Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2010
10/06/2010EP2235746A1 Microdevice fabrication
10/06/2010EP2235743A1 Two-dimensional patterning employing self-assembled material
10/06/2010EP2235742A2 Process for the production of microelectromechanical systems
10/06/2010EP2235741A1 Processing of electric and/or electronic elements on cellulosic material substrates
10/06/2010EP2235740A1 Method and apparatus for a radiation detector
10/06/2010EP2235592A2 Lithography robustness monitor
10/06/2010EP2235238A1 Method for producing group iii nitride-based compound semiconductor, wafer including group iii nitride-based compound semiconductor, and group iii nitride-based compound semiconductor device
10/06/2010EP2234685A2 Compositions and methods containing fluorine substituted olefins
10/06/2010EP1936695B1 Silicon carbide semiconductor device
10/06/2010EP1402316B1 Mask repair with electron beam-induced chemical etching
10/06/2010EP1305743B1 Method for the surface optimisation of components in integrated circuits
10/06/2010EP1050888B1 Conductive paste, conductive structure using the same, electronic part, module, circuit board, method for electrical connection, method for manufacturing circuit board, and method for manufacturing ceramic electronic part
10/06/2010CN201601119U 一种晶圆存储盒存储及传输系统 One kind of wafer storage box storage and transmission systems
10/06/2010CN201601118U 一种ic填装机 One kind ic filling machine
10/06/2010CN201601117U 多芯片植球装置 Multi-chip bumping device
10/06/2010CN201601116U 一种pop封装器件的贴片装置 SMD apparatus pop packaged devices
10/06/2010CN201601115U 半导体元件封装设备 The semiconductor element encapsulation device
10/06/2010CN201601114U 半导体封装产品打印防反装置 Semiconductor packaging products printing anti-anti device
10/06/2010CN201597127U 具有成像光源的晶圆劈裂压板 Splitting wafer platen having an imaging light source
10/06/2010CN1976913B Lactone compounds, lactone-containing monomers, their polymers, resist compositions using same, and processes for forming patterns using same
10/06/2010CN1973064B One hundred millimeter high purity semi-insulating single crystal silicon carbide wafer
10/06/2010CN1969391B Semiconductor on insulator semiconductor device and method of manufacture
10/06/2010CN1953239B Method of manufacturing organic el element, organic el element, and organic el display device
10/06/2010CN1926679B Method of reducing sti divot formation during semiconductor device fabrication
10/06/2010CN1926260B Sputtering target with few surface defects and method for processing surface thereof
10/06/2010CN1900725B Lithographic contact elements
10/06/2010CN1891761B Crosslinkable elastomer composition and formed product comprising the same
10/06/2010CN1888966B Active element array substrate and method for producing colour filtering substrate
10/06/2010CN1879177B NROM flash memory transistor and its manufacture method, NROM flash array, electronic system
10/06/2010CN1873932B Method for manufacturing semiconductor device
10/06/2010CN1813223B Compositions suitable for removing photoresist, photoresist byproducts and etching residue, and use thereof
10/06/2010CN1808268B Metal hard mask method and structure for strained silicon MOS transistor
10/06/2010CN1808266B Optical mask and manufacturing method of thin film transistor array panel using the optical mask
10/06/2010CN1800446B Delivery device
10/06/2010CN1797772B Operating method of charge-trapping memory elements and charge plunged IC
10/06/2010CN1769349B Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts
10/06/2010CN1759135B Organic siloxane resins and insulating film using the same
10/06/2010CN1731278B EUV magnetic contrast lithography mask and manufacture thereof
10/06/2010CN1725933B Wired circuit forming board, wired circuit board, and thin metal layer forming method
10/06/2010CN1721993B System and method for moving an object employing piezo actuators
10/06/2010CN1684244B Method of manufacturing a semiconductor device having damascene structures with air gaps
10/06/2010CN1682354B Polishing compound composition, method for producing same and polishing method
10/06/2010CN1674259B Trench capacitors with insulating layer collars in undercut regions and method of fabricating the same
10/06/2010CN1671273B Device with through-hole interconnection and method for manufacturing the same
10/06/2010CN1669121B Transfer mask for exposure and pattern exchanging method of the same
10/06/2010CN1669118B Method of protecting semiconductor device and protection apparatus for semiconductor device using the same
10/06/2010CN1632942B Technique for porous filling damascene using light sensitive material
10/06/2010CN1591192B Lithographic apparatus and device manufacturing method
10/06/2010CN1577108B Safety mechanism for a lithographic patterning device
10/06/2010CN1575525B Semiconductor device manufacturing method, thin film transistor array panel and method for manufacturing same
10/06/2010CN1515018B Plasma processor
10/06/2010CN1449017B Integrated circuit macro-module layout design based on module deformation
10/06/2010CN101855947A Plasma treatment device
10/06/2010CN101855946A Plasma processing apparatus and method for adjusting plasma density distribution
10/06/2010CN101855740A Process for production of desubstituted compounds, organic semiconductor film and process for production of the film
10/06/2010CN101855734A Semiconductor light emitting device
10/06/2010CN101855726A Power semiconductor devices with mesa structures and buffer layers including mesa steps
10/06/2010CN101855721A Semiconductor structure and method of manufacture
10/06/2010CN101855720A Alignment device and method to align plates for electronic circuits
10/06/2010CN101855719A Load lock apparatus and substrate cooling method
10/06/2010CN101855718A Transport system with buffering
10/06/2010CN101855717A Inline-type wafer conveyance device
10/06/2010CN101855716A Retainer and substrate storing container
10/06/2010CN101855715A Method and apparatus for deriving an iso-dense bias and controlling a fabrication process
10/06/2010CN101855714A Copper metallization of through silicon via
10/06/2010CN101855713A Process for producing semiconductor fine particles and the fine particles
10/06/2010CN101855712A Plasma etching chamber
10/06/2010CN101855711A Dicing die-bonding film
10/06/2010CN101855710A Dicing die-bonding film
10/06/2010CN101855709A Method for heating a plate with a light stream
10/06/2010CN101855708A Heat treatment apparatus
10/06/2010CN101855707A Plasma processing apparatus
10/06/2010CN101855706A Pitch reduction using oxide spacer
10/06/2010CN101855705A Drive control method, drive control apparatus, stage control method, stage control apparatus, exposure method, exposure apparatus and measuring apparatus
10/06/2010CN101855704A Semiconductor device, substrate with single-crystal semiconductor thin film and methods for manufacturing same
10/06/2010CN101855703A Semiconductor device, substrate with single-crystal semiconductor thin film and methods for manufacturing same
10/06/2010CN101855596A Positive-type photosensitive resin composition, method for production of resist pattern, semiconductor device, and electronic device
10/06/2010CN101855559A Stiffener assembly for use with testing devices
10/06/2010CN101855334A High negative zeta potential polyhedral silsesquioxane composition and method for damage free semiconductor wet clean
10/06/2010CN101855311A Adhesive tape for processing semiconductor wafer
10/06/2010CN101855309A Polishing composition comprising a N-substituted imidazole and a method for polishing a copper film
10/06/2010CN101855155A Conductive reel
10/06/2010CN101855074A Polymer-ceramic composites with excellent TCC
10/06/2010CN101855060A Bonding substrate manufacturing apparatus and bonding substrate manufacturing method
10/06/2010CN101855045A Method for cutting work by wire saw and wire saw
10/06/2010CN101853910A Light-emitting device
10/06/2010CN101853906A Circuit structure
10/06/2010CN101853884A 半导体装置 Semiconductor device
10/06/2010CN101853883A Thin film transistor, its manufacturing method, and liquid crystal display panel and electronic device using same
10/06/2010CN101853882A High-mobility multiple-gate transistor with improved on-to-off current ratio
10/06/2010CN101853881A Semiconductor device and method for manufacturing the same
10/06/2010CN101853880A AlGaN/GaN high-electron-mobility transistor and manufacturing method thereof
10/06/2010CN101853878A Combined PNP-trench isolation RC-GCT component and preparation method thereof
10/06/2010CN101853874A Crossed nano-scale storage structure circuit and solution of crosstalk problem thereof
10/06/2010CN101853873A Switching device of memory device and method for forming the same
10/06/2010CN101853864A Method of wafer bonding
10/06/2010CN101853863A Image module and manufacturing method thereof
10/06/2010CN101853862A Photoelectric microelectrode array used for artificial retina and manufacturing method thereof
10/06/2010CN101853860A Integrated semiconductor device and method of manufacturing the same
10/06/2010CN101853859A Display substrate and production method thereof
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