Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2010
07/22/2010WO2010082267A1 Inside reforming substrate for epitaxial growth; crystal film forming element, device, and bulk substrate produced using the same; and method for producing the same
07/22/2010WO2010082264A1 Silicon carbide semiconductor device and method for producing silicon carbide semiconductor device
07/22/2010WO2010082251A1 Method for manufacturing semiconductor device
07/22/2010WO2010082250A1 Semiconductor device and method for manufacturing same
07/22/2010WO2010082249A1 Method for manufacturing semiconductor device
07/22/2010WO2010082248A1 Semiconductor device, electronic apparatus using same, and method for manufacturing semiconductor device
07/22/2010WO2010082238A1 Semiconductor integrated circuit and electronic information device
07/22/2010WO2010082109A2 Stray coating prevention device, coating chamber device for coating substrates, and method of coating
07/22/2010WO2010081966A1 Method for encapsulating a microcircuit and device thus obtained
07/22/2010WO2010081852A1 A test method on the support substrate of a substrate of the "semiconductor on insulator" type
07/22/2010WO2010081804A1 Process flow for directly contacting the metal gate on a high-k gate dielectric
07/22/2010WO2010081767A1 High-yield method of exposing and contacting through-silicon vias
07/22/2010WO2010081752A1 Sintered material, sintered bond and process for producing a sintered bond
07/22/2010WO2010081619A1 Suction device for soldering fumes for a microscope
07/22/2010WO2010081617A1 Chuck and method for receiving and holding thin test substrates
07/22/2010WO2010081616A1 Spacer and gate dielectric structure for programmable high-k/metal gate memory transistors integrated with logic transistors and method of forming the same
07/22/2010WO2010081603A1 Semiconductor circuit having interlayer connections and method for producing vertically integrated circuits
07/22/2010WO2010081445A1 Method for producing an optoelectronic component and optoelectronic component
07/22/2010WO2010081343A1 Endpoint control method and device of semiconductor etch process
07/22/2010WO2010081198A1 Solar cell methods and structures
07/22/2010WO2010065748A3 Method for producing patterned materials
07/22/2010WO2010065249A3 Methods of fabricating substrates
07/22/2010WO2010065204A3 Technique for manufacturing a solar cell
07/22/2010WO2010062644A3 Vertical group iii-v nanowires on si, heterostructures, flexible arrays and fabrication
07/22/2010WO2010062579A3 Process kit having reduced erosion sensitivity
07/22/2010WO2010059419A3 Method of forming a semiconductor layer
07/22/2010WO2010059300A3 Pyrometry for substrate processing
07/22/2010WO2010056769A3 Eddy current sensor with enhanced edge resolution
07/22/2010WO2010056615A3 Electron beam welding of large vacuum chamber body having a high emissivity coating
07/22/2010WO2010054623A3 Method for positioning and/or guiding at least one random processing head for the metallization of thin substrates at a defined distance above the substrate surface
07/22/2010WO2010054206A3 Improved process equipment architecture
07/22/2010WO2010054184A3 Chemical vapor deposition with elevated temperature gas injection
07/22/2010WO2010053804A3 Endpoint control of multiple-wafer chemical mechanical polishing
07/22/2010WO2010050679A3 Imprinting apparatus
07/22/2010WO2010048094A3 Pvd cu seed overhang re-sputtering with enhanced cu ionization
07/22/2010WO2010048076A3 Plasma source for chamber cleaning and process
07/22/2010WO2010047970A3 Method and apparatus for removing photoresist
07/22/2010WO2010045595A3 Method for improving process control and film conformality of pecvd films
07/22/2010WO2010045594A3 Flexible circuit assemblies without solder and methods for their manufacture
07/22/2010WO2010045237A3 Support for a semiconductor wafer in a high temperature environment
07/22/2010WO2010042927A3 Continuous feed chemical vapor deposition
07/22/2010WO2010042883A3 Concentric showerhead for vapor deposition
07/22/2010WO2010042509A3 Techniques for ion implantation of molecular ions
07/22/2010WO2010042494A3 Reduced implant voltage during ion implantation
07/22/2010WO2010042448A3 Scissor lift transfer robot
07/22/2010WO2010039444A3 Process/design methodology to enable high performance logic and analog circuits using a single process
07/22/2010WO2010038954A3 Transparent conductive film, and transparent electrode comprising same
07/22/2010WO2010036051A3 Structure and manufacture method for multi-row lead frame and semiconductor package
07/22/2010WO2010033904A3 Shutter disk for physical vapor deposition chamber
07/22/2010WO2010028136A8 Probe block assembly
07/22/2010WO2010025253A4 Load lock chamber for large area substrate processing system
07/22/2010WO2010016642A3 Apparatus measuring pressure of z-axis for wafer prober
07/22/2010WO2010008116A3 Method and chamber for inductively coupled plasma processing for cylinderical material with three-dimensional surface
07/22/2010WO2009086983A9 Reduction of watermarks in hf treatments of semiconducting substrates
07/22/2010WO2009078605A3 SIC MATERIAL COMPRISING COMBINATION OF α-SIC AND β-SIC AND TWO-PART PLASMA CHAMBER CATHODE MANUFACTURED USING THE SAME
07/22/2010US20100185410 Three dimensional chip fabrication
07/22/2010US20100185313 Pattern data creating method, computer program product, and semiconductor device manufacturing method
07/22/2010US20100184303 Method for revealing emergent dislocations in a germanium-base crystalline element
07/22/2010US20100184302 Method of Forming Conformal Dielectric Film Having Si-N Bonds by PECVD
07/22/2010US20100184301 Methods for Preventing Precipitation of Etch Byproducts During an Etch Process and/or Subsequent Rinse Process
07/22/2010US20100184300 Self-aligned masks using multi-temperature phase-change materials
07/22/2010US20100184299 Substrate processing method
07/22/2010US20100184298 Composite showerhead electrode assembly for a plasma processing apparatus
07/22/2010US20100184297 Method for protecting semiconductor wafer and process for producing semiconductor device
07/22/2010US20100184296 Semiconductor device manufacturing method, wafer treatment system, and recording medium
07/22/2010US20100184295 Multiple depth shallow trench isolation process
07/22/2010US20100184294 Method of Manufacturing a Semiconductor Device
07/22/2010US20100184293 Planarization process for pre-damascene structure including metal hard mask
07/22/2010US20100184292 Systems, methods and slurries for chemical-mechanical rough polishing of gaas wafers
07/22/2010US20100184291 Aqueous slurry composition for chemical mechanical polishing and chemical mechanical polishing method
07/22/2010US20100184290 Substrate support with gas introduction openings
07/22/2010US20100184289 Substrate and method of manufacturing the same
07/22/2010US20100184288 Method of forming pattern structure
07/22/2010US20100184287 Method of Forming Patterns of Semiconductor Device
07/22/2010US20100184286 Method for manufacturing semiconductor device
07/22/2010US20100184285 Method to prevent corrosion of bond pad structure
07/22/2010US20100184284 Method of Manufacturing Semiconductor Memory Device
07/22/2010US20100184283 Method of Manufacturing Flash Memory Device
07/22/2010US20100184282 Methods of manufacturing semiconductor memory devices
07/22/2010US20100184281 Method for treating layers of a gate stack
07/22/2010US20100184280 Method of forming metal ion transistor
07/22/2010US20100184279 Method of Making an Epitaxial Structure Having Low Defect Density
07/22/2010US20100184278 Method for epitaxial growth
07/22/2010US20100184277 Method of fabricating semiconductor device
07/22/2010US20100184276 Low-temperature formation of polycrystalline semiconductor films via enhanced metal-induced crystallization
07/22/2010US20100184275 Semiconductor device and method for manufacturing the same
07/22/2010US20100184274 Method for manufacturing a transistor with parallel semiconductor nanofingers
07/22/2010US20100184273 Group iii nitride compound semiconductor device
07/22/2010US20100184272 Semiconductor die singulation method
07/22/2010US20100184271 Laser processing method and chip
07/22/2010US20100184270 Method for Producing Bonded Wafer
07/22/2010US20100184269 Method for manufacturing soi substrate and semiconductor device
07/22/2010US20100184268 Method for producing a semiconductor device having a portion in which a groove is embedded with an oxide film
07/22/2010US20100184267 Method of forming silicon oxide film and method of production of semiconductor memory device using this method
07/22/2010US20100184266 method of manufacturing a non-volatile nand memory semiconductor integrated circuit
07/22/2010US20100184265 Methods for fabricating semiconductor devices minimizing under-oxide regrowth
07/22/2010US20100184264 Manufacturing method of semiconductor power devices
07/22/2010US20100184263 Methods of fabricating flash memory devices having shared sub active regions
07/22/2010US20100184262 High electron mobility transistor having self-aligned miniature field mitigating plate and protective dielectric layer and fabrication method thereof
07/22/2010US20100184261 Semiconductor device and method for manufacturing the same