Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2006
09/12/2006US7105266 Polymers containing oxygen and sulfur alicyclic units and photoresist compositions comprising same
09/12/2006US7105265 Method for removing resist pattern
09/12/2006US7105264 Method for forming patterned conductive film, electrooptical device, and electronic appliance
09/12/2006US7105256 Silver powder, an organic binder, a photopolymerizable monomer,a photopolymerization initiator and a lead-free glass;
09/12/2006US7105226 To fix or protect a work piece during processing of the work piece temporarily held on a hard plate
09/12/2006US7105208 Methods and processes utilizing microwave excitation
09/12/2006US7105145 Method of producing ferroelectric metal oxide crystalline particles
09/12/2006US7105133 For use in semiconductor manufacturing
09/12/2006US7105118 Methods of forming three-dimensional nanodot arrays in a matrix
09/12/2006US7105102 Vacuum plasma processor having a chamber with electrodes and a coil for plasma excitation and method of operating same
09/12/2006US7105101 Method of removing oxide film on a substrate with hydrogen and fluorine radicals
09/12/2006US7105100 System and method for gas distribution in a dry etch process
09/12/2006US7105099 Method of reducing pattern pitch in integrated circuits
09/12/2006US7105074 Substrate treating method and apparatus
09/12/2006US7105070 Method for producing ceramic substrate, and ceramic substrate
09/12/2006US7105065 Metal layer forming methods and capacitor electrode forming methods
09/12/2006US7105061 Method and apparatus for sealing substrate load port in a high pressure reactor
09/12/2006US7105060 Method of forming an oxidation-resistant TiSiN film
09/12/2006US7105059 Reaction apparatus for atomic layer deposition
09/12/2006US7105055 In situ growth of oxide and silicon layers
09/12/2006US7105054 Method and apparatus of growing a thin film onto a substrate
09/12/2006US7105048 Laser irradiation apparatus
09/12/2006US7104875 Chemical mechanical polishing apparatus with rotating belt
09/12/2006US7104869 Barrier removal at low polish pressure
09/12/2006US7104804 Method and apparatus for memory module circuit interconnection
09/12/2006US7104579 Detection and handling of semiconductor wafers and wafer-like objects
09/12/2006US7104578 Two level end effector
09/12/2006US7104535 Methods and apparatus for positioning a substrate relative to a support stage
09/12/2006US7104476 Multi-sectored flat board type showerhead used in CVD apparatus
09/12/2006US7104453 Unitary package identification and dimensioning system employing ladar-based scanning methods
09/12/2006US7104267 Planarized copper cleaning for reduced defects
09/12/2006US7104217 Plasma processing apparatus
09/12/2006US7103990 Rotary silicon wafer cleaning apparatus
09/12/2006US7103967 Chip-component accommodating device and examining apparatus having the same
09/12/2006US7103966 Device for coupling PCB sheet
09/12/2006US7103959 Conduit for preventing oxidation of a electronic device
09/12/2006CA2433462C Printed circuit board, method for producing same and semiconductor device
09/08/2006WO2006094241A2 Thin-film device comprising an oxide semiconductor and method of selective annealing a blanket coated oxide semiconductor layer
09/08/2006WO2006094231A1 System and method for forming conductive material on a substrate
09/08/2006WO2006094040A2 A method for pattern metalization of substrates
09/08/2006WO2006093990A1 Activated carbon selective epitaxial process
09/08/2006WO2006093770A1 Method to remove resist, etch residue, and copper oxide from substrates having copper and low-k dielectric material
09/08/2006WO2006093730A1 Method for forming self-aligned, dual silicon nitride liner for cmos devices
09/08/2006WO2006093727A1 Multilayer film
09/08/2006WO2006093639A1 Temporary wafer bonding method for semiconductor processing
09/08/2006WO2006093625A1 Conductive pad with high abrasion
09/08/2006WO2006093386A1 Method of bonding aluminum electrodes of two semiconductor substrates
09/08/2006WO2006093340A1 Exposure apparatus
09/08/2006WO2006093315A1 Anisotropic conductive adhesive and method of electrode connection therewith
09/08/2006WO2006093309A1 Semiconductor device and the method of manufacturing the same
09/08/2006WO2006093268A1 Projection electron beam apparatus and defect inspection system using the apparatus
09/08/2006WO2006093263A1 Method for forming tantalum nitride film
09/08/2006WO2006093262A1 Method for forming tantalum nitride film
09/08/2006WO2006093261A1 Method for forming tantalum nitride film
09/08/2006WO2006093260A1 Method for forming tantalum nitride film
09/08/2006WO2006093259A1 Method for forming tantalum nitride film
09/08/2006WO2006093258A1 Method for forming tantalum nitride film
09/08/2006WO2006093204A1 Semiconductor integrated circuit device
09/08/2006WO2006093193A1 Metal pattern, organic electronic device and process for producing the same
09/08/2006WO2006093185A1 Probe and probe card
09/08/2006WO2006093174A1 Vertical gallium nitride semiconductor device and epitaxial substrate
09/08/2006WO2006093136A1 Substrate processing apparatus and semiconductor device manufacturing method
09/08/2006WO2006093130A1 Unit for levitating object to be conveyed, device for levitating object to be conveyed, and stage device
09/08/2006WO2006093120A1 Relay station and substrate processing system using relay station
09/08/2006WO2006093057A1 Composition for underlayer film of resist and process for producing the same
09/08/2006WO2006093037A1 Semiconductor production system and semiconductor production method
09/08/2006WO2006093029A1 Thin film transistor panel
09/08/2006WO2006093024A1 Holder of flat plate panel
09/08/2006WO2006093023A1 Semiconductor device and method for manufacturing same
09/08/2006WO2006093018A1 Two-light flux interference exposure device, two-light flux interference exposure method, semiconductor light emitting element manufacturing method, and semiconductor light emitting element
09/08/2006WO2006092997A1 Plasma processing apparatus
09/08/2006WO2006092994A1 Substrate cleaning apparatus and cleaning method thereof
09/08/2006WO2006092985A1 Microwave plasma processing device
09/08/2006WO2006092936A1 Semiconductor thin film or electromagnetic induction heating method for semiconductor wafer
09/08/2006WO2006092932A1 Method for manufacturing multilayer epitaxial silicon single crystal wafer, and multilayer epitaxial silicon single crystal wafer
09/08/2006WO2006092886A1 Method for manufacturing bonded wafer and bonded wafer
09/08/2006WO2006092848A1 Semiconductor device and method for manufacturing same
09/08/2006WO2006092846A1 Semiconductor device and method for manufacturing same
09/08/2006WO2006092824A1 Semiconductor device and method for manufacturing same
09/08/2006WO2006092754A2 A method of manufacturing a semiconductor packages and packages made
09/08/2006WO2006092321A1 Method and device for deactivating trapping effects in doped semiconductors
09/08/2006WO2006092117A1 Semiconductor element and method for production of a semiconductor element
09/08/2006WO2006071617A3 Semiconductor structures utilizing thin film resistors and tungsten plug connectors and methods for making the same
09/08/2006WO2006049954A3 Methods for protecting silicon or silicon carbide electrode surfaces from morphological modification during plasma etch processing
09/08/2006WO2006036245A3 Iso/nested cascading trim control with model feedback updates
09/08/2006WO2006035411A3 Reduction of sheet resistance of phosphorus implanted poly-silicon
09/08/2006WO2006033086A3 Method of making shallow semiconductor junctions
09/08/2006WO2006015642A3 Electric component with a flip-chip construction
09/08/2006WO2006012110A3 Integrated transistor module and method of fabricating same
09/08/2006WO2006007080A3 Method of forming a nanocluster charge storage device
09/08/2006WO2005114739A3 Manufacturing method of composite sheet material using ultra-fast laser pulses
09/08/2006WO2005086223A3 Multi-layer overlay measurement and correction technique for ic manufacturing
09/08/2006WO2005013319A3 Semiconductor device with strain relieving bump design
09/08/2006WO2005010946A3 DEPOSITION OF SiGe ON SILICON-ON-INSULATOR STRUCTURES AND BULK SUBSTRATES
09/08/2006WO2004114024A3 Exposure method and exposure apparatus
09/08/2006CA2563731A1 Vertical gallium nitride semiconductor device and epitaxial substrate
09/07/2006US20060199482 Pad conditioner for chemical mechanical polishing apparatus
09/07/2006US20060199480 Apparatus and method for feeding slurry
09/07/2006US20060199478 Substrate delivery mechanism
09/07/2006US20060199474 Systems including differential pressure application apparatus