| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/26/2006 | US20060016385 Silicon wafer and method for manufacturing the same |
| 01/26/2006 | US20060016029 Brush scrubbing-high frequency resonating substrate processing system |
| 01/26/2006 | DE20321147U1 Semiconductor device, has one semiconductor chip including set of bumps with different heights is face-bonded on either of mount substrate and another chip, which is die-bonded on mount substrate |
| 01/26/2006 | DE19938907B4 Schaltung und Verfahren zum Verringern von Schaltstörungen Circuit and method for reducing switching noise |
| 01/26/2006 | DE19935131B4 Verfahren zur Beseitigung von Redepositionen von einem Wafer A method for removing redepositions of a wafer |
| 01/26/2006 | DE19916177B4 Verfahren zum Kontaktieren des Halbleiterchips und Halbleiterchip mit drahtförmigen Anschlußstücken Method of contacting of the semiconductor chip and the semiconductor chip with wire-shaped connecting pieces |
| 01/26/2006 | DE19535616B4 Schleifvorrichtung für Waferrand Grinding apparatus for wafer edge |
| 01/26/2006 | DE112004000527T5 Halbleiter-Epitaxial-Wafer Semiconductor epitaxial wafer |
| 01/26/2006 | DE112004000380T5 Ladungsträgereinfangspeicherarrays mit Immunität gegenüber Schäden aus der Kontaktlochherstellung Charge trapping memory arrays with immunity to damage from the contact hole fabrication |
| 01/26/2006 | DE112004000254T5 Verbessertes Funktionsverhalten in Flash-Speichereinrichtungen Improved functional behavior in flash memory devices |
| 01/26/2006 | DE10250611B4 Verfahren zur Herstellung eines Metallsilizidgebietes in einem dotierten Silizium enthaltenden Halbleiterbereich A method for producing a Metallsilizidgebietes in a doped silicon-containing semiconductor region |
| 01/26/2006 | DE10239580B4 Verfahren zum Ausbilden eines Kompensationsgebiets und Verwendung des Verfahrens zur Herstellung eines Kompensationshalbleiterbauelements A method of forming a compensation area and using the method for producing a compensation semiconductor component |
| 01/26/2006 | DE102005030359A1 Apparatus for forming thin film on substrate, has chamber with gas inlet, upper electrode, lower electrode, and selective injection plate including selective injection valve for selectively concentrating gas |
| 01/26/2006 | DE102005029266A1 Dünnschichttrasistor eines Flüssigkristalldisplays sowie zugehöriges Herstellungsverfahren Dünnschichttrasistor a liquid crystal display and manufacturing method thereof |
| 01/26/2006 | DE102005029136A1 Verfahren und Einrichtung für die Montage von Halbleiterchips Method and device for the assembly of semiconductor chips |
| 01/26/2006 | DE102005022530A1 Waferteilungsverfahren Wafer dividing method |
| 01/26/2006 | DE102004060444A1 Formation of polysilicon film of semiconductor device, involves loading semiconductor substrate into deposition chamber, flowing specific silicon hydride gas into chamber at preset flow rate, and forming undoped polysilicon film |
| 01/26/2006 | DE102004057978A1 Fabrication of semiconductor device with dual dielectric structure, e.g. non-volatile dynamic random access memory device, includes forming oxide layer by radical oxidation process |
| 01/26/2006 | DE102004041049A1 Mobile, electrostatic substrate click for wafers in semiconductor manufacture, comprises additional capacitor structures for charge storage, extending over several electrode levels, on support substrate |
| 01/26/2006 | DE102004033553A1 Production of a semiconductor component on a substrate comprises adhering a silicon wafer with a metal-containing phase containing aluminum and/or silver to a high temperature stable support made from silicon carbide and heat treating |
| 01/26/2006 | DE102004032917A1 Schichtanordnung und Verfahren zum Herstellen einer Schichtanordnung Layer arrangement and method for producing a layer arrangement |
| 01/26/2006 | DE102004032912A1 Semiconductor component structure for reducing minority carrier injection has a protective structure with active component zones and semiconductor zones |
| 01/26/2006 | DE102004032761A1 Strip conductor production method for complex-structured strip conductor surfaces with contact surfaces on electronic components deposits a germinal coating on a surface with bond pads |
| 01/26/2006 | DE102004032605A1 Halbleiterbauteil mit einem Halbleiterchip und elektrischen Verbindungselementen zu einer Leiterstruktur A semiconductor device comprising a semiconductor chip and electrical connecting elements to a printed circuit structure |
| 01/26/2006 | DE102004031997A1 Gehäuse für ein Halbleiter-Bauelement und Halbleiter-Bauelement-Test-System zum Testen der Kontaktierung bei übereinander angeordneten Halbleiter-Bauelementen A housing for a semiconductor device and semiconductor device testing system for testing the contact in superposed semiconductor devices |
| 01/26/2006 | DE102004031889A1 Halbleiterbauteil mit einem Gehäuse und einem teilweise in eine Kunststoffgehäusemasse eingebetteten Halbleiterchip und Verfahren zur Herstellung desselben Of the same semiconductor device having a housing and a partially embedded in a plastic housing compound semiconductor chip and method for producing |
| 01/26/2006 | DE102004031741A1 Verfahren zur Herstellung von Feldeffekttransistorstrukturen mit Gateelektroden mit einer Metalllage Process for the preparation of field effect transistor structures with gate electrodes having a metal layer |
| 01/26/2006 | DE102004031436A1 Einrichtung und Verfahren zum Kalibrieren eines Halbleiter-Bauelement-Test-Systems, insbesondere einer probecard bzw. eines Halbleiter-Bauelement-Testgeräts Apparatus and method for calibrating a semiconductor device test system, in particular a probe card and a semiconductor device tester |
| 01/26/2006 | DE102004006505B4 Charge-Trapping-Speicherzelle und Herstellungsverfahren Charge-trapping memory cell, and manufacturing method |
| 01/26/2006 | DE10038887B4 Verfahren zum Verhindern des Wachstums natürlichen Oxids während der Nitrierung A method for preventing the growth of native oxide during the nitration |
| 01/26/2006 | DE10008683B4 Halbleitervorrichtung und zugehöriges Herstellungsverfahren A semiconductor device and manufacturing method thereof |
| 01/26/2006 | CA2574116A1 Stage for holding silicon wafer substrate and method for measuring temperature of silicon wafer substrate |
| 01/25/2006 | EP1619798A1 Semiconductor integrated circuit, logic operation circuit, and flip flop |
| 01/25/2006 | EP1619721A2 Split-gate non-volatile EPROM memory cells and method of manufacturing the same |
| 01/25/2006 | EP1619720A2 Static random access memory |
| 01/25/2006 | EP1619718A1 Electronic device and its manufacturing method |
| 01/25/2006 | EP1619717A1 Device for applying semiconductor treatment to treatment subject substrate |
| 01/25/2006 | EP1619716A1 Pressure testing apparatus and method for pressure testing |
| 01/25/2006 | EP1619715A1 Method for manufacturing semiconductor device |
| 01/25/2006 | EP1619714A1 Method for fabricating a compound semiconductor epitaxial wafer |
| 01/25/2006 | EP1619693A1 Electrode material and semiconductor device |
| 01/25/2006 | EP1619554A1 Positive photoresist composition and method for forming resist pattern |
| 01/25/2006 | EP1619553A1 Positive resist composition and method of formation of resist patterns |
| 01/25/2006 | EP1619552A2 Method of designing charged particle beam mask, charged particle beam mask and charged particle beam transfer method |
| 01/25/2006 | EP1619551A2 Method of manufacturing membrane mask, method of manufacturing semiconductor device, and membrane mask |
| 01/25/2006 | EP1619495A1 Method and Apparatus for inspecting a specimen surface and use of fluorescent materials |
| 01/25/2006 | EP1619277A2 Process for making a structure having at least one precisely positioned zone of one or several semiconductor nanocrystals |
| 01/25/2006 | EP1619269A2 Method for enhancing fluorine utilization |
| 01/25/2006 | EP1619268A2 Process for titanium nitride removal |
| 01/25/2006 | EP1619267A2 Method for removing carbon-containing residues from a substrate |
| 01/25/2006 | EP1619227A1 Method for releasing adhered article |
| 01/25/2006 | EP1619226A1 Silica-based film, method of forming the same, composition for forming insulating film for semiconductor device, interconnect structure, and semiconductor device |
| 01/25/2006 | EP1618989A2 Method for chamfering wafers |
| 01/25/2006 | EP1618988A2 Method for chamfering wafers |
| 01/25/2006 | EP1618611A1 Method for production of a semiconductor device with auto-aligned metallisations |
| 01/25/2006 | EP1618609A1 Programmable semiconductor device |
| 01/25/2006 | EP1618606A2 Circuit device with at least partial packaging and method for forming |
| 01/25/2006 | EP1618603A2 Mirror image memory cell transistor pairs featuring poly floating spacers |
| 01/25/2006 | EP1618602A2 A method of forming stepped structures employing imprint lithography |
| 01/25/2006 | EP1618601A2 Methods and apparatus for patterned deposition of nanostructure-containing materials by self-assembly and related articles |
| 01/25/2006 | EP1618600A1 Micro-machined device structures having on and off-axis orientations |
| 01/25/2006 | EP1618599A2 Method of making a nanogap for variable capacitive elements and device having a nanogap |
| 01/25/2006 | EP1618596A1 Device and method for thermal treatment |
| 01/25/2006 | EP1618587A2 Beam uniformity and angular distribution measurement system |
| 01/25/2006 | EP1618226A1 Carbon nanotube growth method |
| 01/25/2006 | EP1618035A2 Microfluidic device with ultraphobic surfaces |
| 01/25/2006 | EP1617967A2 Wirebonding insulated wire |
| 01/25/2006 | EP1617966A2 Diffusion bonding method for microchannel plates |
| 01/25/2006 | EP1617957A2 Ultra low k (ulk) sicoh film and method |
| 01/25/2006 | EP1570015A4 Passivative chemical mechanical polishing composition for copper film planarization |
| 01/25/2006 | EP1527662B1 Device for selectively displacing holding devices and fitting head for transporting components |
| 01/25/2006 | EP1497851B1 Program-controlled dicing of a substrate using a pulsed laser |
| 01/25/2006 | EP1378036A4 Injection seeded laser with precise timing control |
| 01/25/2006 | EP1303892A4 Injection seeded f 2? lithography laser |
| 01/25/2006 | EP1294534B2 In-situ endpoint detection and process monitoring method and apparatus for chemical mechanical polishing |
| 01/25/2006 | EP1209211B1 Adhesive, adhesive member, circuit substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same |
| 01/25/2006 | EP1166333B1 Multi-stage single-drive foup door opening system |
| 01/25/2006 | EP1123556B1 Fuse circuit having zero power draw for partially blown condition |
| 01/25/2006 | EP1112125B1 Metallization structures for microelectronic applications and process for forming the structures |
| 01/25/2006 | EP1062618A4 Non-lot based method for assembling integrated circuit devices |
| 01/25/2006 | CN1726745A Plasma generation device, plasma control method, and substrate manufacturing method |
| 01/25/2006 | CN1726630A Apparatus for processing an object with high position accurancy |
| 01/25/2006 | CN1726624A Methods of forming electronic devices including semiconductor mesa structures and conductivity junctions and related devices |
| 01/25/2006 | CN1726606A Organic light emitting materials and devices |
| 01/25/2006 | CN1726600A Thin film transistor array panel for X-ray detector |
| 01/25/2006 | CN1726598A Formation of contacts on semiconductor substrates |
| 01/25/2006 | CN1726597A Vertical insulated gate transistor and manufacturing method |
| 01/25/2006 | CN1726596A Trench MIS device having implanted drain-drift region and thick bottom oxide and process for manufacturing the same |
| 01/25/2006 | CN1726595A Dense dual-plane devices |
| 01/25/2006 | CN1726590A Trench isolation structure for a semiconductor device with a different degree of corner rounding and a method of manufacturing the same |
| 01/25/2006 | CN1726589A End effector assembly for supporting substrates |
| 01/25/2006 | CN1726588A N-channel pull-up element & logic circuit |
| 01/25/2006 | CN1726587A Manufacture of a trench-gate semiconductor device |
| 01/25/2006 | CN1726586A Method of manufacture of a trench-gate semiconductor device |
| 01/25/2006 | CN1726585A Method of manufacturing a trench-gate semiconductor device |
| 01/25/2006 | CN1726584A A device and method for controlling plasma with an adjustable coupling to ground circuit |
| 01/25/2006 | CN1726583A Processing method and device |
| 01/25/2006 | CN1726582A Method of manufacturing a semiconductor device and semiconductor device obtained with such a method |
| 01/25/2006 | CN1726581A Strained silicon-on-insulator (SSOI) and method to form the same |
| 01/25/2006 | CN1726570A Dye sensitized solar cells having foil electrodes |