Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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02/10/2011 | US20110031611 Embedded laminated device |
02/10/2011 | US20110031610 Semiconductor device, semiconductor device manufacturing method, printed circuit board and electronic device |
02/10/2011 | US20110031609 Semiconductor package having through electrodes that reduce leakage current and method for manufacturing the same |
02/10/2011 | US20110031608 Power device package and method of fabricating the same |
02/10/2011 | US20110031605 Package structure and package process |
02/10/2011 | US20110031603 Semiconductor devices having stress relief layers and methods for fabricating the same |
02/10/2011 | US20110031602 Method of manufacturing a semiconductor device |
02/10/2011 | US20110031601 Stacked semiconductor device and method of forming serial path thereof |
02/10/2011 | US20110031598 Semiconductor device and fabricating method thereof |
02/10/2011 | US20110031593 Method of manufacturing semiconductor device, substrate processing apparatus, and semiconductor device |
02/10/2011 | US20110031592 Silicon epitaxial wafer and method for production thereof |
02/10/2011 | US20110031590 Liquid film assisted laser die marking and structures formed thereby |
02/10/2011 | US20110031589 Group iii nitride substrate, semiconductor device comprising the same, and method for producing surface-treated group iii nitride substrate |
02/10/2011 | US20110031588 Varactor structure and method |
02/10/2011 | US20110031586 High Breakdown Voltage Embedded MIM Capacitor Structure |
02/10/2011 | US20110031585 Method for fabricating a MIM capacitor using gate metal for electrode and related structure |
02/10/2011 | US20110031584 Semiconductor device and manufacturing method thereof |
02/10/2011 | US20110031582 Fin anti-fuse with reduced programming voltage |
02/10/2011 | US20110031579 Low voltage diode with reduced parasitic resistance and method for fabricating |
02/10/2011 | US20110031576 Solid-state imaging device and manufacturing method thereof |
02/10/2011 | US20110031570 Magnetic tunnel junction device and method of manufacturing the same |
02/10/2011 | US20110031569 Method and system for providing magnetic tunneling junction elements having improved performance through capping layer induced perpendicular anisotropy and memories using such magnetic elements |
02/10/2011 | US20110031568 Structure having plural conductive regions and process for production thereof |
02/10/2011 | US20110031567 Process for manufacturing mems devices having buried cavities and mems device obtained thereby |
02/10/2011 | US20110031565 Micromachined devices and fabricating the same |
02/10/2011 | US20110031560 Read-only memory and method of manufacture thereof |
02/10/2011 | US20110031557 Gate dielectric first replacement gate processes and integrated circuits therefrom |
02/10/2011 | US20110031556 Fin interconnects for multigate fet circuit blocks |
02/10/2011 | US20110031554 Structure and method to improve threshold voltage of mosfets including a high k dielectric |
02/10/2011 | US20110031552 Semiconductor device and manufacturing method thereof |
02/10/2011 | US20110031551 Structure and Method For Forming Laterally Extending Dielectric Layer in a Trench-Gate FET |
02/10/2011 | US20110031550 Nonvolatile semiconductor memory device and method for manufacturing same |
02/10/2011 | US20110031549 Semiconductor memory device and manufacturing method of semiconductor memory device |
02/10/2011 | US20110031547 Nonvolatile semiconductor memory device and method for manufacturing same |
02/10/2011 | US20110031546 Method for manufacturing semiconductor device and apparatus for manufacturing same |
02/10/2011 | US20110031545 Spin transistor based on the spin-filter effect, and non-volatile memory using spin transistors |
02/10/2011 | US20110031539 Semiconductor devices having line type active regions and methods of fabricating the same |
02/10/2011 | US20110031537 Sensor element of a gas sensor |
02/10/2011 | US20110031533 Semiconductor device |
02/10/2011 | US20110031532 Compound semiconductor device and method of manufacturing the same |
02/10/2011 | US20110031522 Nitride-based semiconductor device and method for fabricating the same |
02/10/2011 | US20110031519 Semiconductor light emitting device and method for manufacturing the same |
02/10/2011 | US20110031517 Method for fabricating pixel structure |
02/10/2011 | US20110031516 Led with silicone layer and laminated remote phosphor layer |
02/10/2011 | US20110031507 Semiconductor device and method of manufacturing the same |
02/10/2011 | US20110031505 Silicon carbide semiconductor device and method of manufacturing the same |
02/10/2011 | US20110031503 Device with stressed channel |
02/10/2011 | US20110031498 Semiconductor device and method for manufacturing the same |
02/10/2011 | US20110031497 Semiconductor device and method for manufacturing the same |
02/10/2011 | US20110031494 Manufacturing method of semiconductor device and semiconductor device |
02/10/2011 | US20110031492 Semiconductor device and method for manufacturing semiconductor device |
02/10/2011 | US20110031491 Semiconductor device and manufacturing method thereof |
02/10/2011 | US20110031490 Thin film transistor |
02/10/2011 | US20110031473 Nanomesh SRAM Cell |
02/10/2011 | US20110031470 Methods for fabricating passivated silicon nanowires and devices thus obtained |
02/10/2011 | US20110031468 Nonvolatile memory device and method for manufacturing the same |
02/10/2011 | US20110031466 Semiconductor memory device and a method of manufacturing the same |
02/10/2011 | US20110031465 Resistance variable element and manufacturing method thereof |
02/10/2011 | US20110031462 Electronic Component, And A Method of Manufacturing An Electronic Component |
02/10/2011 | US20110031452 Nanoparticles Having Continuous Photoluminescence |
02/10/2011 | US20110031390 Method of manufacturing an analytical sample and method of analyzing an analytical sample |
02/10/2011 | US20110031376 Solid-state image pickup element, method of manufacturing the same, and image pickup apparatus including the same |
02/10/2011 | US20110031217 Plasma processing apparatus and plasma processing method |
02/10/2011 | US20110030898 Plasma Processing Apparatus and the Upper Electrode Unit |
02/10/2011 | US20110030895 Mask trimming |
02/10/2011 | US20110030774 Inverted Metamorphic Multijunction Solar Cells with Back Contacts |
02/10/2011 | US20110030773 Photovoltaic cell with back-surface reflectivity scattering |
02/10/2011 | US20110030763 Solar Panel Apparatus Created By Laser Etched Gratings on Glass Substrate |
02/10/2011 | US20110030758 Photovoltaic device and manufacturing method thereof |
02/10/2011 | US20110030722 Cleaning water for electronic material, method for cleaning electronic material and system for supplying water containing dissolved gas |
02/10/2011 | DE10320133B4 Verfahren zur Herstellung von einkristallinen oder quasi-einkristallinen Diamantschichten und auf einem Körper angeordnete einkristalline oder quasi-einkristalline Diamantschicht A process for the production of single crystalline or quasi-single-crystalline diamond layers and arranged on a body monocrystalline or quasi-monocrystalline diamond layer |
02/10/2011 | DE10214210B4 Lumineszenzdiodenchip zur Flip-Chip-Montage auf einen lotbedeckten Träger und Verfahren zu dessen Herstellung LED chip for flip-chip mounting on a lotbedeckten carrier and process for its preparation |
02/10/2011 | DE102009036355A1 Producing a thin-film solar module, comprises depositing sublayers of microcrystalline sublayer containing semiconductor layer on transparent front electrode layer by vapor deposition, and coating module with additional layers in vacuum |
02/10/2011 | DE102009035437A1 Halbleiterbauelement mit einem Verspannungspuffermaterial, das über einem Metallisierungssystem mit kleinem ε gebildet ist A semiconductor device having a stress buffer material that is formed over a metallization system with small ε |
02/10/2011 | DE102009035419A1 CMOS-Bauelement mit molekularen Speicherelementen in einer Kontaktdurchführungsebene CMOS device with molecular memory elements in a via level |
02/10/2011 | DE102009035418A1 Herstellung einer Kanalhalbleiterlegierung durch Abscheiden einer Hartmaske für das selektive epitaktische Aufwachsen Producing a channel semiconductor alloy by depositing a hard mask for selective epitaxial growth |
02/10/2011 | DE102009035409A1 Leckstromsteuerung in Feldeffekttransistoren auf der Grundlage einer Implantationssorte, die lokal an der STI-Kante eingeführt wird Leakage current control in field effect transistors on the basis of implantation species, which is introduced locally at the STI edge |
02/10/2011 | DE102009030298A1 Verfahren zur lokalen Politur einer Halbleiterscheibe Process for the local polishing of a semiconductor wafer |
02/10/2011 | DE102009028256A1 Etching silicon carbide by plasma etching process, comprises etching silicon carbide with first ionized process gas, which contains fluorine-containing gas, and etching silicon carbide with second ionized process gas, which contains oxygen |
02/10/2011 | DE102009028084A1 Hochohmige Siliziumcarbidschicht, Verfahren zur Herstellung einer hochohmigen Siliziumcarbidschicht und CVD-Anlage für die Herstellung einer hochohmigen Siliziumcarbidschicht High-resistance silicon carbide layer, method for producing a high-resistance silicon carbide layer and CVD equipment for manufacturing a high-resistance silicon carbide layer |
02/10/2011 | DE102009026300A1 Herstellungsverfahren und Herstellungsvorrichtung zur Herstellung von Dünnfilmsolarzellen Production method and production apparatus for the production of thin film solar cells |
02/10/2011 | DE102009024377B4 Zerstörungsfreies Analyseverfahren zur Güteermittlung einer Dünnschichtsolarzelle mittels Photolumineszenzspektroskopie Non-destructive analysis method for determining a quality thin-film solar cell by means of photoluminescence spectroscopy |
02/10/2011 | DE102006046851B4 Verfahren zum Schützen der Kontaktelemente eines Halbleiterwafers A method of protecting the contact elements of a semiconductor wafer |
02/10/2011 | DE102006038874B4 Halbleitervorrichtung mit gemeinsamen Bezugspotential über Deep-Trench-Isolation und Messanordnung Semiconductor device with a common ground on deep trench isolation and measurement arrangement |
02/10/2011 | DE102006025992B4 Sensorchip-Bruchfestigkeits-Inspektionsvorrichtung sowie Verfahren zur Inspektion der Bruchfestigkeit eines Sensorchips Sensor chip breaking strength inspection apparatus and method for inspecting the breaking strength of a sensor chip |
02/10/2011 | DE102005051346B4 Träger für einen Wafer, Kombination aus einem Träger und einem Wafer sowie Verfahren zur Handhabung des Trägers Carrier for a wafer, a combination of a support and a wafer as well as procedures for handling of the carrier |
02/10/2011 | DE102004024105B4 Verfahren zum Einbringen eines Grabens in ein Halbleitersubstrat sowie zum Aufbringen einer Deckschicht A method for introducing a trench in a semiconductor substrate and for depositing a covering layer |
02/10/2011 | DE10196026B4 Überzugs-Zusammensetzung, dünner Film, zur Verwendung des dünnen Films und Verfahren zur Herstellung eines dünnen porösen Kieselsäure-Films Coating composition, a thin film for use of the thin film and method for producing a porous silica thin film |
02/10/2011 | CA2786406A1 Ohmic connection using widened connection zones in a portable electronic object |
02/10/2011 | CA2768830A1 Resin mold for imprinting and method for producing same |
02/09/2011 | EP2282619A1 Plasma processing apparatus |
02/09/2011 | EP2282374A1 Circuit material |
02/09/2011 | EP2282347A2 Group-iii nitride based high electron mobility transistor (hemt) with barrier/spacer layer |
02/09/2011 | EP2282346A2 Group-III nitride based high electron mobility transistor (HEMT) with barrier/spacer layer |
02/09/2011 | EP2282337A2 Matrix type display apparatus, method of production thereof, and thermo-compression bonding head |
02/09/2011 | EP2282332A1 Method for fabricating a semiconductor substrate |
02/09/2011 | EP2282331A2 Substrate position alignment mechanism, vacuum prechamber and substrate processing system having same |
02/09/2011 | EP2282330A2 Transfer device and processing system having the same |
02/09/2011 | EP2282329A1 Method of electrically connecting a bond wire to a bond pad of an integrated circuit chip and the corresponding electronic device. |
02/09/2011 | EP2282328A1 Adhesive film |