Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2006
01/31/2006US6991946 Method and system for providing backside voltage contrast for silicon on insulator devices
01/31/2006US6991945 Fault detection spanning multiple processes
01/31/2006US6991944 Surface treatment for multi-layer wafers formed from layers of materials chosen from among semiconducting materials
01/31/2006US6991943 Process for preparation of semiconductor wafer surface
01/31/2006US6991942 MFIS ferroelectric memory array on SOI and method of making same
01/31/2006US6991896 comprises photomasks/optical filters for patterning contact-holes; improved resolution
01/31/2006US6991890 acid generator, additive, and unsaturated hydroxyl-containing monomer; not subject to swelling and/or microbridging when exposed photoresist is dissolved in developer solution, avoiding limited spatial resolution in photolithography
01/31/2006US6991888 Photoresist composition for deep ultraviolet lithography comprising a mixture of photoactive compounds
01/31/2006US6991878 Photomask repair method and apparatus
01/31/2006US6991877 Projection lens exposes pattern to illumination; for fabrication of semiconductor chips, integrated circuits
01/31/2006US6991866 Fuel cell and power chip technology
01/31/2006US6991854 Gold alloy bonding wire for semiconductor device
01/31/2006US6991825 Dispensation of controlled quantities of material onto a substrate
01/31/2006US6991739 Method of photoresist removal in the presence of a dielectric layer having a low k-value
01/31/2006US6991711 Cup type plating apparatus
01/31/2006US6991710 Apparatus for manually and automatically processing microelectronic workpieces
01/31/2006US6991709 Simultaneously applying direct current power to a metal target, and RF power to pedestal electrode to accelerate the copper ion reaching deeply into narrow hole on wafer; metallization; forming copper interconnect; semiconductors
01/31/2006US6991703 Bonding method, bonding stage and electronic component packaging apparatus
01/31/2006US6991701 Plasma treatment method and apparatus
01/31/2006US6991699 LCD bonding machine and method for fabricating LCD by using the same
01/31/2006US6991684 Heat-treating apparatus and heat-treating method
01/31/2006US6991680 Liquid droplet ejecting apparatus, electro-optical device, method of manufacturing the electro-optical device, and electronic apparatus
01/31/2006US6991528 Polishing article for processing a substrate comprises a fabric layer having a conductive layer disposed thereover. The conductive layer has an exposed surface adapted to polish a substrate. The fabric layer may be woven or non-woven. The
01/31/2006US6991520 Abrasive machine and method of abrading work piece
01/31/2006US6991517 Linear polishing sheet with window
01/31/2006US6991512 Apparatus for edge polishing uniformity control
01/31/2006US6991506 Display apparatus and method for fabricating the same
01/31/2006US6991455 Shutter structure of an oven apparatus used in semiconductor or liquid crystal display processes
01/31/2006US6991420 Tool for handling wafers and epitaxial growth station
01/31/2006US6991419 Method and apparatus for transferring a wafer
01/31/2006US6991416 System and method for reticle protection and transport
01/31/2006US6991385 Method for developing processing and apparatus for supplying developing solution
01/31/2006US6991207 Molds for wafer scale molding of protective caps
01/31/2006US6991151 Method of fabricating an electronic module comprising an active component on a base
01/31/2006US6991147 dispensers comprising nozzles and power sources, used for dispensing and solidifying liquid dielectrics on conductors; miniaturization; preventing short circuiting
01/31/2006US6991110 Package for storing sensor crystals and related method of use
01/31/2006US6990988 Substrate processing method and substrate processing system
01/31/2006US6990870 System for determining characteristics of substrates employing fluid geometries
01/31/2006US6990750 Apparatus and method for maintaining a dry atmosphere to prevent moisture absorption and allow demoisturization of electronic components
01/31/2006US6990747 Vacuum processing apparatus and substrate transfer method
01/31/2006US6990737 Fluid bearings and vacuum chucks and methods for producing same
01/31/2006US6990733 Method of making stitched LGA connector
01/31/2006US6990721 Growth model automated material handling system
01/31/2006US6990704 Substrate cleaning apparatus and substrate cleaning method
01/30/2006CA2514133A1 Reverse printing
01/28/2006CA2513779A1 Method for placing openings in a substrate
01/26/2006WO2006010133A2 Tunable photonic crystal
01/26/2006WO2006010055A2 Drain extended mos transistors and methods for making the same
01/26/2006WO2006009850A2 Semiconductor assembly having substrate with electroplated contact pads
01/26/2006WO2006009818A2 Semiconductor structure processing using multiple laser beam spots
01/26/2006WO2006009783A2 Low dielectric constant zinc oxide
01/26/2006WO2006009782A2 Persistent p-type group ii-vi semiconductors
01/26/2006WO2006009781A2 Dynamic p-n junction growth
01/26/2006WO2006009723A2 Substrate processing apparatus with removable component module
01/26/2006WO2006009668A1 Silicon wafer etching process and composition
01/26/2006WO2006009641A1 Method of polishing a tungsten-containing substrate
01/26/2006WO2006009640A1 Cmp composition for improved oxide removal rate
01/26/2006WO2006009613A2 Sti formation in semiconductor device including soi and bulk silicon regions
01/26/2006WO2006009578A2 High-resolution in-plane tuning fork gyroscope and methods of fabrication
01/26/2006WO2006009444A2 Method and apparatus for inspecting a specimen surface and use of fluorescent materials
01/26/2006WO2006009304A1 Polishing apparatus and substrate processing method
01/26/2006WO2006009254A1 Support device, stage device, exposure device, and device manufacturing method
01/26/2006WO2006009213A1 Plasma processing apparatus
01/26/2006WO2006009188A1 Image surface measurement method, exposure method, device manufacturing method, and exposure device
01/26/2006WO2006009169A1 Exposure method and method for producing device
01/26/2006WO2006009160A1 Cmp polishing agent and method for polishing substrate
01/26/2006WO2006009148A1 Simox substrate manufacturing method
01/26/2006WO2006009064A1 Support method and support structure for optical member, optical apparatus, exposure apparatus, and device production method
01/26/2006WO2006009046A1 Development processing device and development processing method
01/26/2006WO2006009045A1 Substrate heating equipment substrate heating method
01/26/2006WO2006009025A1 Semiconductor device and semiconductor device manufacturing method
01/26/2006WO2006008957A1 Silicon epitaxial wafer and process for producing the same
01/26/2006WO2006008925A1 Iii-v hemt devices
01/26/2006WO2006008882A1 A method of evaluating charcteristics of and forming of an insulating film for a semiconductor device
01/26/2006WO2006008747A2 On-chip inductor
01/26/2006WO2006008701A2 Assembly and method of placing the assembly on an external board
01/26/2006WO2006008689A1 Bipolar transistor and method of manufacturing the same
01/26/2006WO2006008415A1 Method for producing a biochip blank, and corresponding blank and biochip
01/26/2006WO2006008411A1 Assembling two substrates by molecular adhesion
01/26/2006WO2006008410A1 Assembling two substrates by molecular adhesion, one of the two supporting an electrically conductive film
01/26/2006WO2006008356A1 Integrated circuit comprising a capacitor with metal electrodes, and method of producing one such capacitor
01/26/2006WO2006008236A1 Fluid discharging device
01/26/2006WO2006007819A1 Substrate with strip conductors and production of strip conductors on substrates for semiconductor components
01/26/2006WO2005114707A3 Materials suitable for shallow trench isolation
01/26/2006WO2005091758A3 Integrated circuit with multiple spacer insulating region widths
01/26/2006WO2005090638A9 Remote chamber methods for removing surface deposits
01/26/2006WO2005083513A3 Composite patterning with trenches
01/26/2006WO2005078770A3 Active electronic devices with nanowire composite components
01/26/2006WO2005074025A3 Self-aligned trench mos junctions field-effect transistor for high-frequency applications
01/26/2006WO2005039868A3 Structuring of electrical functional layers by means of a transfer film and structuring the adhesive
01/26/2006WO2005038994A3 Laser-based system for memory link processing with picosecond lasers
01/26/2006WO2005033234A3 Novel slurry for chemical mechanical polishing of metals
01/26/2006WO2005029329A3 A system and method for testing and configuring semiconductor functional circuits
01/26/2006WO2005017962A3 System and process for producing nanowire composites and electronic substrates therefrom
01/26/2006WO2005013323A3 Methods and apparatus for fabricating solar cells
01/26/2006WO2004109750A3 Wiring for semiconductor device, thin film transistor array panel including wiring, and manufacturing method thereof
01/26/2006WO2004102073A3 Vestibule assembly for a heat treatment furnace
01/26/2006WO2004081987A3 Sige rectification process
01/26/2006US20060020734 Signal bus arrangement
01/26/2006US20060020362 System and program for making recipe and method for manufacturing products by using recipe