Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2010
10/05/2010US7807555 Method of forming the NDMOS device body with the reduced number of masks
10/05/2010US7807554 Method of manufacturing semiconductor element
10/05/2010US7807553 Substrate heating apparatus and semiconductor fabrication method
10/05/2010US7807552 Method of inspecting defect of semiconductor device
10/05/2010US7807551 Method for fabricating flexible pixel array substrate
10/05/2010US7807550 Method of making MEMS wafers
10/05/2010US7807549 Method for low temperature bonding and bonded structure
10/05/2010US7807548 Process of forming and controlling rough interfaces
10/05/2010US7807547 Wafer bonding material with embedded rigid particles
10/05/2010US7807546 SRAM cell having stepped boundary regions and methods of fabrication
10/05/2010US7807545 Method for manufacturing SIMOX wafer
10/05/2010US7807544 Solar cell fabrication using extrusion mask
10/05/2010US7807543 Methods of manufacturing trench isolation structures using selective plasma ion immersion implantation and deposition (PIIID)
10/05/2010US7807542 Semiconductor device having storage node electrode with protection film thereon and method of fabricating the same
10/05/2010US7807541 Concentric or nested container capacitor structure for integrated circuits
10/05/2010US7807540 Back end thin film capacitor having plates at thin film resistor and first metallization layer levels
10/05/2010US7807539 Ion implantation and process sequence to form smaller base pick-up
10/05/2010US7807538 Method of forming a silicide layer while applying a compressive or tensile strain to impurity layers
10/05/2010US7807537 Method for forming silicon oxide film and for manufacturing capacitor and semiconductor device
10/05/2010US7807536 Low resistance gate for power MOSFET applications and method of manufacture
10/05/2010US7807535 Methods of forming layers comprising epitaxial silicon
10/05/2010US7807533 Method for forming non-volatile memory with shield plate for limiting cross coupling between floating gates
10/05/2010US7807532 Method and structure for self aligned formation of a gate polysilicon layer
10/05/2010US7807531 Semiconductor device having trench-type gate and its manufacturing method capable of simplifying manufacturing steps
10/05/2010US7807530 Semiconductor integrated circuit device and a method of manufacturing the same
10/05/2010US7807529 Lithographically space-defined charge storage regions in non-volatile memory
10/05/2010US7807528 ESD protection transistor
10/05/2010US7807526 Method of fabricating high-density, trench-based non-volatile random access SONOS memory cells for SOC applications
10/05/2010US7807525 Low power circuit structure with metal gate and high-k dielectric
10/05/2010US7807524 Semiconductor device with strained transistors and its manufacture
10/05/2010US7807523 Sequential selective epitaxial growth
10/05/2010US7807522 Lanthanide series metal implant to control work function of metal gate electrodes
10/05/2010US7807520 Method for manufacturing semiconductor device
10/05/2010US7807519 Method of forming thin film transistor
10/05/2010US7807518 Semiconductor memory device and manufacturing method thereof
10/05/2010US7807517 Method of fabricating a semiconductor device having a single gate electrode corresponding to a pair of fin-type channel regions
10/05/2010US7807516 Semiconductor device and manufacturing method of the same
10/05/2010US7807515 Oxide semiconductor, thin-film transistor and method for producing the same
10/05/2010US7807514 CCD with improved charge transfer
10/05/2010US7807513 Method for manufacturing semiconductor device
10/05/2010US7807512 Semiconductor packages and methods of fabricating the same
10/05/2010US7807511 Method of packaging a device having a multi-contact elastomer connector contact area and device thereof
10/05/2010US7807510 Method of manufacturing chip integrated substrate
10/05/2010US7807509 Anodically bonded ultra-high-vacuum cell
10/05/2010US7807508 Wafer-level fabrication of lidded chips with electrodeposited dielectric coating
10/05/2010US7807507 Backgrinding-underfill film, method of forming the same, semiconductor package using the backgrinding-underfill film, and method of forming the semiconductor package
10/05/2010US7807506 Microelectromechanical semiconductor component with cavity structure and method for producing the same
10/05/2010US7807505 Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods
10/05/2010US7807504 Semiconductor module
10/05/2010US7807503 Die-wafer package and method of fabricating same
10/05/2010US7807502 Method for fabricating semiconductor packages with discrete components
10/05/2010US7807501 Integrated circuit package and apparatus and method of producing an integrated circuit package
10/05/2010US7807500 Process for production of SOI substrate and process for production of semiconductor device including the selective forming of porous layer
10/05/2010US7807499 Stacked module and manufacturing method thereof
10/05/2010US7807498 Substrate, substrate fabrication, semiconductor device, and semiconductor device fabrication
10/05/2010US7807495 Method of manufacturing semiconductor film and method of manufacturing photovoltaic element
10/05/2010US7807494 Method for producing a chalcogenide-semiconductor layer of the ABC2 type with optical process monitoring
10/05/2010US7807493 Methods for fabricating a CMOS image sensor
10/05/2010US7807492 Magnetoresistive random access memory with improved layout design and process thereof
10/05/2010US7807491 Method of manufacturing nitride semiconductor light-emitting device
10/05/2010US7807490 Manufacturing method of nitride semiconductor device and nitride semiconductor device
10/05/2010US7807489 Light-emitting device with a protection layer to prevent the inter-diffusion of zinc (Zn) atoms
10/05/2010US7807488 Display element having filter material diffused in a substrate of the display element
10/05/2010US7807487 Method for fabricating liquid crystal display device
10/05/2010US7807486 Liquid crystal display device and method of fabricating the same
10/05/2010US7807485 Process for producing surface emitting laser, process for producing surface emitting laser array, and optical apparatus including surface emitting laser array produced by the process
10/05/2010US7807484 Light-emitting diode device and method for fabricating the same
10/05/2010US7807483 Method for manufacturing display device
10/05/2010US7807482 Method for transferring wafers
10/05/2010US7807481 Method of semiconductor device protection, package of semiconductor device
10/05/2010US7807480 Test cells for semiconductor yield improvement
10/05/2010US7807479 Method and apparatus for improving force control in wafer scribing
10/05/2010US7807478 Nonvolatile memory device and fabrication method thereof
10/05/2010US7807477 Varactors and methods of manufacture and use
10/05/2010US7807341 Method for forming organic mask and method for forming pattern using said organic mask
10/05/2010US7807337 Forming mold layer comprising hole arrays exposing seed layer;forming conductive patterns from seed layer to fill hole arrays; forming conductive line by growing; system-on-a-chip; electrolytic or electroless plating; adjusting height of conductive lines; helices; diffusion prevention layer
10/05/2010US7807328 base resin comprises homo-/copolyenes having alkali soluble group, exhibits changed alkali solubility under action of acid, acid generator, and tertiary alkanolamines; for patterning semiconductor integrated circuit via lithography; improved resolution
10/05/2010US7807326 toners for electrostatic printing formed from aluminum butoxide binder, polycrystalline silicon and germanium dispersed in ethylene-acrylic acid-methacrylic acid copolymer resin
10/05/2010US7807322 comprises mask substrate divided into first and second regions equally arranged to upper and lower sides on different sides, respectively, first mask pattern formed on first region of mask substrate,and second mask pattern formed on second region of mask substrate; minimizes yield reduction, cycle time
10/05/2010US7807267 Method of modifying porous film, modified porous film and use of same
10/05/2010US7807252 Chemical mechanical polishing pad having secondary polishing medium capacity control grooves
10/05/2010US7807234 Applying plasma processing to a semiconductor silicon substrate by microwaving in the presence of a mixture of inert gas and oxygen and nitrogen free radicals; oxynitriding to produce an insulation film where nitrogen has a higher concentration near the surface than at the interface with silicon
10/05/2010US7807233 Method of forming a TEOS cap layer at low temperature and reduced deposition rate
10/05/2010US7807073 Wiring parts are formed by utilizing such a conductor formulation, ensure the conductivity at the same level as an Ag bulk by a low temperature treatment
10/05/2010US7807038 with a polishing pad having thin cellular polymeric layer overlying a metal or alloy conductive substrate; improved electrical and thermal capabilities and control; porosity
10/05/2010US7807027 Substrate holder, plating apparatus, and plating method
10/05/2010US7807019 Radial antenna and plasma processing apparatus comprising the same
10/05/2010US7807018 Etching apparatus for use in manufacture of flat panel display device and manufacturing method using the same
10/05/2010US7807017 Etching apparatus for substrates
10/05/2010US7806987 Washing device and its work conveying method
10/05/2010US7806985 Vacuum device where power supply mechanism is mounted and power supply method
10/05/2010US7806984 Semiconductor or liquid crystal producing device
10/05/2010US7806983 Substrate temperature control in an ALD reactor
10/05/2010US7806642 Receiver for component feed plates and component feeder
10/05/2010US7806641 Substrate processing system having improved substrate transport system
10/05/2010US7806078 Plasma treatment apparatus
10/05/2010US7806077 Plasma nozzle array for providing uniform scalable microwave plasma generation
10/05/2010US7805835 Method for selectively processing surface tension of solder mask layer in circuit board
10/05/2010US7805834 Method for fabricating three-dimensional all organic interconnect structures
09/2010
09/30/2010WO2010111632A2 Method for laser singulation of chip scale packages on glass substrates