Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2010
11/17/2010CN101326457B Aligning apparatus, bonding apparatus and aligning method
11/17/2010CN101320711B Metal-oxide-semiconductor transistor and preparation thereof
11/17/2010CN101312164B Alxgayin1-x-yn substrate and cleaning method for the same, and AIN substrate and cleaning method for the same
11/17/2010CN101312126B Method for forming amorphous carbon film and method for manufacturing semiconductor device using the method
11/17/2010CN101310377B Transporting apparatus for disc-shaped workpieces
11/17/2010CN101305457B Electronic device and a process for forming the electronic device
11/17/2010CN101295658B Apparatus for heating chip, flip chip bonder having the apparatus, and method for bonding flip chip using the same
11/17/2010CN101295140B Projection optical system, exposure device and exposure method
11/17/2010CN101286468B Method of manufacturing substrate, substrate manufacturing system, and method of manufacturing display
11/17/2010CN101271235B Liquid crystal display device and method of fabricating the same
11/17/2010CN101266942B Semiconductor device and method for fabricating the same
11/17/2010CN101246857B Method of forming non-volatile memory cell
11/17/2010CN101231968B Inlaying inner connecting line structure and double inlaying process
11/17/2010CN101231961B Basal plate making process of inner embedded component
11/17/2010CN101231477B Exposure apparatus and method for producing device
11/17/2010CN101231476B Exposure apparatus and method for producing device
11/17/2010CN101231472B Method of measurement, an inspection apparatus and a lithographic apparatus
11/17/2010CN101226878B Substrate processing apparatus and substrate processing method
11/17/2010CN101217116B Semiconductor device, dynamic random access memory cell and manufacturing method thereof
11/17/2010CN101216600B Projection optical system, exposure apparatus, and exposure method
11/17/2010CN101216598B Projection optical system, exposure apparatus, and exposure method
11/17/2010CN101214946B Method for manufacturing carbon fibers and application thereof
11/17/2010CN101199049B Method of forming through-silicon vias with stress buffer collars and resulting devices
11/17/2010CN101192605B Semiconductor device and its manufacture method
11/17/2010CN101191936B Apparatus for attaching substrates
11/17/2010CN101170060B Making method for silicon germanium extension layer
11/17/2010CN101147242B Polishing compound for semiconductor integrated circuit device, polishing method and method for producing semiconductor integrated circuit device
11/17/2010CN101136373B Manufacturing method of non-volatility memory body
11/17/2010CN101136365B Semiconductor device exhibiting reduced dielectric loss in isolation trenches and producing method thereof
11/17/2010CN101136328B Gate electrode of semiconductor device and method of forming same
11/17/2010CN101080812B Resin composition for flip-chip packaging and resin composition for forming bump
11/17/2010CN101064305B Semiconductor device and method for manufacturing the same
11/17/2010CN101060125B Film transistor array substrate and fabricating method thereof
11/17/2010CN101051655B Schottky part and semiconductor making process for making same
11/17/2010CN101048856B Yttria insulator ring for use inside a plasma chamber
11/17/2010CN101034670B Method for removing contamination from a substrate and for making a cleaning solution
11/17/2010CN101024895B Epitaxial wafer and method for production of epitaxial wafer
11/17/2010CN101021691B Lithographic apparatus and device manufacturing method
11/16/2010USRE41935 Method for preventing low-k dielectric layer cracking in multi-layered dual damascene metallization layers
11/16/2010USRE41927 TFT LCD device having multi-layered pixel electrodes
11/16/2010USRE41924 Method and system for machine vision-based feature detection and mark verification in a workpiece or wafer marking system
11/16/2010US7836420 Integrated circuit system with assist feature
11/16/2010US7835816 Heat processing apparatus, heat processing method, computer program and storage medium
11/16/2010US7835602 Photonic guiding device
11/16/2010US7835157 System for fabrication of integrated tunable/switchable passive microwave and millimeter wave modules
11/16/2010US7835093 Methods for forming layers within a MEMS device using liftoff processes
11/16/2010US7834993 Surface inspection apparatus and surface inspection method
11/16/2010US7834982 Substrate holder and exposure apparatus having the same
11/16/2010US7834977 Lithographic apparatus and device manufacturing method
11/16/2010US7834965 TFT array substrate, method for manufacturing the same, and liquid crystal display having the same
11/16/2010US7834948 Active matrix substrate and liquid crystal display device
11/16/2010US7834926 Semiconductor image sensing element and fabrication method therefor, and semiconductor image sensing device and fabrication method therefor
11/16/2010US7834465 Semiconductor device, and manufacturing method of semiconductor device
11/16/2010US7834457 Bilayer metal capping layer for interconnect applications
11/16/2010US7834454 Electronic structures including barrier layers defining lips
11/16/2010US7834453 Contact structure having a compliant bump and a test pad
11/16/2010US7834452 Device made of single-crystal silicon
11/16/2010US7834445 Heat sink with thermally compliant beams
11/16/2010US7834433 Semiconductor power device
11/16/2010US7834422 Implanted counted dopant ions
11/16/2010US7834420 Semiconductor integrated circuit device and process for manufacturing the same
11/16/2010US7834416 Trench-constrained isolation diffusion for integrated circuit die
11/16/2010US7834409 Micromechanical component and corresponding method for its manufacture
11/16/2010US7834404 Semiconductor device
11/16/2010US7834398 Method of manufacturing a semiconductor device
11/16/2010US7834392 Multi-state non-volatile integrated circuit memory systems that employ dielectric storage elements
11/16/2010US7834391 Integrated circuit memory devices including memory cells on adjacent pedestals having different heights, and methods of fabricating same
11/16/2010US7834388 Memory array of non-volatile electrically alterable memory cells for storing multiple data
11/16/2010US7834386 Non-volatile memory with epitaxial regions for limiting cross coupling between floating gates
11/16/2010US7834382 Nitride read-only memory cell and method of manufacturing the same
11/16/2010US7834366 Semiconductor device having a group III nitride semiconductor layer
11/16/2010US7834361 Pixel structure and method for manufacturing the same
11/16/2010US7834359 Electro-optical device, transferred chip, and transfer origin substrate
11/16/2010US7834356 Semiconductor device and method of fabricating the same
11/16/2010US7834353 Method of manufacturing display device
11/16/2010US7834341 Phase change material (PCM) memory devices with bipolar junction transistors and methods for making thereof
11/16/2010US7834332 Thin film pattern forming device and method
11/16/2010US7834276 Structure for connecting a USB communication interface in a flash memory card by the height difference of a rigid flexible board
11/16/2010US7834275 Secure electronic entity such as a passport
11/16/2010US7834264 Methods of fabricating nanostructures and nanowires and devices fabricated therefrom
11/16/2010US7834119 offering high speed to semiconductor devices, lowering power consumption and greatly reducing cross-talk of metal wires; oxidized siloxane such as tetrahydroxytetramethylcyclotetrasiloxane, condensed into organic polysilicate
11/16/2010US7833957 Removing solution
11/16/2010US7833914 Capacitors and methods with praseodymium oxide insulators
11/16/2010US7833913 Method of forming crystallographically stabilized doped hafnium zirconium based films
11/16/2010US7833912 Semiconductor device and method of manufacturing the same
11/16/2010US7833911 Method of manufacturing semiconductor device, apparatus of manufacturing semiconductor device and semiconductor device
11/16/2010US7833910 Film substrate, fabrication method thereof, and image display substrate
11/16/2010US7833909 Method of manufacturing semiconductor device, and etching apparatus
11/16/2010US7833908 Slurry composition for chemical-mechanical polishing capable of compensating nanotopography effect and method for planarizing surface of semiconductor device using the same
11/16/2010US7833907 CMP methods avoiding edge erosion and related wafer
11/16/2010US7833906 Titanium silicon nitride deposition
11/16/2010US7833905 Method of manufacturing a semiconductor integrated circuit device
11/16/2010US7833904 Methods for fabricating nanoscale electrodes and uses thereof
11/16/2010US7833903 Semiconductor device and method of manufacturing the same
11/16/2010US7833902 Semiconductor device and method of fabricating the same
11/16/2010US7833901 Method for manufacturing a semiconductor device having a multi-layered insulating structure of SiOCH layers and an SiO2 layer
11/16/2010US7833900 Interconnections for integrated circuits including reducing an overburden and annealing
11/16/2010US7833899 Multi-layer thick metallization structure for a microelectronic device, intergrated circuit containing same, and method of manufacturing an integrated circuit containing same
11/16/2010US7833898 Method for manufacturing resistance RAM device
11/16/2010US7833897 Process for making interconnect solder Pb-free bumps free from organo-tin/tin deposits on the wafer surface
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