN102800603A Method for dispensing solder on a substrate and method for mounting semiconductor chips
11/28/2012CN102800602A Method of manufacturing semiconductor device
1 ... 791 792 793 794 795 796 797 798 799 800 801 802 803 804 805 806 807 808 809 810 811 ... 6590