| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 09/30/2010 | US20100243605 Etching method, etching apparatus, computer program and storage medium |
| 09/30/2010 | US20100243471 Composition, method and process for polishing a wafer |
| 09/30/2010 | US20100243470 Plasma treatment apparatus and plasma treatment method |
| 09/30/2010 | US20100243462 Methods for Activating Openings for Jets Electroplating |
| 09/30/2010 | US20100243414 Horizontal Micro-Electro-Mechanical-System Switch |
| 09/30/2010 | US20100243167 Substrate processing apparatus |
| 09/30/2010 | US20100243166 Gas flow path structure and substrate processing apparatus |
| 09/30/2010 | US20100243164 Replaceable upper chamber section of plasma processing apparatus |
| 09/30/2010 | US20100243163 Substrate processing apparatus |
| 09/30/2010 | US20100243161 Pitch multiplied mask patterns for isolated features |
| 09/30/2010 | US20100243048 Metal pastes and use thereof in the production of silicon solar cells |
| 09/30/2010 | US20100243036 Method for Fabricating a Photovolataic Element with Stabilised Efficiency |
| 09/30/2010 | US20100242844 Holder for semiconductor manufacturing equipment |
| 09/30/2010 | US20100242833 AlN Crystal and Method of Its Growth |
| 09/30/2010 | US20100242618 Semiconductor pressure sensor and method of producing the same |
| 09/30/2010 | US20100242602 Process for fabricating a capacitance type tri-axial accelerometer |
| 09/30/2010 | US20100242600 Vertically integrated mems acceleration transducer |
| 09/30/2010 | US20100242374 Polishing Composition and Polishing Method |
| 09/30/2010 | US20100242270 Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module |
| 09/30/2010 | DE202010005719U1 Chipkarte mit integriertem Schaltkreis Smart card integrated circuit |
| 09/30/2010 | DE19724222B4 Dram Dram |
| 09/30/2010 | DE112009000009T5 Verfahren zum Verbinden elektrischer Vorrichtungen durch Anpassung der Erwärmungstemperatur eines Klebstoffs und Vorrichtung zum Verbinden elektrischer Vorrichtungen durch Anpassung der Erwärmungstemperatur eines Klebstoffs A method for connecting electrical devices by adjusting the heating temperature of an adhesive and apparatus for connecting electrical devices by adjusting the heating temperature of an adhesive |
| 09/30/2010 | DE112008000172T5 Elektrodentrennverfahren und Vorrichtung auf Nanodrahtbasis mit getrenntem Elektrodenpaar Electrode separation processes and apparatus nanowire-based with separate pair of electrodes |
| 09/30/2010 | DE112006002952B4 Verfahren zur Herstellung von Halbleiteranordnungen mit Spacern A process for producing semiconductor devices with spacers |
| 09/30/2010 | DE10228530B4 Halbleiterwafer-Zerteilverfahren A semiconductor wafer dicing |
| 09/30/2010 | DE102010000539A1 Halbleiteranordnung Semiconductor device |
| 09/30/2010 | DE102009024411A1 Dünnschichtverkapselung für ein optoelektronisches Bauelement, Verfahren zu dessen Herstellung und optoelektronisches Bauelement Thin-film encapsulation for an optoelectronic component, to processes for its preparation and optoelectronic component |
| 09/30/2010 | DE102009015063A1 Verfahren zum Aufbringen einer Zn(S, O)-Pufferschicht auf ein Halbleitersubstrat mittels chemischer Badabscheidung A method for applying a Zn (S, O) buffer layer on a semiconductor substrate by chemical bath deposition |
| 09/30/2010 | DE102009014507A1 Verfahren zur Bildung eines elektrischen Kontakts zwischen einem Trägerwafer und der Oberfläche einer oberen Siliziumschicht eines Silizium-auf-Isolator-Wafers und elektrische Vorrichtung mit einem solchen elektrischen Kontakt A method of forming an electrical contact between a carrier wafer and the surface of an upper silicon layer of a silicon-on-insulator wafer, and electrical apparatus comprising such an electrical contact |
| 09/30/2010 | DE102009013921B3 Verfahren zur Herstellung einer Metallisierung für mindestens ein Kontaktpad und Halbleiterwafer mit Metallisierung für mindestens ein Kontaktpad A method of producing a metallization for at least one contact pad and the semiconductor wafer having metallization for at least one contact pad |
| 09/30/2010 | DE102009005458B4 Halbleiterbauelement mit Durchkontaktierung und Verfahren zu dessen Herstellung A semiconductor device having through-hole plating and process for its preparation |
| 09/30/2010 | DE102009001932A1 Chipmodul und Verfahren zur Herstellung eines Chipmoduls Chip module and method of producing a chip module, |
| 09/30/2010 | DE102009001919A1 Verfahren zum Herstellen einer Mehrzahl von integrierten Halbleiterbauelementen A method of manufacturing a plurality of integrated semiconductor components |
| 09/30/2010 | DE102006033319B4 Verfahren zur Herstellung eines Halbleiterbauelements in Halbleiterchipgröße mit einem Halbleiterchip A process for producing a semiconductor device in the semiconductor chip size of a semiconductor chip |
| 09/30/2010 | DE102006013853B4 Leistungshalbleiterbauelement mit großflächigen Außenkontakten sowie Verfahren zur Herstellung desselben Power semiconductor component thereof with outer contacts, as well as large-scale process for preparing |
| 09/30/2010 | DE102006003605B4 Verfahren zum Materialabtrag an Si-Festkörpern und dessen Verwendung Method for removing material from Si-solids and its use |
| 09/30/2010 | DE102006002753B4 Verfahren und Anordnung zur Bewertung der Unterätzung von tiefen Grabenstrukturen in SOI-Scheiben Method and apparatus for evaluating the undercutting of deep grave structures in SOI wafers |
| 09/30/2010 | DE102005055853B4 Auswahltransistor-Feld, Halbleiterspeicherbauelement und Verfahren zum Herstellen eines Auswahltransistor-Feldes Selection transistor array, semiconductor memory device and method for producing a selection transistor array |
| 09/30/2010 | DE102005030583B4 Verfahren zur Herstellung von Kontaktisolationsschichten und Silizidgebieten mit unterschiedlichen Eigenschaften eines Halbleiterbauelements und Halbleiterbauelement A process for the production of contact insulating layers and silicide having different characteristics of a semiconductor device and semiconductor device |
| 09/30/2010 | DE102005009024B4 Verfahren und System zum Steuern einer vertikalen Substratposition in einem elektrochemischen Prozess zur Herstellung von mikrostrukturierten integrierten Schaltungen A method and system for controlling a vertical position of substrate in an electrochemical process for the production of integrated circuits microstructured |
| 09/30/2010 | DE10019472B4 Reinigungsvorrichtung Cleaning device |
| 09/30/2010 | CA2756509A1 Device and method to conduct an electrochemical reaction on a surface of a semiconductor substrate |
| 09/30/2010 | CA2738385A1 Mosfet and method for manufacturing mosfet |
| 09/30/2010 | CA2736950A1 Mosfet and method for manufacturing mosfet |
| 09/29/2010 | EP2234463A1 Plasma treatment apparatus, heating device for the plasma treatment apparatus, and plasma treatment method |
| 09/29/2010 | EP2234163A1 Semiconductor device and method of manufacturing the device, and method of manufacturing trench gate |
| 09/29/2010 | EP2234150A2 Semiconductor device and production method therefor |
| 09/29/2010 | EP2234149A1 System and process for conveying workpieces into a chamber |
| 09/29/2010 | EP2234148A1 Method and apparatus for mounting electric component |
| 09/29/2010 | EP2234147A2 Method of fabricating resin-sealed semiconductor devices |
| 09/29/2010 | EP2234146A2 Method for producing a number of integrated semiconductor components |
| 09/29/2010 | EP2234145A1 Etching agent, etching method and liquid for preparing etching agent |
| 09/29/2010 | EP2234144A1 Method for manufacturing a power semiconductor device |
| 09/29/2010 | EP2234143A1 A system and process for processing the substrate in the chamber |
| 09/29/2010 | EP2234142A1 Nitride semiconductor substrate |
| 09/29/2010 | EP2234141A1 Illumination optical system, exposure apparatus, and device manufacturing method |
| 09/29/2010 | EP2234119A1 Copper conductor film and manufacturing method thereof, conductive substrate and manufacturing method thereof, copper conductor wiring and manufacturing method thereof, and treatment solution |
| 09/29/2010 | EP2234115A1 Method for manufacturing a memory device with conductive nanoparticles |
| 09/29/2010 | EP2233978A1 Composition for formation of anti-reflective film, and pattern formation method using the composition |
| 09/29/2010 | EP2233977A1 Composition for formation of top antireflective film, and pattern formation method using the composition |
| 09/29/2010 | EP2233975A2 Photomask blank, processing method, and etching method |
| 09/29/2010 | EP2233960A1 Spatial light modulating unit, illumination optical system, aligner, and device manufacturing method |
| 09/29/2010 | EP2233914A1 Carrier concentration measuring device and carrier concentration measuring method |
| 09/29/2010 | EP2233615A2 Metal nano-objects, formed on semiconductor surfaces, and methods for making said nano-objects |
| 09/29/2010 | EP2233612A1 Electrolytic method |
| 09/29/2010 | EP2232958A2 Asymmetrical rf drive for electrode of plasma chamber |
| 09/29/2010 | EP2232943A1 Heater block of rapid thermal process apparatus |
| 09/29/2010 | EP2232561A1 Manufacturing method of thin film transistor and manufacturing method of display device |
| 09/29/2010 | EP2232560A2 Power transistor with protected channel |
| 09/29/2010 | EP2232549A2 3-d semiconductor die structure with containing feature and method |
| 09/29/2010 | EP2232547A2 Integrated circuit system with contact integration |
| 09/29/2010 | EP2232546A1 A method of fabricating epitaxially grown layers on a composite structure |
| 09/29/2010 | EP2232545A2 A method of fabricating a composite structure with a stable bonding layer of oxide |
| 09/29/2010 | EP2232543A2 Thermal mechanical flip chip die bonding |
| 09/29/2010 | EP2232541A1 Method for manufacturing a microelectronic package comprising at least one microelectronic device |
| 09/29/2010 | EP2232540A2 Method of forming a thermo pyrolytic graphite-embedded heatsink |
| 09/29/2010 | EP2232539A2 Methods for isolating portions of a loop of pitch-multiplied material and related structures |
| 09/29/2010 | EP2232538A1 Spatial phase feature location |
| 09/29/2010 | EP2232536A1 Method for fabricating a power semiconductor device having a voltage sustaining layer with a terraced trench facilitating formation of floating islands |
| 09/29/2010 | EP2232535A2 Droplet actuator configurations and methods |
| 09/29/2010 | EP2232534A1 Process of treating defects during the bonding of wafers |
| 09/29/2010 | EP2232533A1 High aspect ratio holes or trenches |
| 09/29/2010 | EP2232532A2 Method for local etching of the surface of a substrate |
| 09/29/2010 | EP2232531A1 Method for making structures with improved edge definition |
| 09/29/2010 | EP2232530A1 Method for forming high density patterns |
| 09/29/2010 | EP2232528A2 Methods for formation of substrate elements |
| 09/29/2010 | EP2232526A2 Method and device for treating silicon wafers |
| 09/29/2010 | EP2232314A1 Method for obtaining a structured material with through openings, in particular nitrides of type iii semiconductors structured according to photonic crystal patterns |
| 09/29/2010 | EP2231903A1 Composite coatings for whisker reduction |
| 09/29/2010 | EP2231898A2 Methods for in-situ chamber cleaning process for high volume manufacture of semiconductor materials |
| 09/29/2010 | EP1876270B1 Method for growth of GaN single crystals |
| 09/29/2010 | EP1875523B1 Nitride semiconductor component and method for the production thereof |
| 09/29/2010 | EP1654767B1 Transition metal alloys for use as a gate electrode and devices incorporating these alloys |
| 09/29/2010 | EP1597769B1 Semiconductor device and method of manufacturing such a device |
| 09/29/2010 | EP1520298B1 Integrated circuit having building blocks |
| 09/29/2010 | EP1479025B1 Methods and apparatus for semiconductor testing |
| 09/29/2010 | EP1290732B1 Method for producing a field effect transistor having a floating gate |
| 09/29/2010 | CN201594534U Automatic conveying device for transshipping quartz boat |
| 09/29/2010 | CN201594533U Gas circulating type electronic shelf for placing light cover storage box |
| 09/29/2010 | CN201594532U Full packing die of semiconductor device with retractable locating needles by extruding plastic package material |