| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 02/21/1995 | US5391511 Semiconductor processing method of producing an isolated polysilicon lined cavity and a method of forming a capacitor |
| 02/21/1995 | US5391510 A diamond-like-carbon layer is used as masking structure to protect gate dielectric layer from contamination during high temperature annealing, removal by plasma etching, forming metal gate electrode in space vacated by masking layer |
| 02/21/1995 | US5391509 Method of manufacturing a semiconductor device forming a high concentration impurity region through a CVD insulating film |
| 02/21/1995 | US5391508 Method of forming semiconductor transistor devices |
| 02/21/1995 | US5391507 Lift-off fabrication method for self-aligned thin film transistors |
| 02/21/1995 | US5391506 Manufacturing method for semiconductor devices with source/drain formed in substrate projection. |
| 02/21/1995 | US5391505 Active device constructed in opening formed in insulation layer and process for making same |
| 02/21/1995 | US5391504 Method for producing integrated quasi-complementary bipolar transistors and field effect transistors |
| 02/21/1995 | US5391503 Method of forming a stacked semiconductor device wherein semiconductor layers and insulating films are sequentially stacked and forming openings through such films and etchings using one of the insulating films as a mask |
| 02/21/1995 | US5391502 Per-wafer method for globally stressing gate oxide during device fabrication |
| 02/21/1995 | US5391501 Method for manufacturing integrated circuits with a step for replacing defective circuit elements |
| 02/21/1995 | US5391410 Chemical vapor deposition from silane, nitrous oxide mixture diluted with hydrogen |
| 02/21/1995 | US5391397 Method of adhesion to a polyimide surface by formation of covalent bonds |
| 02/21/1995 | US5391394 Forming optically opaque refractory metal layer on exposed silicon regions of wafer, heating in chemical vapor deposition chamber while supplying reducing and metal-containing gases to form barrier layer, annealing to form silicide at interface |
| 02/21/1995 | US5391393 Method for making a semiconductor device having an anhydrous ferroelectric thin-film in an oxygen-containing ambient |
| 02/21/1995 | US5391285 Adjustable plating cell for uniform bump plating of semiconductor wafers |
| 02/21/1995 | US5391281 Plasma shaping plug for control of sputter etching |
| 02/21/1995 | US5391275 Method for preparing a shield to reduce particles in a physical vapor deposition chamber |
| 02/21/1995 | US5391269 Method of making an article comprising a silicon body |
| 02/21/1995 | US5391260 Vacuum processing apparatus |
| 02/21/1995 | US5391258 Compositions and methods for polishing |
| 02/21/1995 | US5391257 Method of transferring a thin film to an alternate substrate |
| 02/21/1995 | US5391252 Plasma pressure control assembly |
| 02/21/1995 | US5391244 Using sulfur halide gases |
| 02/21/1995 | US5391231 Holding arrangement for a planar workpiece and at least one such holding arrangement |
| 02/21/1995 | US5391229 Apparatus for chemical vapor deposition of diamond including graphite substrate holders |
| 02/21/1995 | US5391082 Conductive wedges for interdigitating with adjacent legs of an IC or the like |
| 02/21/1995 | US5391036 Magnetic transfer device |
| 02/21/1995 | US5391035 Micro-enviroment load lock |
| 02/21/1995 | US5390972 Wafer cassette handle |
| 02/21/1995 | US5390844 Semiconductor inner lead bonding tool |
| 02/21/1995 | US5390811 Wafer basket for containing semiconductor wafers |
| 02/21/1995 | US5390785 Pressurized sealable transportable containers for storing a semiconductor wafer in a protective gaseous environment |
| 02/21/1995 | US5390626 Low pressure chemical vapor deposition method using a hot-wall |
| 02/19/1995 | CA2130149A1 Sub-micron bonded soi by trench planarization |
| 02/16/1995 | WO1995005008A2 Flat component with a grid of through holes |
| 02/16/1995 | WO1995005004A1 Method and apparatus for wafer washing |
| 02/16/1995 | WO1995005003A1 Device for transporting wafer magazines |
| 02/16/1995 | WO1995005002A1 Conveyor for magazines receiving disk-shaped objects |
| 02/16/1995 | WO1995004845A1 Crystalline multilayer structure and manufacturing method thereof |
| 02/16/1995 | WO1995004786A2 Adhesive paste containing polymeric resin |
| 02/16/1995 | WO1994028577A3 Method of producing a structure with narrow line width and devices obtained |
| 02/16/1995 | DE4333661C1 Semiconductor component with high breakdown voltage |
| 02/16/1995 | CA2168427A1 Adhesive paste containing polymeric resin |
| 02/15/1995 | EP0748261A4 Layered chip structure |
| 02/15/1995 | EP0639028A1 Improved output circuit for charge transfer devices |
| 02/15/1995 | EP0638984A1 Low voltage charge pumps |
| 02/15/1995 | EP0638937A2 Ohmic electrode, its fabricating method and semiconductor device using this electrode |
| 02/15/1995 | EP0638936A1 Gate array LSI |
| 02/15/1995 | EP0638935A1 Method of making a BicMOS device |
| 02/15/1995 | EP0638934A1 Semiconductor device and manufacturing method |
| 02/15/1995 | EP0638931A2 Multi-chip module |
| 02/15/1995 | EP0638930A1 Novel TiSi2/TiN clad interconnect technology |
| 02/15/1995 | EP0638928A1 Power semiconductor device with pressure contact |
| 02/15/1995 | EP0638927A1 Method for manufacturing a field oxide region |
| 02/15/1995 | EP0638926A1 Process of fabricating semiconductor unit employing bumps to bond two components |
| 02/15/1995 | EP0638924A1 Process for fabricating TAB tape carriers |
| 02/15/1995 | EP0638923A2 Low temperature etching in cold-wall CVD systems |
| 02/15/1995 | EP0638922A1 Method for forming an integrated circuit pattern on a semiconductor substrate, using an anti-reflective layer |
| 02/15/1995 | EP0638902A2 Selector circuit selecting and outputting voltage applied to one of first and second terminal in response to voltage level applied to first terminal |
| 02/15/1995 | EP0638847A1 Apparatus and method for projection exposure |
| 02/15/1995 | EP0638660A2 Dry cleaning of semiconductor processing chambers |
| 02/15/1995 | EP0638391A1 Polishing pad and a process for polishing |
| 02/15/1995 | EP0638202A1 Self-aligned thin-film transistor constructed using lift-off technique |
| 02/15/1995 | EP0638001A1 Ultrasonic spray coating system and method |
| 02/15/1995 | EP0633823A4 Removal of surface contaminants by irradiation. |
| 02/15/1995 | CN1098821A Method for manufacturing a highly intergrated semiconductor device |
| 02/15/1995 | CN1098819A A capillary for a wire bonding apparatus and a method for forming an electric connection bump using the capillary |
| 02/15/1995 | CN1098818A Semiconductor integrated circuit, semiconductor device, transistor, and process for fabricating the same |
| 02/14/1995 | USRE34861 Sublimation of silicon carbide to produce large, device quality single crystals of silicon carbide |
| 02/14/1995 | US5390146 Reference switching circuit for flash EPROM |
| 02/14/1995 | US5390144 Semiconductor memory |
| 02/14/1995 | US5390143 Non-volatile static memory devices and operational methods |
| 02/14/1995 | US5390142 Memory material and method for its manufacture |
| 02/14/1995 | US5390140 Signal output circuit operating stably and arrangement of power supply interconnection line therefor in semiconductor integrated circuit device |
| 02/14/1995 | US5390082 Chip carrier with protective coating for circuitized surface |
| 02/14/1995 | US5390079 Tape carrier package |
| 02/14/1995 | US5390072 Thin film capacitors |
| 02/14/1995 | US5390069 Short circuit limit circuit with temperature-dependent current limit |
| 02/14/1995 | US5389990 Method for measuring DC current/voltage characteristic of semiconductor device |
| 02/14/1995 | US5389873 Pressure contact chip and wafer testing device |
| 02/14/1995 | US5389820 IC carrier |
| 02/14/1995 | US5389818 Lead frame |
| 02/14/1995 | US5389817 Semiconductor device having a flat jumper lead |
| 02/14/1995 | US5389815 Semiconductor diode with reduced recovery current |
| 02/14/1995 | US5389811 Fault-protected overvoltage switch employing isolated transistor tubs |
| 02/14/1995 | US5389809 Field effect transistor drain structure |
| 02/14/1995 | US5389808 Non-volatile semiconductor memory with increased capacitance between floating and control gates |
| 02/14/1995 | US5389807 Field effect transistor |
| 02/14/1995 | US5389804 Resonant-tunneling heterojunction bipolar transistor device |
| 02/14/1995 | US5389803 High-gain Si/SiGe MIS heterojunction bipolar transistors |
| 02/14/1995 | US5389802 Heterojunction field effect transistor (HJFET) having an improved frequency characteristic |
| 02/14/1995 | US5389801 Semiconductor device having increased current capacity |
| 02/14/1995 | US5389796 Vacuum transistor having an optical gate |
| 02/14/1995 | US5389769 ID recognizing system in semiconductor manufacturing system |
| 02/14/1995 | US5389581 High density TEOS-based film for intermetal dielectrics |
| 02/14/1995 | US5389580 Thin film semiconductor device and method of production |
| 02/14/1995 | US5389576 Method of processing a polycide structure |
| 02/14/1995 | US5389575 Self-aligned contact diffusion barrier method |
| 02/14/1995 | US5389574 Etching gallium arsenide using mixture of fluorocarbon, silicon chloride, rare gas |