| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 07/09/1996 | US5534798 Multiplexer with level shift capabilities |
| 07/09/1996 | US5534785 Integrated circuit bare chip carrier |
| 07/09/1996 | US5534784 Method for probing a semiconductor wafer |
| 07/09/1996 | US5534751 Plasma etching apparatus utilizing plasma confinement |
| 07/09/1996 | US5534732 Single twist layout and method for paired line conductors of integrated circuits |
| 07/09/1996 | US5534731 Layered low dielectric constant technology |
| 07/09/1996 | US5534730 Conductive layer connection structure of a semiconductor device and a method of manufacturing thereof |
| 07/09/1996 | US5534728 Semiconductor device having a corrosion-resistant metal wiring layer |
| 07/09/1996 | US5534726 Semiconductor device provided with status detecting function |
| 07/09/1996 | US5534723 Semiconductor integrated circuit device having output and internal circuit MISFETS |
| 07/09/1996 | US5534722 Insulator substrate for a light valve device having an electrostatic protection region |
| 07/09/1996 | US5534720 Solid state image sensing element |
| 07/09/1996 | US5534719 HGCDTE thin film transistor |
| 07/09/1996 | US5534716 Semiconductor device having transistors with different orientations of crystal channel growth with respect to current carrier direction |
| 07/09/1996 | US5534714 Integrated field effect transistor and resonant tunneling diode |
| 07/09/1996 | US5534713 Silicon-germanium layers, relaxed layers alternating with layers under tensile and compressive strain |
| 07/09/1996 | US5534666 Multi-layer wiring board having a base block and a stacking block connected by an adhesive layer |
| 07/09/1996 | US5534467 Semiconductor packages for high I/O semiconductor dies |
| 07/09/1996 | US5534466 Depositing release dielectric layer on carrier |
| 07/09/1996 | US5534464 Semiconductor device having a semiconductor chip mounted on an insulating body |
| 07/09/1996 | US5534463 Method for forming a wiring layer |
| 07/09/1996 | US5534462 Method for forming a plug and semiconductor device having the same |
| 07/09/1996 | US5534461 Method for manufacturing a semiconductor device having planarized wiring |
| 07/09/1996 | US5534460 Optimized contact plug process |
| 07/09/1996 | US5534459 Method for forming silicon on insulator structured |
| 07/09/1996 | US5534458 Method of manufacturing a semiconductor device with high dielectric capacitor having sidewall spacers |
| 07/09/1996 | US5534457 Method of forming a stacked capacitor with an "I" shaped storage node |
| 07/09/1996 | US5534456 Method of making dense flash EEPROM cell array and peripheral supporting circuits formed in deposited field oxide with sidewall spacers |
| 07/09/1996 | US5534455 Method for protecting a stacked gate edge in a semiconductor device from self aligned source (SAS) etch |
| 07/09/1996 | US5534454 Method of producing a semiconductor device having accurate current detection |
| 07/09/1996 | US5534453 Washing, heat treatment |
| 07/09/1996 | US5534452 Method for producing semiconductor device |
| 07/09/1996 | US5534451 Method for fabricating a reduced area metal contact to a thin polysilicon layer contact structure having low ohmic resistance |
| 07/09/1996 | US5534450 Method for fabrication a semiconductor device |
| 07/09/1996 | US5534449 Methods of forming complementary metal oxide semiconductor (CMOS) integrated circuitry |
| 07/09/1996 | US5534448 Process for realizing P-channel MOS transistors having a low threshold voltage in semiconductor integrated circuits for analog applications |
| 07/09/1996 | US5534447 Process for fabricating MOS LDD transistor with pocket implant |
| 07/09/1996 | US5534446 Process for producing buried insulator layer in semiconductor substrate |
| 07/09/1996 | US5534445 Method of fabricating a polysilicon thin film transistor |
| 07/09/1996 | US5534442 Process of providing uniform photoresist thickness on an opto-electronic device |
| 07/09/1996 | US5534382 Positive photoresist composition |
| 07/09/1996 | US5534359 Silicon wafer with ridges and grooves, electron microscopes |
| 07/09/1996 | US5534312 Method for directly depositing metal containing patterned films |
| 07/09/1996 | US5534311 Production of structures by electrostatically-focused deposition |
| 07/09/1996 | US5534309 Calibration particles, semiconductor wafers, mixing aerosol with clean gas flow for specified time |
| 07/09/1996 | US5534294 Process for producing Semiconductor silicon wafer |
| 07/09/1996 | US5534290 Surround print process for the manufacture of electrode embedded dielectric green sheets |
| 07/09/1996 | US5534231 Low frequency inductive RF plasma reactor |
| 07/09/1996 | US5534127 Melting a solder layer to form sphere, cooling then adding a second layer and fusion |
| 07/09/1996 | US5534112 Method for testing electrical properties of silicon single crystal |
| 07/09/1996 | US5534110 Clamping a wafer in a plasma reacion chamber |
| 07/09/1996 | US5534109 Method for etching HgCdTe substrate |
| 07/09/1996 | US5534107 Using fluorine in the presence of ultraviolet radiation to produce fluorine and chlorine or bromine as a second gas for etching |
| 07/09/1996 | US5534106 Apparatus for processing semiconductor wafers |
| 07/09/1996 | US5534102 Component supply method |
| 07/09/1996 | US5534094 Method for fabricating multi-layer thin film structure having a separation layer |
| 07/09/1996 | US5534092 Method of manufacturing multilayer ceramic electronic component |
| 07/09/1996 | US5534079 Doped silicides or germanides for semiconductors |
| 07/09/1996 | US5534076 Megasonic cleaning system |
| 07/09/1996 | US5534074 Vertical boat for holding semiconductor wafers |
| 07/09/1996 | US5534073 Semiconductor producing apparatus comprising wafer vacuum chucking device |
| 07/09/1996 | US5534071 Integrated laser ablation deposition system |
| 07/09/1996 | US5534070 Plasma CVD process using a very-high-frequency and plasma CVD apparatus |
| 07/09/1996 | US5534066 Controlling and monitoring concentration of a gas for microelectronics |
| 07/09/1996 | US5533887 Fluid rotary apparatus having tapered rotors |
| 07/09/1996 | US5533736 Thermal processing apparatus |
| 07/09/1996 | US5533664 Method of manufacturing a semiconductor device |
| 07/09/1996 | US5533635 Baking photoresist-covered, etched wafer to convert residual chlorine to polymer in a carbon tetrafluoride and/or oxygen atmosphere prior to plasma stripping |
| 07/09/1996 | US5533586 Adjustable suspension system |
| 07/09/1996 | US5533540 Apparatus for uniform cleaning of wafers using megasonic energy |
| 07/09/1996 | US5533387 Method of evaluating silicon wafers |
| 07/09/1996 | US5533257 Method for forming a heat dissipation apparatus |
| 07/09/1996 | US5533256 Method for directly joining a chip to a heat sink |
| 07/09/1996 | US5533243 Notch position aligning apparatus and process for using the apparatus to independently align individual wafers in a wafer cassette |
| 07/09/1996 | CA2043610C Drive circuit comprising a subsidiary drive circuit |
| 07/04/1996 | WO1996020583A1 Process for manipulating microcomponents or lightweight components and device to carry out the process |
| 07/04/1996 | WO1996020501A1 An integrated circuit package encapsulated by fiber laden molding material and its method of manufacturing |
| 07/04/1996 | WO1996020500A1 Method of contacting a chip |
| 07/04/1996 | WO1996020499A1 Novel transistor with ultra shallow tip and method of fabrication |
| 07/04/1996 | WO1996020498A1 Oxide film, formation method thereof, and semiconductor device |
| 07/04/1996 | WO1996020497A1 Method of manufacturing semiconductor devices with semiconductor elements formed in a layer of semiconductor material glued on a support wafer |
| 07/04/1996 | WO1996020293A1 Layer-depositing device |
| 07/04/1996 | WO1996020145A1 Method of producing ceramic composite bodies |
| 07/04/1996 | WO1996012347A3 A protected switch |
| 07/04/1996 | DE19600049A1 Selbstbootstrapvorrichtung Selbstbootstrapvorrichtung |
| 07/04/1996 | DE19549155A1 Method of separating two semiconductor devices |
| 07/04/1996 | DE19548984A1 System for fuse couplers in integrated circuit |
| 07/04/1996 | DE19547811A1 Verfahren zur Herstellung von Kondensatoren von Halbleitervorrichtungen A process for producing capacitors of semiconductor devices |
| 07/04/1996 | DE19522364C1 Semiconductor transistor bonding pad arrangement |
| 07/04/1996 | DE19522162A1 Verfahren zum Entfernen von lichtempfindlichem Harz und Entfernvorrichtung für lichtempfindliches Harz A method for removing photosensitive resin and removing apparatus for photosensitive resin |
| 07/03/1996 | EP0739252A4 Process and apparatus for the treatment of semiconductor wafers in a fluid |
| 07/03/1996 | EP0720418A1 Ternary compound film and manufacturing method therefor |
| 07/03/1996 | EP0720295A2 Semiconductor device |
| 07/03/1996 | EP0720289A2 Ultra-fast MOS device circuits |
| 07/03/1996 | EP0720270A2 Low-side bidirectional battery disconnect switch |
| 07/03/1996 | EP0720243A2 Method of fabricating compound semiconductor device and optical semiconductor device |
| 07/03/1996 | EP0720240A2 Epitaxial wafer and method of preparing the same |
| 07/03/1996 | EP0720237A1 Zener diode for integrated circuits |
| 07/03/1996 | EP0720235A2 Trench MOSFET with heavily doped delta-layer to provide low on-resistance |
| 07/03/1996 | EP0720234A2 Vertical power MOSFET having thick metal layer to reduce distributed resistance and method of fabricating the same |