Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/1988
04/19/1988US4739438 Integrated circuit with an improved input protective device
04/19/1988US4739389 High-frequency circuit arrangement and semiconductor device for use in such an arrangement
04/19/1988US4739388 Integrated circuit structure for a quality check of a semiconductor substrate wafer
04/19/1988US4739386 Bipolar transistor having improved switching time
04/19/1988US4739379 Heterojunction bipolar integrated circuit
04/19/1988US4739378 Protection of integrated circuits from electric discharge
04/19/1988US4739373 Projection exposure apparatus
04/19/1988US4739258 Dynamic testing of thin-film conductor
04/19/1988US4739142 Method of producing a wire bonding ball
04/19/1988US4738936 Method of fabrication lateral FET structure having a substrate to source contact
04/19/1988US4738935 Annealing polished compound substrate surfaces to bond
04/19/1988US4738934 Method of making indium phosphide devices
04/19/1988US4738916 Intermediate layer material of three-layer resist system
04/19/1988US4738915 Positive-working O-quinone diazide photoresist composition with 2,3,4-trihydroxybenzophenone
04/19/1988US4738910 Method of applying a resist
04/19/1988US4738907 Process for manufacturing a photomask
04/19/1988US4738832 Crystal holder
04/19/1988US4738761 Shared current loop, multiple field apparatus and process for plasma processing
04/19/1988US4738749 Process for producing an active matrix display screen with gate resistance
04/19/1988US4738748 Plasma processor and method for IC fabrication
04/19/1988US4738683 Etching to form openings in silicon dioxide layer
04/19/1988US4738624 Bipolar transistor structure with self-aligned device and isolation and fabrication process therefor
04/19/1988US4738618 Vertical thermal processor
04/19/1988US4738573 Silicon wafer processing boat carrier slot plunge cutter
04/19/1988US4738272 Vessel and system for treating wafers with fluids
04/19/1988US4738056 Method and blasting apparatus for preparation of silicon wafer
04/19/1988CA1235384A1 Dual ion beam deposition of amorphous semiconductor films
04/14/1988DE3733499A1 Verfahren und vorrichtung fuer die ablagerung aus der dampfphase Method and apparatus for the deposition from the vapor phase
04/14/1988DE3732418A1 Semiconductor component having a semiconductor region in which a band (energy) gap is continuously stepped
04/13/1988EP0263788A1 Process and apparatus for depositing hydrogenated amorphous silicon on a substrate in a plasma environment
04/13/1988EP0263756A2 Selective epitaxy BiCMOS process
04/13/1988EP0263755A1 Process for manufacturing a P+NN+ diode and a bipolar transistor including this diode, using the neutralization effect of atomic hydrogen on donor atoms
04/13/1988EP0263574A1 A method of manufacturing a semiconductor device, and a semiconductor device, having at least one selectively actuable conductive line
04/13/1988EP0263542A1 Method of pull-testing wire bonds on a micro-miniature solid-state device
04/13/1988EP0263517A2 Lithography apparatus
04/13/1988EP0263504A2 Method for manufacturing high-breakdown voltage semiconductor device
04/13/1988EP0263374A2 Reactive ion etch chemistry for providing deep vertical trenches in semiconductor substrates
04/13/1988EP0263348A2 Process for defining vias through silicon nitride and polyimide
04/13/1988EP0263343A2 Power transistor with self-protection against direct secondary breakdown
04/13/1988EP0263341A2 An improved process for preparing a charge coupled device with charge transfer direction biasing implants
04/13/1988EP0263322A2 Method of making sloped vias
04/13/1988EP0263287A2 Forming a capacitor in an integrated circuit
04/13/1988EP0263277A2 A flexible electrical connection and method of making same
04/13/1988EP0263273A2 Process of laminating
04/13/1988EP0263270A2 Process for providing a P-doped semiconducting region in an N-conductivity semiconducting body
04/13/1988EP0263222A1 Method of forming solder terminals for a pinless ceramic module
04/13/1988EP0263221A1 Method of forming solder bumps on metal contact pads of a substrate
04/13/1988EP0263220A1 Method of forming a via-having a desired slope in a photoresist masked composite insulating layer
04/13/1988EP0263146A1 Aluminum-backed wafer and chip
04/13/1988EP0263141A1 Method for depositing materials containing tellurium.
04/13/1988EP0155311B1 Method for repair of buried contacts in mosfet devices
04/13/1988EP0082189B1 Masking portions of a substrate
04/13/1988CN87106299A Process and device for sepparation and recovery of volatile solvents
04/13/1988CN86102417A Gold-diffusing technology in manufacturing high-speed thyristor
04/12/1988US4737920 Method and apparatus for correcting rotational errors during inspection of reticles and masks
04/12/1988US4737902 Inner potential generating circuit
04/12/1988US4737839 Semiconductor chip mounting system
04/12/1988US4737838 Capacitor built-in semiconductor integrated circuit and process of fabrication thereof
04/12/1988US4737835 Read only memory semiconductor device
04/12/1988US4737831 Semiconductor device with self-aligned gate structure and manufacturing process thereof
04/12/1988US4737830 Integrated circuit structure having compensating means for self-inductance effects
04/12/1988US4737829 Dynamic random access memory device having a plurality of one-transistor type memory cells
04/12/1988US4737828 Method for gate electrode fabrication and symmetrical and non-symmetrical self-aligned inlay transistors made therefrom
04/12/1988US4737827 Heterojunction-gate field-effect transistor enabling easy control of threshold voltage
04/12/1988US4737823 Opto-lithographic device comprising a displaceable lens system and method of controlling the imaging properties of lens system in such a device
04/12/1988US4737646 Method of using an electron beam
04/12/1988US4737474 Depositing amorphous silicon and silicide layers and sintering
04/12/1988US4737472 Process for the simultaneous production of self-aligned bipolar transistors and complementary MOS transistors on a common silicon substrate
04/12/1988US4737471 Method for fabricating an insulated-gate FET having a narrow channel width
04/12/1988US4737470 Method of making three dimensional structures of active and passive semiconductor components
04/12/1988US4737468 Semiconductors
04/12/1988US4737438 Negative-working photosensitive composition comprising a diphenylamine-melamine condensate and an azide compound
04/12/1988US4737426 Cyclic acetals or ketals of beta-keto esters or amides
04/12/1988US4737425 Patterned resist and process
04/12/1988US4737387 With composite frame for free-standing, protective membrane
04/12/1988US4737379 Plasma deposited coatings, and low temperature plasma method of making same
04/12/1988US4737237 Process for producing a buried strip semiconductor laser with or without a defractive network
04/12/1988US4737235 Premixing in storage
04/12/1988US4737208 Method of fabricating multilayer structures with nonplanar surfaces
04/12/1988US4737112 Anisotropically conductive composite medium
04/12/1988US4736882 Thermode design for tab and method of use
04/12/1988US4736760 Apparatus for cleaning, rinsing and drying substrates
04/12/1988US4736759 Apparatus for cleaning rinsing and drying substrates
04/12/1988US4736758 Vapor drying apparatus
04/12/1988US4736621 Immersion in heated perfluoroperhydrofluorene bubble detection
04/12/1988US4736508 Process of manufacturing vacuum tips particularly for vacuum handling systems
04/12/1988CA1235234A1 Method of manufacturing a semiconductor device, in which a semiconductor substrate is subjected to a treatment in a reaction gas
04/12/1988CA1235233A1 L fast-fabrication process for high speed bipolar analog large scale integrated circuits
04/12/1988CA1235219A1 Ccd imager
04/12/1988CA1234972A1 Chemical vapor deposition wafer boat
04/07/1988WO1988002554A1 High-frequency power transistor with bipolar epitaxial technology
04/07/1988WO1988002552A1 Multichip integrated circuit packaging configuration and method
04/07/1988WO1988002551A1 Method and apparatus for packaging integrated circuit chips employing a polymer film overlay layer
04/07/1988WO1988002550A1 Method to produce via holes in polymer dielectrics for multiple electronic circuit chip packaging
04/07/1988WO1988002549A1 Method and configuration for testing electronic circuits and integrated circuit chips using a removable overlay layer
04/07/1988WO1987007400A3 Monolithic channeling mask
04/07/1988DE3731838A1 X-ray lithographic device
04/06/1988EP0263078A2 Logic interface circuit with high stability and low rest current
04/06/1988EP0263050A1 Hermetic terminal assembly and method of manufacturing same
04/06/1988EP0263032A1 Primary particle beam irradiation apparatus and method of irradiation thereof