| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/24/2006 | US6988463 Ion beam source with gas introduced directly into deposition/vacuum chamber |
| 01/24/2006 | US6988327 Methods and systems for processing a substrate using a dynamic liquid meniscus |
| 01/24/2006 | US6988326 Phobic barrier meniscus separation and containment |
| 01/24/2006 | US6988312 Method for producing multilayer circuit board for semiconductor device |
| 01/24/2006 | US6988307 Method of making an integrated inductor |
| 01/24/2006 | CA2382724C Nanometer-sized silica-coated alpha-alumina abrasives in chemical mechanical planarization |
| 01/24/2006 | CA2184432C Apparatus for coating substrates in a vacuum |
| 01/19/2006 | WO2006007462A1 ISOLATION STRUCTURE FOR A MEMORY CELL USING Al2O3 DIELECTRIC |
| 01/19/2006 | WO2006007446A2 Photonic crystal emitter, detector, and sensor |
| 01/19/2006 | WO2006007396A1 Strained silicon-on-silicon by wafer bonding and layer transfer |
| 01/19/2006 | WO2006007394A2 Strained tri-channel layer for semiconductor-based electronic devices |
| 01/19/2006 | WO2006007367A1 Method of making mirror image memory cell transistor pairs featuring poly floating spaces |
| 01/19/2006 | WO2006007355A1 Method for providing uniform removal of organic material |
| 01/19/2006 | WO2006007350A1 High mobility tri-gate devices and methods of fabrication |
| 01/19/2006 | WO2006007343A2 Semiconductor devices shared element(s) apparatus and method |
| 01/19/2006 | WO2006007327A2 Forming semiconductor devices by printing multiple semiconductor inks |
| 01/19/2006 | WO2006007297A1 Elongated features for improved alignment process integration |
| 01/19/2006 | WO2006007281A1 Solder bumps formation using paste retaining its shape after uv irradiation |
| 01/19/2006 | WO2006007192A2 Three-dimensional photoresist structures and method of making |
| 01/19/2006 | WO2006007188A1 Technique for forming a substrate having crystalline semiconductor regions of different characteristics |
| 01/19/2006 | WO2006007156A1 Fabrication of crystalline materials over substrates |
| 01/19/2006 | WO2006007143A2 Schottky device and method of forming |
| 01/19/2006 | WO2006007142A2 Ultra-thin die and method of fabricating same |
| 01/19/2006 | WO2006007141A2 Lead solder indicator and method |
| 01/19/2006 | WO2006007081A2 Method of making a semiconductor device having a strained semiconductor layer |
| 01/19/2006 | WO2006007080A2 Method of forming a nanocluster charge storage device |
| 01/19/2006 | WO2006007069A2 Method of forming a nanocluster charge storage device |
| 01/19/2006 | WO2006007068A2 Integration of strained ge into advanced cmos technology |
| 01/19/2006 | WO2006007005A1 A system and method for processing a substrate using supercritical carbon dioxide processing |
| 01/19/2006 | WO2006006964A1 Silicon carbide devices and fabricating methods therefor |
| 01/19/2006 | WO2006006850A1 Laser cutting method and arrangement for performing said method |
| 01/19/2006 | WO2006006752A1 Brittle material transfer apparatus using linear motor |
| 01/19/2006 | WO2006006730A1 Planar motor equipment, stage equipment, exposure equipment and device manufacturing method |
| 01/19/2006 | WO2006006635A2 Defect repair device and defect repair method |
| 01/19/2006 | WO2006006630A1 Magnetoresistive device, method for manufacturing magnetoresistive device and magnetic random access memory |
| 01/19/2006 | WO2006006611A1 Ic chip and its manufacturing method |
| 01/19/2006 | WO2006006584A1 Vapor phase growing equipment |
| 01/19/2006 | WO2006006565A1 Exposure equipment and device manufacturing method |
| 01/19/2006 | WO2006006562A1 Method of determining exposure conditions, exposure method, exposure apparatus, and method of producing device |
| 01/19/2006 | WO2006006540A1 Photomask blank, photomask manufacturing method and semiconductor device manufacturing method |
| 01/19/2006 | WO2006006526A1 Method and device for treating outer periphery of base material |
| 01/19/2006 | WO2006006391A1 Wafer heating equipment and semiconductor manufacturing equipment |
| 01/19/2006 | WO2006006364A1 Substrate recovery method and substrate processing apparatus |
| 01/19/2006 | WO2006005959A1 Apparatus for and a method of determining characteristics of thin-layer structures using low-coherence interferometry |
| 01/19/2006 | WO2006005869A1 Method for metallizing the previously passivated surface of a semiconductor material and resulting material |
| 01/19/2006 | WO2006005670A1 Method for producing a capacitor arrangement, and corresponding capacitor arrangement |
| 01/19/2006 | WO2006005321A2 Method for producing an integrated circuit and substrate comprising a buried layer |
| 01/19/2006 | WO2006005317A2 Method for the production of an electric component and component |
| 01/19/2006 | WO2006005304A2 Semiconductor component with a semiconductor chip and electric connecting elements for connecting to a conductor structure |
| 01/19/2006 | WO2005114709A3 Inter-process sensing of wafer outcome |
| 01/19/2006 | WO2005109485A3 Metallic air-bridges |
| 01/19/2006 | WO2005106890A8 An organic electronic circuit with functional interlayer and method for making the same |
| 01/19/2006 | WO2005104211A3 Land grid array packaged device and method of forming same |
| 01/19/2006 | WO2005103321A3 Ionized physical vapor deposition (ipvd) process |
| 01/19/2006 | WO2005101460A3 Bonding an interconnect to a circuit device and related devices |
| 01/19/2006 | WO2005101458A3 Method and use of a device for applying coatings onto band-shaped structures during the production of semiconductor components |
| 01/19/2006 | WO2005098932A3 Method and device for feeding encapsulating material to a mould cavity |
| 01/19/2006 | WO2005094534A3 A semiconductor device having a silicided gate electrode and method of manufacture therefor |
| 01/19/2006 | WO2005076794A3 Die encapsulation using a porous carrier |
| 01/19/2006 | WO2005062355A8 Capacitor |
| 01/19/2006 | WO2005022639A3 Gallium nitride material devices and methods of forming the same |
| 01/19/2006 | WO2005004189A3 Sidewall magnet improving uniformity of inductively coupled plasma and shields used therewith |
| 01/19/2006 | WO2005001895A3 Patterned thin film graphite devices and method for making same |
| 01/19/2006 | WO2004086489A8 System and method of silicon crystallization |
| 01/19/2006 | US20060015834 Method for correcting crosstalk |
| 01/19/2006 | US20060015760 Semiconductor device for supplying power supply voltage to semiconductor device |
| 01/19/2006 | US20060015279 Device for correcting reference position for transfer mechanism, and correction method |
| 01/19/2006 | US20060015206 Formula-based run-to-run control |
| 01/19/2006 | US20060014860 interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components, a curing agent and a hydroxy resin with radical polymer |
| 01/19/2006 | US20060014845 Low dielectric organosilicate polymer composite |
| 01/19/2006 | US20060014657 Etching; corrosion resistance |
| 01/19/2006 | US20060014479 Arrangement of a chemical-mechanical polishing tool and method of chemical-mechanical polishing using such a chemical-mechanical polishing tool |
| 01/19/2006 | US20060014476 Method of fabricating a window in a polishing pad |
| 01/19/2006 | US20060014465 Semiconductor device and manufacturing method therefor |
| 01/19/2006 | US20060014400 Method for fabricating a buried metallic layer in a semiconductor body and semiconductor component having a buried metallic layer |
| 01/19/2006 | US20060014399 Low-temperature plasma-enhanced chemical vapor deposition of silicon-nitrogen-containing films |
| 01/19/2006 | US20060014398 Method of forming dielectric layer using plasma enhanced atomic layer deposition technique |
| 01/19/2006 | US20060014397 Methods for the reduction and elimination of particulate contamination with CVD of amorphous carbon |
| 01/19/2006 | US20060014396 Method for forming a resist protect layer |
| 01/19/2006 | US20060014395 Method of manufacturing displays and apparatus for manufacturing displays |
| 01/19/2006 | US20060014394 Process for low temperature, dry etching, and dry planarization of copper |
| 01/19/2006 | US20060014393 Process method to facilitate silicidation |
| 01/19/2006 | US20060014392 Method for producing a semiconductor component and a semiconductor component produced according to the method |
| 01/19/2006 | US20060014391 Method of manufacturing a semiconductor device using a cleaning composition |
| 01/19/2006 | US20060014390 Slurry composition, polishing method using the slurry composition and method of forming a gate pattern using the slurry composition |
| 01/19/2006 | US20060014389 Method of manufacturing semiconductor device |
| 01/19/2006 | US20060014388 Wafer processing apparatus & methods for depositing cobalt silicide |
| 01/19/2006 | US20060014387 Silicide formation using a low temperature anneal process |
| 01/19/2006 | US20060014386 Small grain size, conformal aluminum interconnects and method for their formation |
| 01/19/2006 | US20060014385 Method of forming titanium nitride layer and method of fabricating capacitor using the same |
| 01/19/2006 | US20060014384 Method of forming a layer and forming a capacitor of a semiconductor device having the same layer |
| 01/19/2006 | US20060014383 Method of producing semiconductor single crystal wafer and laser processing device used therefor |
| 01/19/2006 | US20060014382 Method for forming an interconnection line in a semiconductor device |
| 01/19/2006 | US20060014381 Method for forming interconnection line in semiconductor device using a phase-shift photo mask |
| 01/19/2006 | US20060014380 Production method for wiring structure of semiconductor device |
| 01/19/2006 | US20060014379 Semiconductor processing methods of forming contact openings, methods of forming electrical connections and interconnections, and integrated circuitry |
| 01/19/2006 | US20060014378 System and method to form improved seed layer |
| 01/19/2006 | US20060014377 Method for forming passivation film of semiconductor device and structure of passivation film of semiconductor device |
| 01/19/2006 | US20060014376 Stacked via-stud with improved reliability in copper metallurgy |
| 01/19/2006 | US20060014375 Soluble carbon nanotubes |