Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2010
11/24/2010CN101894813A Semiconductor packaging structure and manufacture method thereof
11/24/2010CN101894811A Quad flat package structure having exposed heat sink, electronic assembly and manufacturing methods thereof
11/24/2010CN101894810A Composite underfill, semiconductor package and its forming method
11/24/2010CN101894809A Stackable packaging structure with embedded connecting substrate and manufacturing method thereof
11/24/2010CN101894808A Electronic device and method of manufacturing the same
11/24/2010CN101894807A TFT-LCD (Thin Film Transistor-Liquid Crystal Display) array base plate and manufacturing method thereof
11/24/2010CN101894806A Resistive memory and production method thereof
11/24/2010CN101894805A Non-volatile memory device and method for fabricating the same
11/24/2010CN101894804A Method of manufacturing nonvolatile memory device
11/24/2010CN101894803A Method for protecting high-temperature silica quality on top of ONO layer of SONOS flash memory
11/24/2010CN101894802A Flash memory and manufacturing method thereof
11/24/2010CN101894801A Manufacturing method of NROM and device thereof
11/24/2010CN101894800A Method for manufacturing high voltage CMOS devices
11/24/2010CN101894799A Method for improving electron mobility of NMOS transistor
11/24/2010CN101894798A Fabrication method of semiconductor integrated circuit device
11/24/2010CN101894797A Manufacture method of backside illumination image sensor
11/24/2010CN101894796A Method for utilizing laser scribing to cleave tube core of gallium nitride-based laser
11/24/2010CN101894795A Integrated circuit system with hierarchical capacitor and method of manufacture thereof
11/24/2010CN101894794A Method of forming sub-lithographic features using directed self-assembly of polymers
11/24/2010CN101894793A Integrated circuit system with through silicon via and method of manufacture thereof
11/24/2010CN101894792A Method for forming metal patterns by stripping
11/24/2010CN101894791A Formation method of contact hole
11/24/2010CN101894790A Preparation method of semiconductor chip
11/24/2010CN101894789A Method for fabricating an isolation structure
11/24/2010CN101894788A Isolation structure and formation method thereof
11/24/2010CN101894787A Method for constructing shallow trench isolation groove of wafer
11/24/2010CN101894786A Method for preparing shallow trench isolation (STI)
11/24/2010CN101894785A Diode pin clamping mold
11/24/2010CN101894784A Wafer rotating plate device for special equipment of semiconductor
11/24/2010CN101894783A Chip absorption and turnover device for semiconductor special equipment
11/24/2010CN101894782A Protective tape joining method and protective tape joining apparatus
11/24/2010CN101894781A Suspended floatation working platform
11/24/2010CN101894780A 转向装置 Steering device
11/24/2010CN101894779A A method and apparatus for semiconductor processing
11/24/2010CN101894778A A method and apparatus for semiconductor processing
11/24/2010CN101894777A Semiconduct device contacting device for test handler and test handler using the same
11/24/2010CN101894776A Method for detecting nitrogen doped concentration by measuring resistance change
11/24/2010CN101894775A Method for detecting stability of spike anneal processing device
11/24/2010CN101894774A 电子部件安装方法和电子部件安装装置 Electronic component mounting method and an electronic component mounting apparatus
11/24/2010CN101894773A Preparation method of carbon nano tube salient points
11/24/2010CN101894772A Method for enhancing reliability of chip welding spot, printed circuit board and electronic device
11/24/2010CN101894771A Manufacturing method of multilayer stacked resistance transit storage
11/24/2010CN101894770A Pre-oxidation method of semiconductor packaging and routing surface and pre-oxidation layer structure thereof
11/24/2010CN101894769A Interconnect for tightly packed arrays with flex circuit
11/24/2010CN101894768A Manufacturing method of chip provided with bump
11/24/2010CN101894767A Manufacturing method of bump bottom metal layer
11/24/2010CN101894766A Method for manufacturing solder lug
11/24/2010CN101894765A Manufacturing method of LED device
11/24/2010CN101894764A Semiconductor structure and manufacture method thereof
11/24/2010CN101894763A Chip assembling method
11/24/2010CN101894762A Metal heat-conducting substrate and manufacturing method thereof
11/24/2010CN101894761A Substrate for open window type ball grid array package structure and manufacturing method thereof
11/24/2010CN101894760A Thin film transistor and manufacture method thereof
11/24/2010CN101894759A Semiconductor device and method for manufacturing the semiconductor device
11/24/2010CN101894758A Manufacturing method for increasing gains of MOS pipe
11/24/2010CN101894757A Manufacturing method of MOS (Metal Oxide Semiconductor) transistor
11/24/2010CN101894756A Groove formation method, metal wire formation method, photoetching method and equipment
11/24/2010CN101894755A Method for etching groove and device for measuring groove depth
11/24/2010CN101894754A Developing method in wafer etching process
11/24/2010CN101894753A Method for preparing dielectric film embedded with high-density palladium nano-crystal
11/24/2010CN101894752A Semiconductor manufacture method
11/24/2010CN101894751A Method of removing photoresist
11/24/2010CN101894750A Method for carrying out dry etching on TaN electrode
11/24/2010CN101894749A Gate doping method of semiconductor device
11/24/2010CN101894748A Ion implant method
11/24/2010CN101894747A Crystallization of amorphous silicon film as well as manufacture method and device of poly-silicon film
11/24/2010CN101894746A Method for modifying chips by using electron beam radiation
11/24/2010CN101894745A Logic gate formed by semiconductor-based nano wires and preparation method thereof
11/24/2010CN101894744A Laser crystallizing method for polycrystalline silicon film by adopting technology of back insulating layer
11/24/2010CN101894743A Methods for producing epitaxially coated silicon wafers
11/24/2010CN101894742A Making method of high Q value inductor
11/24/2010CN101894741A Fabrication process of a hybrid semiconductor substrate
11/24/2010CN101894740A Method for settling anti-reflection film
11/24/2010CN101894739A Method for controlling interlayer dielectric layer thickness
11/24/2010CN101894738A Method of cleaning semiconductor wafers
11/24/2010CN101894737A Control method of cavity environment
11/24/2010CN101894736A Coating developing machine
11/24/2010CN101894735A Method for removing residues of chemical mechanical grinding
11/24/2010CN101893977A Touch screen, color film base plate and manufacture method thereof
11/24/2010CN101893879A Method and system for carrier plate transmission control of plasma chemical vapor deposition equipment
11/24/2010CN101893823A Method for preventing damage of photoresist layer graph
11/24/2010CN101893799A Liquid crystal display panel and manufacturing method thereof
11/24/2010CN101893797A Pixel structure and manufacturing method thereof
11/24/2010CN101893774A Liquid crystal display panel and manufacturing method thereof
11/24/2010CN101892521A Substrate for growing single crystal diamond layer and method for producing single crystal diamond substrate
11/24/2010CN101892465A Quickly-changed silicon chip film-coated single-faced hanging hook assembly and mounting method thereof
11/24/2010CN101892463A Methods for stable and repeatable plasma ion implantation
11/24/2010CN101891468A Method for preparing ferroelectric solution and film capacitor thereof
11/24/2010CN101890710A Wafer adsorption type conveying manipulator
11/24/2010CN101890668A 磨削装置 Grinding apparatus
11/24/2010CN101890605A Power semiconductor chip welding device
11/24/2010CN101890580A Laser processing method for semiconductor wafer
11/24/2010CN101890579A Device processing method
11/24/2010CN101890578A Laser processing method for semiconductor wafer
11/24/2010CN101890548A Solder printing type die bonding method
11/24/2010CN101459177B Semiconductor device and producing method thereof
11/24/2010CN101436631B Method for packaging LED
11/24/2010CN101388340B Metal high-k transistor and process to fabricate same
11/24/2010CN101355010B Air-intake installation and reaction chamber
11/24/2010CN101325210B Magnetic sensor and production method thereof
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