Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2011
07/21/2011US20110175233 Semiconductor device and method for fabricating the same
07/21/2011US20110175228 Molecular self-assembly in substrate processing
07/21/2011US20110175226 Interconnect structure for integrated circuits having enhanced electromigration resistance
07/21/2011US20110175225 Method of forming an em protected semiconductor die
07/21/2011US20110175224 Bonded structure and manufacturing method for bonded structure
07/21/2011US20110175221 Chip package and fabrication method thereof
07/21/2011US20110175220 Semiconductor device having conductive pads and a method of manufacturing the same
07/21/2011US20110175219 Method for modular arrangement of a silicon based array and modular silicon based array
07/21/2011US20110175218 Package assembly having a semiconductor substrate
07/21/2011US20110175217 Semiconductor Packages Including Die and L-Shaped Lead and Method of Manufacture
07/21/2011US20110175216 Integrated void fill for through silicon via
07/21/2011US20110175215 3d chip stack having encapsulated chip-in-chip
07/21/2011US20110175214 Power Semiconductor Module With Interconnected Package Portions
07/21/2011US20110175213 Semiconductor device and manufacturing method thereof
07/21/2011US20110175211 Method And Structure To Reduce Soft Error Rate Susceptibility In Semiconductor Structures
07/21/2011US20110175210 Emi shielding package structure and method for fabricating the same
07/21/2011US20110175209 Method of forming an em protected semiconductor die
07/21/2011US20110175207 Method for producing metal oxide layers
07/21/2011US20110175205 Semiconductor device and manufacturing method thereof
07/21/2011US20110175204 Semiconductor device and method of manufacturing the same
07/21/2011US20110175198 Esd protection with increased current capability
07/21/2011US20110175196 Semiconductor integrated circuit device
07/21/2011US20110175195 Method for making high-performance rf integrated circuits
07/21/2011US20110175194 Semiconductor device and method of manufacturing the same
07/21/2011US20110175193 Semiconductor device and semiconductor device manufacturing method
07/21/2011US20110175191 Isolation trenches for semiconductor layers
07/21/2011US20110175190 Deep well structures with single depth shallow trench isolation regions
07/21/2011US20110175181 Magnetic Tunnel Junction (MTJ) on Planarized Electrode
07/21/2011US20110175180 Micrometer-scale Grid Structure Based on Single Crystal Silicon and Method of Manufacturing the Same
07/21/2011US20110175178 Microscopic structure packaging method and device with packaged microscopic structure
07/21/2011US20110175177 Microelectromechanical system (mems) device and methods for fabricating the same
07/21/2011US20110175176 High-k transistors with low threshold voltage
07/21/2011US20110175173 Semiconductor device and method for manufacturing the same
07/21/2011US20110175172 Manufacturing a semiconductor device
07/21/2011US20110175171 Semiconductor device and method for manufacturing the same
07/21/2011US20110175170 Structure and method for making low leakage and low mismatch nmosfet
07/21/2011US20110175169 Cmos circuit with low-k spacer and stress liner
07/21/2011US20110175168 Nmos transistor with enhanced stress gate
07/21/2011US20110175167 Semiconductor device having dual work function metal
07/21/2011US20110175166 Strained cmos device, circuit and method of fabrication
07/21/2011US20110175165 Semiconductor fin device and method for forming the same using high tilt angle implant
07/21/2011US20110175164 Device structure, layout and fabrication method for uniaxially strained transistors
07/21/2011US20110175163 FinFET WITH THIN GATE DIELECTRIC LAYER
07/21/2011US20110175162 Semiconductor memory device and method for fabricating the same
07/21/2011US20110175160 Short-channel schottky-barrier mosfet device and method of manufacture
07/21/2011US20110175157 Nonvolatile semiconductor memory device and method for manufacturing same
07/21/2011US20110175153 Semiconductor Device Having Transistor with Vertical Gate Electrode and Method of Fabricating the Same
07/21/2011US20110175152 Method and structure for forming high performance mos capacitor along with fully depleted semiconductor on insulator devices on the same chip
07/21/2011US20110175147 Field-effect transistor device having a metal gate stack with an oxygen barrier layer
07/21/2011US20110175146 Semiconductor device and method for manufacturing the same
07/21/2011US20110175141 Semiconductor devices including mos transistors having an optimized channel region and methods of fabricating the same
07/21/2011US20110175140 Methods for forming nmos epi layers
07/21/2011US20110175139 Semiconductor device and method for manufacturing same
07/21/2011US20110175110 Mosfet and method for manufacturing mosfet
07/21/2011US20110175103 Semiconductor device and method for manufacturing semiconductor device
07/21/2011US20110175099 Lithographic method of making uniform crystalline si films
07/21/2011US20110175093 Pixel structure and fabricating method thereof
07/21/2011US20110175092 Organic semiconductor element, method of manufacturing organic semiconductor element, electronic device, electronic equipment and insulating layer forming composition
07/21/2011US20110175091 Display device and manufacturing method thereof
07/21/2011US20110175090 Semiconductor device, manufacturing method thereof, and electronic device
07/21/2011US20110175088 Thin-Film Transistor Substrate and Method of Fabricating the Same
07/21/2011US20110175085 Pin structures including intrinsic gallium arsenide, devices incorporating the same, and related methods
07/21/2011US20110175083 Semiconductor Device
07/21/2011US20110175080 Transistors, methods of manufacturing a transistor, and electronic devices including a transistor
07/21/2011US20110175060 Graphene grown substrate and electronic/photonic integrated circuits using same
07/21/2011US20110175053 Nonvolatile memory device and method for manufacturing the same
07/21/2011US20110175052 Resistance-variable memory device including carbide-based solid electrolyte membrane and manufacturing method thereof
07/21/2011US20110175051 Resistive memory device and method for fabricating the same
07/21/2011US20110175050 Metal Oxide Resistance Based Semiconductor Memory Device With High Work Function Electrode
07/21/2011US20110175048 Nonvolatile memory device and method for manufacturing same
07/21/2011US20110175047 Electric field induced phase transitions and dynamic tuning of the properties of oxide structures
07/21/2011US20110174991 Scanning method and system using 2-d ion iimplanter
07/21/2011US20110174974 Method and apparatus for processing a microsample
07/21/2011US20110174799 Micro-hotplates
07/21/2011US20110174700 Method and Device for Storing Glass Plates for Photovoltaic Modules
07/21/2011US20110174527 Element mounting board, semiconductor module, semiconductor device, method for fabricating the element mounting board, and method for fabricating semiconductor device
07/21/2011US20110174441 Plasma processing apparatus
07/21/2011US20110174377 Manufacturing method for flexible device, flexible device, solar cell, and light emitting device
07/21/2011US20110174058 Integration manufacturing process for mems device
07/21/2011DE112009002396T5 Vorrichtung zum Herstellen eines Verbindungshalbleiters, Verfahren zum Herstellen eines Verbindungshalbleiters und Einspannvorrichtung zum Herstellen eines Verbindungshalbleiters Apparatus for producing a compound semiconductor process for producing a compound semiconductor and jig for manufacturing a compound semiconductor
07/21/2011DE112009002253T5 Vorrichtung zum chemisch-mechanischen Polieren, Verfahren zum chemisch-mechanischen Polieren und Steuerprogramm An apparatus for chemical mechanical polishing method for chemical mechanical polishing and control program
07/21/2011DE10222670B4 Elektrische Vorrichtung, welche eine Mehrzahl von Metallkontaktstellen besitzt,auf die eine Metallverdrahtung gebondet ist, und ein Herstellungsverfahren davon Electrical device having a plurality of metal pads to which a metal wiring is bonded, and a manufacturing method thereof
07/21/2011DE102011008562A1 Formation e.g. of quad no-lead frame integrated circuit package by forming solder coating on side surface of terminal of integrated circuit package while covering underside of terminal of package
07/21/2011DE102011008401A1 Kriechbeständiges Polierkissenfenster Kriechbeständiges polishing pad window
07/21/2011DE102011008397A1 Method for slicing block e.g. composite semiconductor block, using wire saw, involves determining abnormal value of potentiometer by interruption in cutting process of block where abnormal value is detected by torque sensing device
07/21/2011DE102011002795A1 Signalübertragungsanordnung, Verfahren zu dessen Herstellung und Spannungswandler Signal transmission arrangement, process for its preparation and voltage transformer
07/21/2011DE102010060831A1 Bondmaterial mit exotherm reaktiven Heterostrukturen Bonding material with exothermic reactive heterostructures
07/21/2011DE102010037675A1 Verfahren zur Silizidausbildung durch Zusetzen einer abgestuften Menge von Verunreinigungen während der Metallabscheidung A method for silicide formation by adding a graded amount of impurities during the metal deposition
07/21/2011DE102010029341A1 Substratträger Substrate carrier
07/21/2011DE102010015944A1 Überwachungsvorrichtung und Verfahren für ein in-situ Messen von Waferdicken zum Überwachen eines Dünnens von Halbleiterwafern sowie Dünnungsvorrichtung mit einer Nassätzeinrichtung und einer Überwachungsvorrichtung Monitoring apparatus and method for in-situ measurement of wafer thicknesses for monitoring a thinning of semiconductor wafers and Dünnungsvorrichtung with a Nassätzeinrichtung and a monitoring device
07/21/2011DE102010004966A1 Bleed-und-Feed-Vorrichtung und -Verfahren Bleed and feed device and method
07/21/2011DE102010001023A1 Sensorvorrichtung Sensor device
07/21/2011DE102010000952A1 Verfahren und Vorrichtung zum Bereitstellen von Wafern sowie Verwendung derselben Method and apparatus for providing wafers and using the same
07/21/2011DE102010000942A1 Verfahren zur Herstellung eines Gehäuseteils für ein Leistungshalbleitermodul und Verfahren zur Herstellung eines Leistungshalbleitermoduls A process for producing a housing part for a power semiconductor module and method of producing a power semiconductor module
07/21/2011DE102010000908A1 Power semiconductor module has external terminal guards that are screwed on regions of terminal tabs, so that external terminal guards are made to press contact the spring elements
07/21/2011DE102010000895A1 Verfahren zum Herstellen und Verschließen eines Grabens eines Halbleiterbauelements A method of manufacturing and closing of a trench of a semiconductor device
07/21/2011DE102010000892A1 Verfahren zum Bereitstellen und Verbinden von zwei Kontaktbereichen eines Halbleiterbauelements bzw. einem Substrat, sowie ein Substrat mit zwei solchen verbundenen Kontaktbereichen A method for providing and connecting two contact portions of a semiconductor device or a substrate and a substrate associated with two such contact regions
07/21/2011DE102010000888A1 Verfahren zum Ausbilden von Gräben in einem Halbleiterbauelement A method of forming trenches in a semiconductor device
07/21/2011DE102009010196B4 Halbleiterbauelemente und Verfahren zu deren Herstellung Semiconductor devices and processes for their preparation
07/21/2011DE102009010174B4 Verfahren zur Herstellung eines Halbleiterbauelements und Halbleiterbauelement A process for producing a semiconductor device and semiconductor device