Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2010
09/30/2010WO2010082900A3 System and method for inspecting a wafer
09/30/2010WO2010080590A3 High temperature electrostatic chuck bonding adhesive
09/30/2010WO2010080296A3 Lateral mosfet with substrate drain connection
09/30/2010WO2010078565A3 Magnet bar support system
09/30/2010WO2010078340A3 Semiconductor devices including dual gate structures and methods of forming such semiconductor devices
09/30/2010WO2010078204A3 Quantum well mosfet channels having uni-axial strain caused by metal source/drains, and conformal regrowth source/drains
09/30/2010WO2010078058A3 Method of forming a pattern on a work piece, method of shaping a beam of electromagnetic radiation for use in said method, and aperture for shaping a beam of electromagnetic radiation
09/30/2010WO2010068055A3 Planar gate-controlled element and method for fabricating the same
09/30/2010WO2010067284A3 Method and system for centering wafer on chuck
09/30/2010WO2010065070A3 Electrostatic chuck
09/30/2010WO2009102520A9 Microcrystalline silicon thin film transistor
09/30/2010US20100249993 Substrate processing apparatus and substrate transport method
09/30/2010US20100249986 Method for appointing orientation flat, apparatus for detecting orientation flat, and program for appointing orientation flat
09/30/2010US20100249980 Exposure system, method of testing exposure apparatus, and method of manufacturing device
09/30/2010US20100249160 Cancer Treatment Method
09/30/2010US20100248597 Equipment and method for cleaning polishing cloth
09/30/2010US20100248499 Enhanced efficiency growth processes based on rapid thermal processing of gallium nitride films
09/30/2010US20100248498 Material stripping in semiconductor devices by evaporation
09/30/2010US20100248497 Methods and apparatus for forming nitrogen-containing layers
09/30/2010US20100248496 Rotatable and tunable heaters for semiconductor furnace
09/30/2010US20100248495 Silicon etching liquid and etching method
09/30/2010US20100248494 Method of cleaning semiconductor wafers
09/30/2010US20100248493 Photomask blank, processing method, and etching method
09/30/2010US20100248492 Method of forming patterns of semiconductor device
09/30/2010US20100248491 Method for fabricating semiconductor device using a double patterning process
09/30/2010US20100248490 Method and apparatus for reduction of voltage potential spike during dechucking
09/30/2010US20100248489 Plasma processing apparatus and plasma processing method
09/30/2010US20100248488 Pulsed plasma high aspect ratio dielectric process
09/30/2010US20100248487 Method and apparatus for elimination of micro-trenching during etching of a hardmask layer
09/30/2010US20100248486 Solution for removing residue after semiconductor dry process and method of removing the residue using the same
09/30/2010US20100248485 Method for dielectric material removal between conductive lines
09/30/2010US20100248484 Methods of Forming Printable Integrated Circuit Devices and Devices Formed Thereby
09/30/2010US20100248483 Method of producing semiconductor element
09/30/2010US20100248482 Method of manufacturing semiconductor device, template, and method of creating pattern inspection data
09/30/2010US20100248481 Cad flow for 15nm/22nm multiple fine grained wimpy gate lengths in sit gate flow
09/30/2010US20100248480 Chemical mechanical polishing compositions for copper and associated materials and method of using same
09/30/2010US20100248479 Cmp method
09/30/2010US20100248478 Method of processing a surface of group iii nitride crystal and group iii nitride crystal substrate
09/30/2010US20100248477 Cleaning liquid used in process for forming dual damascene structure and a process for treating a substrate therewith
09/30/2010US20100248476 Method of manufacturing semiconductor device
09/30/2010US20100248475 Method of fabricating a semiconductor device
09/30/2010US20100248474 Method of forming coating-type film
09/30/2010US20100248473 Selective deposition of metal-containing cap layers for semiconductor devices
09/30/2010US20100248472 Methods Of Forming Copper-Comprising Conductive Lines In The Fabrication Of Integrated Circuitry
09/30/2010US20100248471 Method of fabricating semiconductor device
09/30/2010US20100248470 Method of manufacturing semiconductor device
09/30/2010US20100248469 Semiconductor device and method of fabricating the same
09/30/2010US20100248468 Method and structure for performing a chemical mechanical polishing process
09/30/2010US20100248467 Method for fabricating nonvolatile memory device
09/30/2010US20100248466 Method for making a stressed non-volatile memory device
09/30/2010US20100248465 Methods of fabricating silicon oxide layers using inorganic silicon precursors and methods of fabricating semiconductor devices including the same
09/30/2010US20100248464 METHOD FOR FORMING A HIGH-k GATE STACK WITH REDUCED EFFECTIVE OXIDE THICKNESS
09/30/2010US20100248463 Enhancing adhesion of interlayer dielectric materials of semiconductor devices by suppressing silicide formation at the substrate edge
09/30/2010US20100248462 Method for manufacturing a power semiconductor device
09/30/2010US20100248461 Method of growing GaN using CVD and HVPE
09/30/2010US20100248460 Method of forming information storage pattern
09/30/2010US20100248459 Method for fabricating semiconductor device
09/30/2010US20100248458 Coating apparatus and coating method
09/30/2010US20100248457 Method of forming nonvolatile memory device
09/30/2010US20100248456 Method of manufacturing semiconductor device
09/30/2010US20100248455 Manufacturing method of group III nitride semiconductor
09/30/2010US20100248454 Method of forming fin structures using a sacrificial etch stop layer on bulk semiconductor material
09/30/2010US20100248453 Semiconductor device and manufacturing method of the same
09/30/2010US20100248452 Adhesive, adhesive sheet, multi-layered adhesive sheet, and production method for electronic part
09/30/2010US20100248451 Method for Laser Singulation of Chip Scale Packages on Glass Substrates
09/30/2010US20100248450 Method of producing semiconductor device
09/30/2010US20100248449 Metal-Assisted Chemical Etching of Substrates
09/30/2010US20100248448 Method of manufacturing semiconductor devices
09/30/2010US20100248447 Method for producing a bonded wafer
09/30/2010US20100248446 Method and apparatus of holding a device
09/30/2010US20100248445 Method for manufacturing semiconductor substrate
09/30/2010US20100248444 Method for manufacturing soi substrate
09/30/2010US20100248443 Method of integrating an air gap structure with a substrate
09/30/2010US20100248442 Methods of forming a phase change memory device
09/30/2010US20100248441 Multi-bit high-density memory device and architecture and method of fabricating multi-bit high-density memory devices
09/30/2010US20100248440 Nitride removal while protecting semiconductor surfaces for forming shallow junctions
09/30/2010US20100248439 Method of fabricating non-volatile memory device having vertical structure
09/30/2010US20100248438 Semiconductor device and method of fabricating the same
09/30/2010US20100248437 Methods of forming recessed gate structures including blocking members, and methods of forming semiconductor devices having the recessed gate structures
09/30/2010US20100248436 Methods of forming insulation layer patterns and methods of manufacturing semiconductor devices including insulation layer patterns
09/30/2010US20100248435 Method of selective nitridation
09/30/2010US20100248434 Method for Fabricating Semiconductor Device
09/30/2010US20100248433 Method for Manufacturing Thin Film Transistor
09/30/2010US20100248432 Methods of forming a hyper-abrupt p-n junction and design structures for an integrated circuit
09/30/2010US20100248431 Method for manufacturing nonvolatile storage device
09/30/2010US20100248430 High Frequency Flip Chip Package Process of Polymer Substrate and Structure thereof
09/30/2010US20100248429 Method for manufacturing semiconductor modules
09/30/2010US20100248428 Manufacturing method for semiconductor device
09/30/2010US20100248427 Method of handling a thin wafer
09/30/2010US20100248426 Method of making chip-on-lead package
09/30/2010US20100248425 Chip-size-package semiconductor chip and manufacturing method
09/30/2010US20100248424 Self-Aligned Chip Stacking
09/30/2010US20100248423 Delivery device comprising gas diffuser for thin film deposition
09/30/2010US20100248422 Method of manufacturing nonvolatile memory device
09/30/2010US20100248415 Semitransparent flexible thin film solar cells and modules
09/30/2010US20100248414 Method of wafer bonding
09/30/2010US20100248413 Monolithic Integration of Photovoltaic Cells
09/30/2010US20100248408 Method of texturing solar cell and method of manufacturing solar cell
09/30/2010US20100248407 Method for producing group III nitride-based compound semiconductor device
09/30/2010US20100248406 Nitride semiconductor laser element
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