Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2010
11/17/2010CN101887917A Field-effect transistor and preparation method thereof
11/17/2010CN101887916A Asymmetric semiconductor devices and method of fabricating
11/17/2010CN101887912A Insulated gate type bipolar transistor and manufacturing method thereof
11/17/2010CN101887911A Lateral bipolar junction transistor and manufacturing method thereof
11/17/2010CN101887910A Gate stack structure for semiconductor flash memory device and preparation method thereof
11/17/2010CN101887908A Active drive organic electroluminescent device and preparation method thereof
11/17/2010CN101887905A Image display system and manufacturing method thereof
11/17/2010CN101887898A TFT-LCD (Thin Film Transistor Liquid Crystal Display) array base plate and manufacturing method thereof
11/17/2010CN101887897A TFT-LCD (Thin Film Transistor Liquid Crystal Display) array base plate and manufacturing method thereof
11/17/2010CN101887896A Semiconductor chip and method of repair design of the same
11/17/2010CN101887893A Film transistor array substrate and manufacturing method thereof
11/17/2010CN101887887A 3d integration structure and method using bonded metal planes
11/17/2010CN101887886A Multi-die package and manufacturing method thereof
11/17/2010CN101887883A MTM antifuse element structure and preparation method thereof
11/17/2010CN101887882A Integrated circuit layout structure and manufacturing method thereof
11/17/2010CN101887881A Interconnecting assembly, manufacture method and repairing method thereof
11/17/2010CN101887880A Multilayer printed wiring board
11/17/2010CN101887879A Substrate having single patterned metal layer, and package applied with the substrate , and methods of manufacturing of the substrate and package
11/17/2010CN101887877A Lead frame, semiconductor device and manufacturing method of the lead frame
11/17/2010CN101887875A Substrate having single patterned metal layer, and package applied with the substrate , and methods of manufacturing of the substrate and package
11/17/2010CN101887874A Substrate having single patterned metal layer, and package applied with the substrate , and methods of manufacturing of the substrate and package
11/17/2010CN101887873A Heat sink mounting structure and method
11/17/2010CN101887871A Chip packaging structure, chip packaging mould and chip packaging technology
11/17/2010CN101887869A Substrate having single patterned metal layer, and package applied with the substrate , and methods of manufacturing of the substrate and package
11/17/2010CN101887868A Method of fabricating array substrate
11/17/2010CN101887867A Method of fabricating organic light emitting diode display
11/17/2010CN101887866A Manufacturing method of shallow trench isolation structure
11/17/2010CN101887865A Substrate support with electrostatic chuck having dual temperature zones
11/17/2010CN101887864A Three-dimension packaging method
11/17/2010CN101887863A Manufacture method of silicon perforation
11/17/2010CN101887862A Silicon wafer back metalizing process for eutectic bonding
11/17/2010CN101887861A Chip packaging mould
11/17/2010CN101887860A Manufacturing method of electronic elements and encapsulation structures thereof
11/17/2010CN101887859A Method for forming through holes on base material and base material with through holes
11/17/2010CN101887858A Semiconductor device and manufacturing method thereof
11/17/2010CN101887857A Semiconductor device and manufacturing method thereof
11/17/2010CN101887856A Semiconductor device and manufacturing method thereof
11/17/2010CN101887855A Asymmetric voltage discharge tube and manufacturing method thereof
11/17/2010CN101887854A Method of manufacturing silicon carbide semiconductor device
11/17/2010CN101887853A Method for producing low-k film, semiconductor device, and method for manufacturing the same
11/17/2010CN101887852A Method for filling deep trench
11/17/2010CN101887851A Method of double side alignment photoetching and magnetic field auxiliary electrochemical corrosion of silicon-based three-dimensional structure
11/17/2010CN101887850A Monocrystaline silicon damage-free tunneling window integration method for promoting SONOS data holding ability
11/17/2010CN101887849A Method for preparing ZnO film by two-step deposition method
11/17/2010CN101887848A A method for producing a wafer comprising a silicon single crystal substrate having a front and a back side and a layer of sige deposited on the front side
11/17/2010CN101887847A Method for forming monocrystal silicon structure with alternated P types and N types
11/17/2010CN101887846A Process for producing pellicle
11/17/2010CN101887845A Method for preparing nanometer super capacitor
11/17/2010CN101887844A Wafer cleaning device
11/17/2010CN101887843A Process for producing semiconductor chip
11/17/2010CN101887842A Method for manufacturing soi substrate and soi substrate
11/17/2010CN101887841A Adhesive tape expansion method
11/17/2010CN101887840A Chip cleaning method for preventing falling particles
11/17/2010CN101887836A Method and device for regulating current distribution and plasma process equipment
11/17/2010CN101887704A Semiconductor device having oxide semiconductor layer and manufacturing method thereof
11/17/2010CN101887467A Method for establishing copper interconnection chemical mechanically mechanical polishing process model
11/17/2010CN101887199A Liquid crystal display and manufacturing method thereof
11/17/2010CN101887194A Electrode equipment and detection method
11/17/2010CN101887186A Array substrate for dislay device and method of fabricating the same
11/17/2010CN101886759A Light emitting device using alternating current and manufacturing method thereof
11/17/2010CN101886437A Shock-absorbing platform structure and elevated floor structure with same
11/17/2010CN101886266A Etchant and method of manufacturing an array substrate using the same
11/17/2010CN101886265A Etching solution for copper-containing multilayer film
11/17/2010CN101886255A Dielectric barrier deposition using nitrogen containing precursor
11/17/2010CN101885959A Cerium salt
11/17/2010CN101885211A Chip chipping endless belt
11/17/2010CN101884981A 晶片清洁装置 Wafer cleaning device
11/17/2010CN101599454B Semiconductor element isolating structure and forming method thereof
11/17/2010CN101582387B Holding device for substrate and mask and holding method using same
11/17/2010CN101567322B Encapsulating structure and encapsulating method of chip
11/17/2010CN101542741B Trench gate type transistor and method for manufacturing the same
11/17/2010CN101529570B Lateral trench mosfet with direct trench polysilicon contact and method of forming the same
11/17/2010CN101521205B Memory array and method for manufacturing same
11/17/2010CN101517831B Anisotropic conductive adhesive composition, anisotropic conductive film, circuit member connecting structure and method for manufacturing coated particles
11/17/2010CN101506955B Dielectric spacers for metal interconnects and method to form the same
11/17/2010CN101484993B Non-volatile memory AND-array and operation method thereof
11/17/2010CN101483155B Dual gate multi-bit semiconductor memory array manufacturing method
11/17/2010CN101471300B Image sensor and method for manufacturing the sensor
11/17/2010CN101465290B Substrate silicon chip for semiconductor power device and manufacturing technology thereof
11/17/2010CN101461039B Laser material processing method
11/17/2010CN101452228B Automatic aligner
11/17/2010CN101436580B Structure and method for measuring stack pair
11/17/2010CN101432890B Conductive paste for solar cell electrode
11/17/2010CN101431057B High-capacity BCD technique for twice etching single/poly-silicon
11/17/2010CN101419367B 液晶显示器件 The liquid crystal display device
11/17/2010CN101414567B Wafer encapsulation procedure capable of degenerating pre-calcination test and high-temperature test
11/17/2010CN101399169B Film-forming method, film-forming apparatus, storage medium, and semiconductor device
11/17/2010CN101383368B Image sensor and method for manufacturing same
11/17/2010CN101383357B Thin-film solar cell module and processing method thereof
11/17/2010CN101383322B Side wall vertical etching method for high-voltage electric switch contact hole
11/17/2010CN101367203B Chemical mechanical polishing pad with controlled wetting
11/17/2010CN101364571B Semiconductor device and method for fabricating the same
11/17/2010CN101364549B Making method for white light LED
11/17/2010CN101364019B Liquid crystal display device
11/17/2010CN101359185B Exposure apparatus, exposure method, and method for manufacturing display panel substrate
11/17/2010CN101356624B Laser annealing method and laser annealing apparatus
11/17/2010CN101355845B Substrate with conductive projection and technique thereof
11/17/2010CN101355011B Method and system for stamping wafer laser
11/17/2010CN101339893B Method for judging wafer thinning, device structure and device and its manufacture method
11/17/2010CN101330068B Molded reconfigured wafer, stack package using the same, and method for manufacturing the stack package
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