Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2010
11/23/2010US7838203 alters the cross sectional shape of the floating gate to enable the deposition of a thicker oxide layer at the edge of the floating gate; reduced charge leakage from the floating gate and increased retention reliability of the memory cell; cost efficiency
11/23/2010US7838182 thin film of forming a mask pattern is deposited on a substrate, an atmosphere from which an acid substance inhibiting a chemical amplification effect of a chemically amplified resist is removed is supplied into an environment for forming the resist film, thus chemically amplified resist film is formed
11/23/2010US7838173 Structure design and fabrication on photomask for contact hole manufacturing process window enhancement
11/23/2010US7838117 curing a silicone rubber layer which coats the LED chip, and then curing a silicone resin layer which coats and seals the periphery of the cured silicone rubber layer; hydrosilation catalyst; heat resistance, weather resistance, colorfastness; prevents cracking
11/23/2010US7838077 Functionalized, hydrogen-passivated silicon surfaces
11/23/2010US7837908 Mold cleaning sheet and method of producing semiconductor devices using the same
11/23/2010US7837828 Substrate supporting structure for semiconductor processing, and plasma processing device
11/23/2010US7837827 Edge ring arrangements for substrate processing
11/23/2010US7837826 Hybrid RF capacitively and inductively coupled plasma source using multifrequency RF powers and methods of use thereof
11/23/2010US7837825 Confined plasma with adjustable electrode area ratio
11/23/2010US7837820 Method for dicing wafer and process for manufacturing liquid-discharging head using the dicing method
11/23/2010US7837804 Substrate cleaning method, substrate cleaning equipment, computer program, and program recording medium
11/23/2010US7837803 Device and method for wet treating disc-shaped articles
11/23/2010US7837800 cerium oxide particles, a dispersing agent (lauryl betaine), a water-soluble polymer containing N-mono-substituted product and an N,N-di-substituted product of any one selected from acrylamide, methacrylamide and alpha -substituted product; polishing a silicon dioxide film
11/23/2010US7837799 Arrangement for transporting a flat substrate in a vacuum chamber
11/23/2010US7837798 Semiconductor processing apparatus with a heat resistant hermetically sealed substrate support
11/23/2010US7837795 Low temperature load and bake
11/23/2010US7837793 Method of manufacturing diamond substrates
11/23/2010US7837792 Method for manufacturing semiconductor device
11/23/2010US7837791 Silicon single crystal wafer for particle monitor
11/23/2010US7837534 Apparatus for heating or cooling a polishing surface of a polishing apparatus
11/23/2010US7837459 Method for fabricating dual damascene structures using photo-imprint lithography, methods for fabricating imprint lithography molds for dual damascene structures, materials for imprintable dielectrics and equipment for photo-imprint lithography used in dual damascene patterning
11/23/2010US7837425 Transportation apparatus and drive mechanism
11/23/2010US7837383 Apparatus and method for real time measurement of substrate temperatures for use in semiconductor growth and wafer processing
11/23/2010US7836901 Method and apparatus for wafer cleaning
11/23/2010US7836900 Substrate processing system, substrate processing method, recording medium and software
11/23/2010US7836586 Thin foil semiconductor package
11/23/2010US7836567 Thin film capacitor, high-density packaging substrate incorporating thin film capacitor, and method for manufacturing thin-film capacitor
11/23/2010CA2592266C Method of bonding substrates
11/18/2010WO2010132880A1 Method and apparatus for controlled laser ablation of material
11/18/2010WO2010132724A1 System-in packages
11/18/2010WO2010132717A1 High density non-volatile information storage
11/18/2010WO2010132716A2 Anodized showerhead
11/18/2010WO2010132640A2 Electrostatic chuck with polymer protrusions
11/18/2010WO2010132591A2 Pecvd coating using an organosilicon precursor
11/18/2010WO2010132587A2 High voltage iii-nitride semiconductor devices
11/18/2010WO2010132552A1 Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays
11/18/2010WO2010132403A1 Schottky diodes containing high barrier metal islands in a low barrier metal layer and methods of forming the same
11/18/2010WO2010132371A2 Multi-stage substrate cleaning method and apparatus
11/18/2010WO2010132338A2 Flip-chip underfill
11/18/2010WO2010132329A1 Brush core and brush driving method
11/18/2010WO2010132319A1 Adjusting threshold voltage for sophisticated transistors by diffusing a gate dielectric cap layer material prior to gate dielectric stabilization
11/18/2010WO2010132284A1 Photolithographically defined contacts to carbon nanostructures
11/18/2010WO2010132283A1 Semiconductor device comprising metal gates and a silicon containing resistor formed on an isolation structure
11/18/2010WO2010132277A1 Enhanced electromigration performance of copper lines in metallization systems of semiconductor devices by surface alloying
11/18/2010WO2010132181A2 Polishing head zone boundary smoothing
11/18/2010WO2010132172A2 Method for tuning a deposition rate during an atomic layer deposition process
11/18/2010WO2010132161A1 Solution based zirconium precursors for atomic layer deposition
11/18/2010WO2010132144A1 Diffused junction termination structures for silicon carbide devices and methods of fabricating silicon carbide devices incorporating same
11/18/2010WO2010132138A1 Photovolaic device
11/18/2010WO2010132071A1 Patterning a single integrated circuit layer using automatically-generated masks and multiple masking layers
11/18/2010WO2010131901A2 Non-volatile memory device
11/18/2010WO2010131680A1 Resin composition for formation of pattern, pattern formation method, and process for production of light-emitting element
11/18/2010WO2010131679A1 Semiconductor device
11/18/2010WO2010131662A1 Method for producing tio2-sio2 glass body, method for heat-treating tio2-sio2 glass body, tio2-sio2 glass body, and optical base for euvl
11/18/2010WO2010131655A1 Bonding sheet
11/18/2010WO2010131639A1 Semiconductor device, manufacturing method therefor, and solar cell
11/18/2010WO2010131632A1 Liquid crystal polymer compound and photomask for use in lithography
11/18/2010WO2010131616A1 Adhesive agent, adhesive sheet, and process for production of electronic component
11/18/2010WO2010131575A1 Adhesive composition, adhesive sheet for connecting circuit member, and method for manufacturing semiconductor device
11/18/2010WO2010131573A1 Insulating gate type bipolar transistor
11/18/2010WO2010131572A1 Semiconductor device
11/18/2010WO2010131571A1 Semiconductor device
11/18/2010WO2010131570A1 Silicon carbide substrate and semiconductor device
11/18/2010WO2010131569A1 Method for producing semiconductor substrate
11/18/2010WO2010131568A1 Silicon carbide substrate, semiconductor device, and method for manufacturing silicon carbide substrate
11/18/2010WO2010131527A1 Nitride semiconductor light emitting element and epitaxial substrate
11/18/2010WO2010131524A1 Circuit board and circuit module
11/18/2010WO2010131511A1 Group iii nitride semiconductor laser diode, and method for producing group iii nitride semiconductor laser diode
11/18/2010WO2010131502A1 Thin film transistor and method for manufacturing same
11/18/2010WO2010131490A1 Exposure apparatus and device manufacturing method
11/18/2010WO2010131485A1 Mobile apparatus, power transmission apparatus, exposure apparatus, and device manufacturing method
11/18/2010WO2010131469A1 Free ball bearing, support table, conveyance facility, and turntable
11/18/2010WO2010131462A1 Solid-state image pickup element
11/18/2010WO2010131451A1 Epitaxial substrate for electronic device and process for producing same
11/18/2010WO2010131414A1 Purging apparatus and purging method
11/18/2010WO2010131412A1 Silicon wafer and method for producing the same
11/18/2010WO2010131393A1 Wiring structure, wiring substrate, liquid crystal display panel, and method for manufacturing wiring structure
11/18/2010WO2010131391A1 Semiconductor device and electronic device provided with same
11/18/2010WO2010131388A1 Semiconductor device
11/18/2010WO2010131380A1 Bonding apparatus and bonding method
11/18/2010WO2010131366A1 Surface wave plasma cvd apparatus and film forming method
11/18/2010WO2010131365A1 Surface wave plasma cvd apparatus and film forming method
11/18/2010WO2010131357A1 Transfer device and transfer method
11/18/2010WO2010131356A1 Transfer device and transfer method
11/18/2010WO2010131312A1 Semiconductor device and method of producing same
11/18/2010WO2010131311A1 Semiconductor memory cell and method for manufacturing same
11/18/2010WO2010131310A1 Semiconductor memory cell and method for manufacturing same
11/18/2010WO2010131291A1 Semiconductor wafer housing container
11/18/2010WO2010131079A1 Semiconductor Device Comprising a Metal System Including a Separate Inductor Metal Layer
11/18/2010WO2010130602A1 High voltage field effect transistor with trench drift region and corresponding method of production
11/18/2010WO2010130013A1 Material or device characterisation with non-homogeneous photoexcitation
11/18/2010WO2010106144A3 Method for producing a metallization having two multiple alternating metallization layers for at least one contact pad and semiconductor wafer having said metallization for at least one contact pad
11/18/2010WO2010105585A8 Substrate processing system and substrate processing method
11/18/2010WO2010101759A3 Non destructive selective deposition removal of non-metallic deposits from aluminum containing substrates
11/18/2010WO2010101691A3 Methods of forming patterns
11/18/2010WO2010098876A3 Digital metamorphic alloys for graded buffers
11/18/2010WO2010098352A9 Process for producing porous quartz glass object, and optical member for euv lithography
11/18/2010WO2010098324A9 Method of producing semiconductor device
11/18/2010WO2010096707A3 Microelectronic contactor assembly, structures thereof, and methods of constructing same