Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2010
07/21/2010CN101785086A Display device manufacturing method and laminated structure
07/21/2010CN101785085A Method for handling a semiconductor wafer assembly
07/21/2010CN101784958A Photosensitive composition, cured film formed therefrom, and device having cured film
07/21/2010CN101784466A Holding means, device and method for transporting substrates, in particular printed circuit boards
07/21/2010CN101784181A Apparatus for supplying electronic parts and chip mounter having the same
07/21/2010CN101784156A Circuit board and preparation method thereof
07/21/2010CN101783397A Organic el device manufacture apparatus, deposition apparatus and deposition method thereof, liquid crystal display manufacture apparatus, alignment apparatus and alignment method
07/21/2010CN101783394A Method for carrying out Fermi energy level modification on top electrode
07/21/2010CN101783380A Method for manufacturing light emitting diode package and package structure thereof
07/21/2010CN101783378A Lighting element with patterned surface
07/21/2010CN101783372A Manufacturing method of two-section type solar battery
07/21/2010CN101783368A Semiconductor device, method for manufacturing the same, and electronic device having the same
07/21/2010CN101783367A Nanowire MOS transistor based on III-V element and preparation method thereof
07/21/2010CN101783366A Preparation method of graphene MOS transistor
07/21/2010CN101783365A Transistor with wire source and drain
07/21/2010CN101783364A Nano electronic part and production method thereof
07/21/2010CN101783363A Organic bipolar transistor and preparation method thereof
07/21/2010CN101783362A Upper cover structure, packaging structure of luminous element and packaging method for luminous element
07/21/2010CN101783357A Integrated circuit memory with single crystal silicon on silicide driver and manufacturing method
07/21/2010CN101783353A Array substrate and method of manufacturing the same
07/21/2010CN101783352A Nonvolatile memory and design method thereof
07/21/2010CN101783351A Flash memory device and manufacturing method the same
07/21/2010CN101783350A Flash memory device and manufacturing method the same
07/21/2010CN101783349A Data storage structure, memory device and process for fabricating memory device
07/21/2010CN101783348A Semiconductor memory device and method of manufacturing the same
07/21/2010CN101783346A Charged balanced devices with shielded gate trench
07/21/2010CN101783345A Grooved semiconductor rectifier and manufacturing method thereof
07/21/2010CN101783342A BGA (ball grid array) integrated resistor as well as manufacturing method and equipment thereof
07/21/2010CN101783335A Semiconductor device
07/21/2010CN101783334A Packaging carrier plate structure and realizing method thereof
07/21/2010CN101783332A Circuit board and preparation process thereof
07/21/2010CN101783331A System-in-package structure and package method
07/21/2010CN101783329A Semiconductor component and manufacturing method thereof
07/21/2010CN101783325A Method for forming flash memory
07/21/2010CN101783324A CMOS (complementary metal-oxide-semiconductor) transistor and manufacturing method thereof
07/21/2010CN101783323A CMOS (complementary metal-oxide-semiconductor) transistor and manufacturing method thereof
07/21/2010CN101783322A CMOS (complementary metal-oxide-semiconductor) transistor and manufacturing method thereof
07/21/2010CN101783321A Method for manufacturing solid-state image device
07/21/2010CN101783320A Method for fabricating of cmos image sensor
07/21/2010CN101783319A Dual metal for a backside package of backside illuminated image sensor
07/21/2010CN101783318A Method and structure for reducing cross-talk in image sensor devices
07/21/2010CN101783317A Process for fabricating crown capacitors of dram and capacitor structure
07/21/2010CN101783316A Method of implantation
07/21/2010CN101783315A Method for forming interlayer contact
07/21/2010CN101783314A Method of forming an isolation structure and corresponding device
07/21/2010CN101783313A Shallow groove, manufacturing method thereof and shallow groove isolation structure
07/21/2010CN101783312A Method for manufacturing shallow groove isolation structure
07/21/2010CN101783311A Substrate holder unit and subtrate assembling appartus having the same
07/21/2010CN101783310A Method and apparatus for repairing an electrostatic chuck device, and the electrostatic chuck device
07/21/2010CN101783309A Silicon wafer side-by-side convey mechanism
07/21/2010CN101783308A Storage machine station of combined wafer storage box
07/21/2010CN101783307A On-line continuous buffer of semiconductor packaging system
07/21/2010CN101783306A System and method for inspecting a wafer
07/21/2010CN101783305A Probe device
07/21/2010CN101783304A Manufacturing method of semiconductor device
07/21/2010CN101783303A Laser bonding for stacking semiconductor substrates
07/21/2010CN101783302A Method for forming pre-welding material of packaging base plate
07/21/2010CN101783301A Heterogeneous material bonding method
07/21/2010CN101783300A Production method of copper alloy irregularly-shaped copper strip for electronic lead frame
07/21/2010CN101783299A MOS (Metal Oxide Semiconductor) formation method and threshold voltage adjustment method thereof
07/21/2010CN101783298A Method for inhibiting growth of high-k gate dielectric/metal gate structure interface layer
07/21/2010CN101783297A UMOS and production method thereof
07/21/2010CN101783296A Forming method of grid electrode side wall layer
07/21/2010CN101783295A High-voltage LDMOS device and manufacturing method thereof
07/21/2010CN101783294A Production method of semiconductor element
07/21/2010CN101783293A Aluminum pad etching method
07/21/2010CN101783292A Method for reworking metal layer
07/21/2010CN101783291A Method for manufacturing stacked film
07/21/2010CN101783290A Method for forming a patterned thick metallization atop a power semiconductor chip
07/21/2010CN101783289A Preparation method of inverse epitaxial wafer
07/21/2010CN101783288A Epitaxially coated silicon wafer and method for producing epitaxially coated silicon wafers
07/21/2010CN101783287A Method for bonding two materials
07/21/2010CN101783286A Method for manufacturing capacitor of metal-insulator-metal structure
07/21/2010CN101783285A Methods for processing wafer surfaces using thin, high velocity fluid layer
07/21/2010CN101783284A Silicon carbide substrate, epitaxial wafer and manufacturing method of silicon carbide substrate
07/21/2010CN101783283A Handling device and electronic component testing system
07/21/2010CN101783282A Monitoring circuit, monitoring device and monitoring method thereof
07/21/2010CN101783281A Plasma etching device and etching method of grid electrode
07/21/2010CN101783280A Cleaning method of semiconductor board
07/21/2010CN101783279A Method for spearing two materials
07/21/2010CN101781797A Method and system for low temperature ion implantation
07/21/2010CN101781526A Chemical polishing solution used for GaAs chip and chemical polishing method
07/21/2010CN101781525A Wafer rough polishing solution
07/21/2010CN101781524A Wafer precise polishing solution
07/21/2010CN101781523A Shallow groove isolation polishing solution
07/21/2010CN101781522A Dielectric layer polishing solution
07/21/2010CN101780946A Method for preparing ZnSe nano wire films by pulsed laser ablation deposition
07/21/2010CN101780659A Clamp ring cleaning protection and measuring jigs
07/21/2010CN101552203B Method for fixing ZnO nanometer wire in preparation of ZnO nanometer wire field effect tube
07/21/2010CN101527267B Metallic packaging shell sintering method for controlling consistency of lead height
07/21/2010CN101494174B Image acquisition die set and method for forming same
07/21/2010CN101416287B Technique for providing stress sources in transistors in close proximity to a channel region by recessing drain and source regions
07/21/2010CN101405863B Semiconductor devices and electrical parts manufacturing using metal coated wires
07/21/2010CN101399196B Coarsening processing method for backing side of wafer
07/21/2010CN101397689B Removal method of oil, wax and residual gum on diode surface
07/21/2010CN101378025B Technique test method for chip and wafer, and integrated circuit structure
07/21/2010CN101378024B Method for detecting wafer defect
07/21/2010CN101371338B Method for fabricating and separating semiconductor devices
07/21/2010CN101355043B Encapsulation body for electronic element and preparation method thereof
07/21/2010CN101355030B Method for manufacturing memory, memory device as well as method for operating and accessing the memory device
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