Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2010
10/06/2010CN101853858A Nonvolatile memory device having stacked structure, memory card and electronic system
10/06/2010CN101853857A Method of forming an EEPROM device and structure therefor
10/06/2010CN101853856A Semiconductor devices and formation methods thereof
10/06/2010CN101853855A Silicon wafer with perforating holes and manufacturing method thereof
10/06/2010CN101853854A Groove power MOS component with improved type terminal structure and manufacturing method thereof
10/06/2010CN101853853A Tvs with low capacitance & forward voltage drop with depleted scr as steering diode
10/06/2010CN101853852A Groove MOS (Metal Oxide Semiconductor) device integrating Schottky diodes in unit cell and manufacture method
10/06/2010CN101853851A Capacitive element, manufacturing method of the same, solid-state imaging device, and imaging apparatus
10/06/2010CN101853850A Super barrier semiconductor rectifying device and manufacture method thereof
10/06/2010CN101853842A Package structure for chip and method for forming the same
10/06/2010CN101853841A Device mounting board and method of manufacturing the board, semiconductor module and method of manufacturing the module
10/06/2010CN101853840A Structure of embedded line substrate and manufacturing method thereof
10/06/2010CN101853835A Flip chip package and manufacturing method thereof
10/06/2010CN101853834A Submerged basic island, embedded basic island lead frame structure and first-etching last-plating method thereof
10/06/2010CN101853833A Embedded basic island and multi-convex point basic island lead framework and first-etching last-plating method thereof
10/06/2010CN101853832A Base island exposed type and embedded type base island lead frame structure and first-engraving last-plating method thereof
10/06/2010CN101853831A Semiconductor device and manufacturing method therefor
10/06/2010CN101853830A 半导体装置及其制造方法 Semiconductor device and manufacturing method
10/06/2010CN101853829A Semiconductor structure and manufacturing method thereof
10/06/2010CN101853827A Multilayer wiring substrate, stack structure sensor package, and method of manufacturing stack structure sensor package
10/06/2010CN101853824A Array substrate and manufacturing method thereof
10/06/2010CN101853822A Novel heat sink and production method thereof
10/06/2010CN101853819A Chip structure, wafer structure and chip fabrication technique
10/06/2010CN101853818A Packaging substrate structure with recess and manufacturing method thereof
10/06/2010CN101853817A 封装结构及其制造方法 Package structure and method for manufacturing
10/06/2010CN101853816A Group III nitride semiconductor composite substrate, group III nitride semiconductor substrate, and group III nitride semiconductor composite substrate manufacturing method
10/06/2010CN101853815A Method for manufacturing of non-volatile memory device
10/06/2010CN101853814A Method for making peripheral circuit device grid in flash memory
10/06/2010CN101853813A Semiconductor device and fabricating method thereof
10/06/2010CN101853812A Image sensor and method of fabricating same
10/06/2010CN101853811A Method for manufacturing semiconductor device
10/06/2010CN101853810A Electronic device with polymer light-emitting diode and manufacturing method thereof
10/06/2010CN101853809A Semiconductor element and its manufacturing method and liquid-crystal display device and its manufacturing method
10/06/2010CN101853808A Method of forming a circuit structure
10/06/2010CN101853807A Method for dielectric material removal between conductive lines
10/06/2010CN101853806A Method for forming functional element using metal-to-insulator transition material, functional element formed by method, method for producing functional device, and functional device produced by method
10/06/2010CN101853805A Method of reducing W loss effect and semiconductor structure
10/06/2010CN101853804A Method for manufacturing semiconductor device
10/06/2010CN101853803A Method for reducing shallow channel isolating divot
10/06/2010CN101853802A Method of measurement in semiconductor fabrication
10/06/2010CN101853801A Method and apparatus of holding a device
10/06/2010CN101853800A Working stage with antistatic treatment
10/06/2010CN101853799A Substrate elevating transferring device and substrate processing transferring system
10/06/2010CN101853798A High voltage sensor device and method therefor
10/06/2010CN101853797A System and method for inspecting a wafer
10/06/2010CN101853796A Probe card
10/06/2010CN101853795A Low-temperature thermocompression bonding method
10/06/2010CN101853794A Electronic components jointing method and salient point forming method and device
10/06/2010CN101853793A Manufacturing method for semiconductor device
10/06/2010CN101853792A Manufacturing method of semiconductor device and semiconductor device
10/06/2010CN101853791A Manufacturing method and structure of flip chip package as well as structure of wafer coating
10/06/2010CN101853790A New process flow of COL (Chip On Lead) packaging
10/06/2010CN101853789A Method for manufacturing golden finger of soldering-pan of flexible package carrying board
10/06/2010CN101853788A Method for manufacturing semiconductor modules
10/06/2010CN101853787A Thin-film transistor and making method thereof
10/06/2010CN101853786A Method for manufacturing semiconductor substrate
10/06/2010CN101853785A Method for preparing longitudinal high-pressure boron diffusion deep groove semiconductor pipe
10/06/2010CN101853784A Method for transversely inducing and crystallizing low-temperature polycrystalline silicon film
10/06/2010CN101853783A Processing procedure of semiconductor device with thick silicon substrate
10/06/2010CN101853782A Copper line having self assembled monolayer for use in ULSI semiconductor devices and methods of making the same
10/06/2010CN101853781A Substrate brush scrubbing and proximity cleaning-drying sequence using compatible chemistries, and method, apparatus, and system for implementing the same
10/06/2010CN101853780A Ion radiation damage prediction method, ion radiation damage simulator, ion radiation apparatus and ion radiation method
10/06/2010CN101853779A Substrate processing apparatus and exhaust method therefor
10/06/2010CN101853778A Method and system of stacking and aligning a plurality of integrated circuits
10/06/2010CN101853777A Gas flow path structure and substrate processing apparatus
10/06/2010CN101853776A Advanced process control with novel sampling policy
10/06/2010CN101853775A Sticking and mounting system of electronic component and control method thereof
10/06/2010CN101853774A Heating cavity and semiconductor processing device
10/06/2010CN101853697A Gain cell embedded dynamic random access memory (eDRAM) unit, memory and preparation method thereof
10/06/2010CN101853008A Method and system for tuning advanced process control parameters
10/06/2010CN101852984A Method for inspecting photomask blank or intermediate thereof, method for determining dosage of high-energy radiation, and method for manufacturing photomask blank
10/06/2010CN101852953A TFT-LCD (Thin Film Transistor Liquid Crystal Display) array substrate and manufacturing method thereof, as well as liquid crystal display panel
10/06/2010CN101852763A Chiral sensor based on field effect transistor and preparation method thereof
10/06/2010CN101852741A Method for defect diagnosis and management
10/06/2010CN101851748A Full-automatic large panel PECVD silicon nitride tectorial membrane preparation system
10/06/2010CN101851742A Preparation method of compound semiconductor film
10/06/2010CN101850944A Method for sedimentating silicon nitride thin film by using 13.56 MHz radio frequency power source
10/06/2010CN101850538A Support jig of wafer and method for grinding, transferring and cutting wafer
10/06/2010CN101850537A Circular substrate polishing and cleaning device and method
10/06/2010CN101850343A Wafer two-fluid cleaning device
10/06/2010CN101615613B Pixel structure, organic electro-luminescence display unit and manufacturing method thereof
10/06/2010CN101604638B Wafer level fan-out chip packaging method
10/06/2010CN101527257B Bonded method and bonded body
10/06/2010CN101494181B Solder ball printing device
10/06/2010CN101479837B Method of manufacturing a bipolar transistor and bipolar transitor obtained therewith
10/06/2010CN101477985B Semiconductor device, liquid crystal panel, electronic device and method for manufacturing same
10/06/2010CN101477958B Bonding apparatus and bonding method
10/06/2010CN101467233B Thin-film deposition apparatus using discharge electrode and solar cell fabrication method
10/06/2010CN101465306B Method for measuring distortion of epitaxial growth picture
10/06/2010CN101431079B Nonvolatile semiconductor memory device
10/06/2010CN101431034B Method for multi-chip plane packaging
10/06/2010CN101405854B Resin sealing/molding apparatus
10/06/2010CN101399279B Image sensor and method for manufacturing the same
10/06/2010CN101399226B Method for forming a pattern of a semiconductor device
10/06/2010CN101376966B Novel electrode box
10/06/2010CN101373730B Apparatus for locating silicon chip angle and reaction chamber
10/06/2010CN101366102B Methods of forming openings into dielectric material
10/06/2010CN101356866B Method and apparatus for mounting solder ball
10/06/2010CN101354507B Thin-film transistor LCD device array substrate structure and manufacturing method thereof
10/06/2010CN101346818B Wavelength-converting light-emitting devices
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