Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/1995
02/07/1995US5387548 Method of forming an etched ohmic contact
02/07/1995US5387546 Method for manufacturing a semiconductor device
02/07/1995US5387545 Deoxidizing, doping the surface natural silicon dioxide with hydrogen and impurities gas mixtures
02/07/1995US5387544 Method of making a semiconductor device including carbon as a dopant
02/07/1995US5387542 Polycrystalline silicon thin film and low temperature fabrication method thereof
02/07/1995US5387541 Method of making silicon-on-porous-silicon by ion implantation
02/07/1995US5387540 Vapor deposition of thin layer of silicon dioxide over trench isolation and adjuscent active region, forming a gate electrode over thin layer, and dielectric lies between them
02/07/1995US5387539 Method of manufacturing trench isolation
02/07/1995US5387538 Method of fabrication of integrated circuit isolation structure
02/07/1995US5387537 Process for manufacturing isolated semiconductor components in a semiconductor wafer
02/07/1995US5387536 Method of making a low capacitance floating diffusion structure for a solid state image sensor
02/07/1995US5387535 Method of fabricating semiconductor devices in CMOS technology with local interconnects
02/07/1995US5387534 Method of forming an array of non-volatile sonos memory cells and array of non-violatile sonos memory cells
02/07/1995US5387533 Method of making dynamic random access memory
02/07/1995US5387531 Hole capacitor for dram cell and a fabrication method thereof
02/07/1995US5387530 Threshold optimization for soi transistors through use of negative charge in the gate oxide
02/07/1995US5387529 Production method of a MESFET semiconductor device
02/07/1995US5387528 Method of manufacturing a semiconductor device comprising an insulated gate field effect device
02/07/1995US5387497 High resolution lithography method using hydrogen developing reagent
02/07/1995US5387495 Coating top surface of substrate with insulating layer of tetrafluoroethylene, depositing conductive seed layer, lines, patterned layer of posts, removing portions of seed layer, depositing liquid fluorinated hydrocarbon dielectric
02/07/1995US5387494 Includes a latex binder polymer having carboxylic acid functionality, a photopolymerizable monomer fraction and a photoinitiator
02/07/1995US5387484 For use with lasers for ablation of ceramics, polymers and metals; blocking, reflecting, transmission of beams
02/07/1995US5387474 Reducing X-Y shrinkage and distortion on firing
02/07/1995US5387459 Multilayer structure having an epitaxial metal electrode
02/07/1995US5387444 Ultrasonic method for coating workpieces, preferably using two-part compositions
02/07/1995US5387316 Wafer etch protection method
02/07/1995US5387315 Process for deposition and etching of copper in multi-layer structures
02/07/1995US5387312 High selective nitride etch
02/07/1995US5387311 Depositing oxide layer on conductive substrate, providing via holes, depositing anti-fuse material over oxide layer and within holes, depositing spacer material, etching, masking, etching
02/07/1995US5387289 Film uniformity by selective pressure gradient control
02/07/1995US5387265 Semiconductor wafer reaction furnace with wafer transfer means
02/07/1995US5387067 Direct load/unload semiconductor wafer cassette apparatus and transfer system
02/07/1995US5386936 For integrated circuit devices
02/07/1995US5386645 Rotary-type wafer drying apparatus with anti-deflection cover
02/07/1995US5386625 Tab type IC assembling method and an IC assembled thereby
02/07/1995US5386624 Method for underencapsulating components on circuit supporting substrates
02/07/1995US5386623 Process for manufacturing a multi-chip module
02/07/1995US5386620 Punching and shaping machine tool with cam gear
02/07/1995CA2001982C Ceramic substrate with metal filled via holes for hybrid microcircuits and method of making the same
02/07/1995CA1334245C Method and apparatus for coating semiconductor components on a dielectric film
02/03/1995CA2129212A1 Use of a saw frame with tape as a substrate carrier for wafer level backend processing
02/02/1995WO1995003685A1 Semiconductor inner lead bonding tool
02/02/1995WO1995003629A1 Thin film semiconductor device, its manufacture, and display system
02/02/1995WO1995003628A1 Integrated laser structuring process for thin film solar cells
02/02/1995WO1995003626A1 Structures for preventing reverse engineering of integrated circuits
02/02/1995WO1995003625A1 Pad structure with parasitic mos transistor for use with semiconductor devices
02/02/1995WO1995003624A1 Coated bonding wires in high lead count packages
02/02/1995WO1995003436A1 Stationary aperture plate for reactive sputter deposition
02/02/1995WO1995003245A1 System and method for dispensing liquid from storage containers
02/02/1995WO1995003152A1 Shaped lead structure and method
02/02/1995DE4426347A1 Flat construction element with a grid system of through-holes
02/02/1995DE4425552A1 Wafermaßstabsarchitektur für programmierbare Logikschaltungen Wafer-scale architecture for programmable logic circuits
02/02/1995DE4422038A1 Exposure method for the production of semiconductor components, and a diffraction mask used for this purpose
02/02/1995DE4421633A1 Semiconductor device and method for production thereof
02/02/1995DE4339721C1 Method for producing a matrix of thin-film transistors
02/02/1995DE4325712A1 Method for encapsulating electrical or electronic components or modules, and encapsulation of electrical or electronic components or modules
02/02/1995DE4325543A1 Process and apparatus for the wet chemical treatment of silicon material
02/02/1995DE4325518A1 Method for smoothing the edge of semiconductor wafers
02/02/1995CA2164975A1 Stationary aperture plate for reactive sputter deposition
02/01/1995EP0637196A1 Process for manufacturing integrated microcircuits
02/01/1995EP0637134A1 Variable impedance delay elements
02/01/1995EP0637086A2 Light emitting semiconductor device and light enhanced deposition method for fabricating the same
02/01/1995EP0637083A1 Semiconductor device having a reduced wiring area in and out of data path zone
02/01/1995EP0637081A2 Micro sensor with plug connections
02/01/1995EP0637075A1 Semiconductor device sealed with molded resin
02/01/1995EP0637074A2 Method of forming active and isolation areas with split active patterning
02/01/1995EP0637073A1 Process for realizing low threshold P-channel MOS transistors for complementary devices (CMOS)
02/01/1995EP0637072A2 Spin-on conductor process for integrated circuits
02/01/1995EP0637071A2 Planarization process for IC trench isolation using oxidised polysilicon filler
02/01/1995EP0637070A1 Perimeter independent precision locating member for a semiconductor chip and method of making said member
02/01/1995EP0637069A1 Method of obtaining high quality silicon dioxide passivation on silicon carbide and resulting passivated structures
02/01/1995EP0637068A2 Manufacture of thin-film transistors
02/01/1995EP0637067A2 Plasma etching using xenon
02/01/1995EP0637066A1 Process for increasing sacrificial oxide layer etch rate to reduce field oxide loss, using a step of ionic implantation
02/01/1995EP0637065A2 Chemical mechanical planarization of shallow trenches in semiconductor substrates
02/01/1995EP0637064A2 Method and apparatus for high-flatness etching of wafer
02/01/1995EP0637063A1 Method of in-situ cleaning of native oxide from silicon surfaces
02/01/1995EP0637062A2 Process for manufacturing semi-conducteur device with planarized surface and application to the manufacturing of bipolar transistors and DRAM
02/01/1995EP0637061A1 Threshold optimization for SOI transistors through use of negative charge in the gate oxide
02/01/1995EP0637060A2 Method for forming isolated intrapolycrystalline silicon structures
02/01/1995EP0637059A2 Direct MOMBE and MOVPE growth of II-VI materials on silicon
02/01/1995EP0637058A1 Gas inlets for wafer processing chamber
02/01/1995EP0637057A1 Method and apparatus for depositing metal fine lines on a substrate
02/01/1995EP0637055A1 Plasma processing apparatus
02/01/1995EP0637052A1 Method for producing a stream of ionic aluminum
02/01/1995EP0637049A1 Process for making an electric conducting point of doped silicon and application of the process for manufacturing components used in vacuum electronics
02/01/1995EP0637042A2 Device for affecting an input signal
02/01/1995EP0637035A1 Circuit structure for a memory matrix and corresponding manufacturing method
02/01/1995EP0637034A1 Method for detecting faulty elements of a redundancy semiconductor memory
02/01/1995EP0637032A2 Parallel processor structure and package
02/01/1995EP0636896A1 Boundary scan cell
02/01/1995EP0636866A2 Method and circuit arrangement for measuring the temperature of a barrier layer of a GTO thyristor
02/01/1995EP0636707A2 Nitrogen trifluoride thermal cleaning apparatus and process
02/01/1995EP0636706A2 Apparatus for chemical vapor deposition of diamond including graphite substrate holders
02/01/1995EP0636705A2 A vertical type vapor phase growth apparatus
02/01/1995EP0636704A1 Silicon nitride deposition
02/01/1995EP0636586A1 Photomask substrate plate of synthetic fused silica glass for photolithography
02/01/1995EP0636285A1 Stabilizer for switch-mode powered rf plasma processing.
02/01/1995EP0636276A1 Semiconductor wafer temperature determination by optical measurement of wafer expansion in processing apparatus chamber
02/01/1995EP0636271A1 Multilayer electrodes for ferroelectric devices