Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2010
06/29/2010US7745307 Method of manufacturing an inkjet head through the anodic bonding of silicon members
06/29/2010US7745306 Method for producing bonded wafer
06/29/2010US7745305 Method of removing an oxide and method of filling a trench using the same
06/29/2010US7745304 Method of manufacturing semiconductor device
06/29/2010US7745303 Method of manufacturing a semiconductor device and the semiconductor device
06/29/2010US7745302 Method for making transmission electron microscope grid
06/29/2010US7745301 Methods and apparatus for high-density chip connectivity
06/29/2010US7745300 Method for forming a capacitor in a semiconductor and a capacitor using the same
06/29/2010US7745299 Semiconductor device and fabrication method thereof
06/29/2010US7745298 Method of forming a via
06/29/2010US7745297 Method of substrate with transparent electrodes and devices incorporating it
06/29/2010US7745296 Raised source and drain process with disposable spacers
06/29/2010US7745295 Methods of forming memory cells
06/29/2010US7745294 Methods of manufacturing trench isolated drain extended MOS (demos) transistors and integrated circuits therefrom
06/29/2010US7745293 Method for manufacturing a thin film transistor including forming impurity regions by diagonal doping
06/29/2010US7745292 Method for fabricating a semiconductor gate structure
06/29/2010US7745291 Method of fabricating a high-voltage transistor with an extended drain structure
06/29/2010US7745290 Methods of fabricating semiconductor device including fin-fet
06/29/2010US7745289 Method of forming a FET having ultra-low on-resistance and low gate charge
06/29/2010US7745288 Semiconductor device and a method of manufacturing the same
06/29/2010US7745287 Floating trap type nonvolatile memory device and method of fabricating the same
06/29/2010US7745286 Methods of forming semiconductor devices
06/29/2010US7745285 Methods of forming and operating NAND memory with side-tunneling
06/29/2010US7745284 Method of manufacturing flash memory device with conductive spacers
06/29/2010US7745283 Method of fabricating memory transistor
06/29/2010US7745282 Interconnect structure with bi-layer metal cap
06/29/2010US7745281 Thin solid electrolytic capacitor embeddable in a substrate
06/29/2010US7745280 Metal-insulator-metal capacitor structure
06/29/2010US7745279 Capacitor that includes high permittivity capacitor dielectric
06/29/2010US7745278 Selective implementation of barrier layers to achieve threshold voltage control in CMOS device fabrication with high K dielectrics
06/29/2010US7745277 MOSFET performance improvement using deformation in SOI structure
06/29/2010US7745276 Method for manufacturing SiC semiconductor device
06/29/2010US7745275 Integrated circuit and a method of making an integrated circuit to provide a gate contact over a diffusion region
06/29/2010US7745274 Gate self aligned low noise JFET
06/29/2010US7745273 Semiconductor device and method for forming same
06/29/2010US7745272 Method for surfaced-passivated zinc-oxide
06/29/2010US7745271 Method of manufacturing a semiconductor device
06/29/2010US7745270 Tri-gate patterning using dual layer gate stack
06/29/2010US7745269 Semiconductor device and manufacture method thereof
06/29/2010US7745267 Method of fabricating active layer of thin film transistor
06/29/2010US7745266 Method of forming a fuse part
06/29/2010US7745265 Method of making three dimensional NAND memory
06/29/2010US7745264 Semiconductor chip with stratified underfill
06/29/2010US7745263 System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices
06/29/2010US7745262 Heat dissipating package structure and method for fabricating the same
06/29/2010US7745261 Chip scale package fabrication methods
06/29/2010US7745260 Method of forming semiconductor package
06/29/2010US7745259 Layered chip package and method of manufacturing same
06/29/2010US7745258 Manufacturing method of semiconductor device
06/29/2010US7745257 High power MCM package with improved planarity and heat dissipation
06/29/2010US7745256 Rectangular-shaped controlled collapse chip connection
06/29/2010US7745255 Bonding pad structure, electronic device having a bonding pad structure and methods of fabricating the same
06/29/2010US7745253 Ribbon bonding in an electronic package
06/29/2010US7745252 Semiconductor device and manufacturing method thereof
06/29/2010US7745251 Method of fabricating CMOS image sensor
06/29/2010US7745248 Fabrication of capacitive micromachined ultrasonic transducers by local oxidation
06/29/2010US7745247 Solid-state image sensor and imaging system
06/29/2010US7745246 Method of fabricating light emitting device
06/29/2010US7745245 Semiconductor light emitting device
06/29/2010US7745244 Pin substrate and package
06/29/2010US7745243 Method for forming pixel structure of transflective liquid crystal display
06/29/2010US7745242 Method for fabricating liquid crystal display device
06/29/2010US7745241 Method of making light emitting diodes
06/29/2010US7745240 Manufacturing method of light-emitting element with surface layer removal
06/29/2010US7745239 Arrangement of fill unit elements in an integrated circuit interconnect layer
06/29/2010US7745238 Monitoring of temperature variation across wafers during processing
06/29/2010US7745237 Pattern forming method and pattern forming system
06/29/2010US7745236 Floating gate process methodology
06/29/2010US7745235 Method for manufacturing semiconductor sensor
06/29/2010US7745234 Method for reclaiming semiconductor package
06/29/2010US7745233 Ferroelectric capacitor and ferroelectric memory with Ir-Ru alloy electrode and method of manufacturing the same
06/29/2010US7745232 Semiconductor device and method of manufacturing the same
06/29/2010US7745231 Resistive memory cell fabrication methods and devices
06/29/2010US7745101 Nanoparticle patterning process
06/29/2010US7745093 Vinylimidazole-vinylpyrrolidone copolymer; amine sulfonate acid generator such asp-toluenesulfonic acid triethylamine salt; ethylene oxide adduct acetylenic glycol ether surfactant; and alkylated urea, oxazoline group-containing polymer, or polyamine curing agent;crosslinking, exposure to argon fluoride
06/29/2010US7745074 Mask blank substrate, mask blank, exposure mask, mask blank substrate manufacturing method, and semiconductor manufacturing method
06/29/2010US7745073 Method for manufacturing a semiconductor device, stencil mask and method for manufacturing a the same
06/29/2010US7745068 Improved resolution; a transmission-prevention pattern formed on substrate defining a circuit pattern; compensation layer configured to change light transmitted through the binaryphotomask based on the topology of the compensation layer; arranged on the transmission-prevention layer and/or substrate
06/29/2010US7744946 Organic siloxane resins and insulating film using the same
06/29/2010US7744802 Dielectric film with low coefficient of thermal expansion (CTE) using liquid crystalline resin
06/29/2010US7744771 Method for removing protective film on article
06/29/2010US7744769 etching gas COMPRISING HYPOFLUORITE WHICH DISSOCIATES MORE EASILY THAN, FOR EXAMPLE, EACH OF CF4, C2F6, C4F8, AND NF3
06/29/2010US7744768 Covering a surface of a resist pattern with a resin, a crosslinking agent, and an aromatic compound, an alicyclic compound, or a heterocyclic compound and pure water; heating to thicken; can be patterned by using ArF excimer laser, has a fine structure, and is excellent in etching resistance.
06/29/2010US7744735 Ionized PVD with sequential deposition and etching
06/29/2010US7744721 Plasma processing apparatus
06/29/2010US7744720 Suppressor of hollow cathode discharge in a shower head fluid distribution system
06/29/2010US7744718 Microsystem component and method for gluing microcomponents to a substrate
06/29/2010US7744698 Vaporizer for MOCVD and method of vaporizing raw material solutions for MOCVD
06/29/2010US7744666 abrasives; for wirings of semiconductor devices
06/29/2010US7744438 Production apparatus and method of producing a light-emitting device by using the same apparatus
06/29/2010US7744385 High speed cable termination electrical connector assembly
06/29/2010US7744327 Tubular handling apparatus and a drilling rig
06/29/2010US7744293 Coaxial opto-electronic device having small form factor insulating structure
06/29/2010US7743730 Apparatus for an optimized plasma chamber grounded electrode assembly
06/29/2010US7743728 Cluster tool architecture for processing a substrate
06/29/2010CA2489706C Die level testing using machine grooved storage tray with vacuum channels
06/29/2010CA2247777C A process for manufacturing microstructure bodies
06/24/2010WO2010071875A2 Cutting fluid composition for wiresawing
06/24/2010WO2010071873A2 Wiresaw cutting method
06/24/2010WO2010071870A2 Composition for improving dryness during wire sawing
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