Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/1988
08/04/1988DE3701649A1 Method of fabricating EEPROM memory cells with tunnel current programming using dual polysilicon-NMOS technology
08/03/1988EP0276981A2 Semiconductor integrated circuit device and method of producing same
08/03/1988EP0276979A2 Microenvironmental sensors
08/03/1988EP0276961A2 Solar battery and process for preparing same
08/03/1988EP0276960A2 Process for producing crystal article
08/03/1988EP0276959A2 Process for producing crystal article
08/03/1988EP0276940A2 Semiconductor chip having external terminals connected to corresponding leads by wires
08/03/1988EP0276938A2 Semiconductor device fabrication including a non-destructive method for examining lithographically defined features
08/03/1988EP0276928A2 Wire Bonding
08/03/1988EP0276914A2 Anti-flaking measures in molecular-beam-epitaxy apparatus, and method of manufacture
08/03/1988EP0276902A1 A method of making a field effect transistor
08/03/1988EP0276788A2 Aluminium nitride sintered body formed with metallized layer and method of manufacturing the same
08/03/1988EP0276774A2 Composition for use in the processing of semiconductor materials and method for its preparation and use
08/03/1988EP0276717A2 Method of forming a fine resist pattern in electron beam or x-ray lithography
08/03/1988EP0276695A2 Integrated circuit method using polycrystalline layers and contacts
08/03/1988EP0276694A2 Integrated circuit method using double implant doping
08/03/1988EP0276693A2 Integrated circuit process using polycrystalline layers and contacts
08/03/1988EP0276692A2 Integrated circuit structure with polycrystalline layers and contacts
08/03/1988EP0276572A1 Intermediate potential generating circuit
08/03/1988EP0276571A2 Method of manufacturing a semiconductive device comprising a buried region
08/03/1988EP0276564A1 Wire bonding
08/03/1988EP0276520A1 Method of testing a modified booth multiplier, modified booth multiplier suitable for testing by means of this method, and integrated circuit comprising such a modified booth multiplier
08/03/1988EP0276345A1 Elastic bladder method of fabricating an integrated circuit package having bonding pads in a stepped cavity
08/03/1988EP0276257A1 Method of epitaxially growing compound semiconductor materials
08/03/1988EP0174997B1 Method for controlled doping trench sidewalls in a semiconductor body
08/02/1988US4761768 Programmable logic device
08/02/1988US4761681 Method for fabricating a semiconductor contact and interconnect structure using orientation dependent etching and thermomigration
08/02/1988US4761678 Integrated circuit semiconductor device
08/02/1988US4761677 Doped polyacetylene layers
08/02/1988US4761620 For detecting a change in an electrical signal
08/02/1988US4761607 Apparatus and method for inspecting semiconductor devices
08/02/1988US4761572 Semiconductor large scale integrated circuit with noise cut circuit
08/02/1988US4761559 Ion beam implantation display method and apparatus
08/02/1988US4761385 Forming a trench capacitor
08/02/1988US4761384 Forming retrograde twin wells by outdiffusion of impurity ions in epitaxial layer followed by CMOS device processing
08/02/1988US4761325 Copper conductors separated by glass-ceramic insulating layers
08/02/1988US4761302 Fluorination of amorphous thin-film materials with xenon fluoride
08/02/1988US4761300 Method of vacuum depostion of pnictide films on a substrate using a pnictide bubbler and a sputterer
08/02/1988US4761245 Nonionic surfactants, silicon dioxide, integrated circuits
08/02/1988US4761244 Nonionic surfactants
08/02/1988US4761211 Method of improving the electrical characteristics of a thin film
08/02/1988US4761210 Superimposing masks, selective etching
08/02/1988US4761134 Refractory coating of silicon nitride, silicon carbide or silicon oxide
08/02/1988US4760917 Integrated circuit carrier
08/02/1988US4760711 Multilayer cooling disc for use in high temperature processing
08/02/1988US4760673 Lead frame finishing apparatus
08/02/1988CA1240073A2 Plastic resin and fibre encapsulation for electronic circuit device, and method for making same
08/02/1988CA1240072A1 Metal cored circuit board with baked-on polymer layer
08/02/1988CA1239851A1 Single crystal of compound semiconductor of groups iii-v with low dislocation density
07/1988
07/29/1988EP0177571A4 Double planarization process for multilayer metallization of int egrated circuit structures.
07/28/1988WO1988005603A1 Method for producing electric insulation zones in a cmos integrated circuit
07/28/1988WO1988005602A1 Method for producing electric insulation zones in a cmos integrated circuit
07/28/1988WO1988005601A1 Contact to cadmium mercury telluride
07/28/1988WO1988005600A1 Process for producing thin single crystal silicon islands on insulator
07/28/1988WO1988005428A1 Method for connecting leadless chip packages and articles
07/28/1988WO1988002174A3 Nonvolatile memory cell array
07/28/1988DE3701310A1 Contact-making device for making contact with surface-mounted integrated circuits
07/27/1988EP0276087A2 Improved multilayer interconnection for integrated circuit structure having two or more conductive metal layers and method of making same
07/27/1988EP0276069A2 Vapor phase epitaxial growth of iron-doped, indium-based, compound group III-V semiconductors
07/27/1988EP0276061A1 Rapid thermal chemical vapour deposition apparatus
07/27/1988EP0276047A2 Microcomputer with built-in EPROM
07/27/1988EP0276001A2 Active color liquid crystal display element
07/27/1988EP0275905A2 A self-aligned field effect transistor including method
07/27/1988EP0275877A2 Bond paramaters control during bonding
07/27/1988EP0275872A2 Integrated circuit with "latch-up" protective circuit in complementary MOS circuit techniques
07/27/1988EP0275778A1 Process for collectively cutting semiconductor devices in a chemical way, and device cut by this process
07/27/1988EP0275634A1 Integrated-circuit chip test probe card
07/27/1988EP0275611A2 Electron beam device and a focusing lens therefor
07/27/1988EP0275595A1 Process for producing interconnecting lines and interlevels via crossings in an integrated circuit
07/27/1988EP0275588A1 Method of fabricating a semiconductor device with reduced packaging stress
07/27/1988EP0275540A2 Staggered bandgap gate field effect transistor
07/27/1988EP0275508A1 Method for making CMOS devices
07/27/1988EP0275469A2 Surface inspection
07/27/1988EP0275433A1 Method for mounting electronic components on a substrate, foil to carry out the method and method to produce the foil
07/27/1988EP0275299A1 Semiconductor devices having improved metallization
07/27/1988EP0275267A1 Process for photochemical vapor deposition of oxide layers at enhanced deposition rates.
07/27/1988EP0275261A1 Semi-conductor component
07/27/1988EP0267233A4 Modular semiconductor wafer transport and processing system.
07/27/1988EP0148856B1 Wafer height correction system for focused beam system
07/27/1988CN87105952A Conductive pattern producing method and its applications
07/27/1988CN87104018A Method to improve insulation of fieldistor pillar
07/26/1988US4760434 Semiconductor device with protective means against overheating
07/26/1988US4760429 High speed reticle change system
07/26/1988US4760369 Thin film resistor and method
07/26/1988US4760289 Two-level differential cascode current switch masterslice
07/26/1988US4760273 Solid-state image sensor with groove-situated transfer elements
07/26/1988US4760249 Logic array having multiple optical logic inputs
07/26/1988US4760037 Pressure contact type semiconductor device
07/26/1988US4760036 Epitaxial growing laterally monocrystalline silicon over oxide layer, etching silicon, selectively oxidizing silicon substrate, regrowing silicon laterally
07/26/1988US4760035 Doping, photolithography, forming tub shaped zone
07/26/1988US4760034 Forming protective layer over semiconductor substrate
07/26/1988US4760033 Method for the manufacture of complementary MOS field effect transistors in VLSI technology
07/26/1988US4760032 Screening of gate oxides on semiconductors
07/26/1988US4760006 2,3-bis(dialkylaminophenyl)quinoxalines and their use in electrophotographic recording materials
07/26/1988US4759990 Composite optical element including anti-reflective coating
07/26/1988US4759958 Method for forming polyimide film by chemical vapor deposition
07/26/1988US4759948 Film formation through co-deposition with high and low energy beams
07/26/1988US4759836 Forming thin film resistor of chromium silicide or silicon carbide over insulating surface, forming an insulating film, doping thin film through insulating film
07/26/1988US4759829 Depositing electroless nickel onto entire header, covering it with gold layer, removing both layers from specific area, cleaning, coating nickel and gold again
07/26/1988US4759822 Methods for producing an aperture in a surface