| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 07/27/2011 | CN102135674A Array substrate for liquid crystal display device and method of fabricating the same |
| 07/27/2011 | CN102135672A Hot-pressing sticking mechanism |
| 07/27/2011 | CN102134710A Film deposition apparatus |
| 07/27/2011 | CN102134709A Film deposition apparatus |
| 07/27/2011 | CN102134491A Gallium nitride surface corrosion liquid and corrosion method |
| 07/27/2011 | CN102134453A Heat resistant adhesive sheet used in the fabrication of substrateless semiconductor package |
| 07/27/2011 | CN102134452A Heat-resistant adhesive sheet for semiconductor device fabrication and adhesive used for the sheet |
| 07/27/2011 | CN102134451A Adhesive film for semiconductor, composite sheet, and method for producing semiconductor using the same |
| 07/27/2011 | CN102133565A Control method and system for COB (Chip on Board) glue sealing machine based on visual orientation technology |
| 07/27/2011 | CN101807583B TFT-LCD (Thin Film Transistor Liquid Crystal Display) array substrate and manufacture method thereof |
| 07/27/2011 | CN101789374B Method for preparing plane collision ionizing field effect transistor in self-aligning manner |
| 07/27/2011 | CN101764077B Alignment system and alignment method |
| 07/27/2011 | CN101733703B Process method for reducing deformation of micro suspension structure in chemically mechanical thinning and polishing process |
| 07/27/2011 | CN101730928B Forming complimentary metal features using conformal insulator layer |
| 07/27/2011 | CN101714527B Method for manufacturing semiconductor element |
| 07/27/2011 | CN101673697B Front-opening unified pod with wafer constraint modules arranged on both sides of recessed area on door |
| 07/27/2011 | CN101673672B Method for preparing nitride films |
| 07/27/2011 | CN101667545B Multi-chip stacked structure and manufacturing method thereof |
| 07/27/2011 | CN101667534B Plasma processing apparatus and plasma processing method |
| 07/27/2011 | CN101667532B Plasma processing apparatus |
| 07/27/2011 | CN101661893B Resin sealing type semiconductor device and method of manufacturing the same, and lead frame |
| 07/27/2011 | CN101656222B Nested support pillar equipment |
| 07/27/2011 | CN101645464B TbMnO p-n heterojunction having two-way rectifying characteristic and preparation method thereof |
| 07/27/2011 | CN101645453B Nonvolatile memory device and method of manufacturing the same |
| 07/27/2011 | CN101645435B Probing pad structure and manufacturing method thereof |
| 07/27/2011 | CN101645430B Chip cooling device |
| 07/27/2011 | CN101630086B Aligning device |
| 07/27/2011 | CN101626030B Luminous element and repairing method thereof |
| 07/27/2011 | CN101615025B Maintenance control method and system used for semiconductor processing equipment |
| 07/27/2011 | CN101612622B Method, system and semiconductor processing equipment for reducing particle deposition in cavity |
| 07/27/2011 | CN101609830B Printed circuit board including electronic component embedded therein and method of manufacturing the same |
| 07/27/2011 | CN101609793B BGA screening device and replacing and soldering method of printed board BGA device |
| 07/27/2011 | CN101606233B Bevel clean device |
| 07/27/2011 | CN101604675B Circuit board and method of manufacturing the same, and circuit device and method of manufacturing the same |
| 07/27/2011 | CN101599517B Light emitting diode (LED) packaging structure with electrostatic protection function and manufacturing method thereof |
| 07/27/2011 | CN101599446B Electronic device and method of manufacturing the same |
| 07/27/2011 | CN101599437B Method for preparing thin film transistor |
| 07/27/2011 | CN101598894B Photomask, thin film transistor element and manufacturing method of thin film transistor element |
| 07/27/2011 | CN101587903B Electronic element packaging body and manufacturing method thereof |
| 07/27/2011 | CN101587868B Qfn semiconductor package and fabrication method thereof |
| 07/27/2011 | CN101583545B Damping body for packaging and package body |
| 07/27/2011 | CN101577256B Semiconductor device and method of manufacturing the same |
| 07/27/2011 | CN101560663B Method for electrochemically preparing nano-array structure materials on basis of nano-mask preparation technique |
| 07/27/2011 | CN101556914B Method for preparing semiconductor gallium nitride (GaN) extending thin film substrate |
| 07/27/2011 | CN101552290B Insulated gate field effect transistor and method of manufacturing same, and image pickup device and method of manufacturing same |
| 07/27/2011 | CN101552233B Low-cost large-screen wide-angle fast-response liquid crystal display apparatus |
| 07/27/2011 | CN101552194B Semiconductor device and method of fabricating the same |
| 07/27/2011 | CN101546733B Method for manufacturing TFT-LCD array substrate and color film substrate |
| 07/27/2011 | CN101546722B Air charging apparatus |
| 07/27/2011 | CN101515564B Membrane with dicing and die-bonding film |
| 07/27/2011 | CN101515563B Manufacturing method of capping layer |
| 07/27/2011 | CN101513154B Electronic component picking-up apparatus, surface mounter, and electronic component picking-up method |
| 07/27/2011 | CN101512783B Semiconductor light-emitting element |
| 07/27/2011 | CN101496139B Substrate processing method |
| 07/27/2011 | CN101488544B Light emitting element and method for manufacturing the same |
| 07/27/2011 | CN101477277B Liquid crystal display device and its manufacture method |
| 07/27/2011 | CN101471288B Semiconductor device using CMP and manufacturing method thereof |
| 07/27/2011 | CN101471265B Method for manufacturing thin film transistor |
| 07/27/2011 | CN101468784B Semiconductor miniature suspension structure and method of producing the same |
| 07/27/2011 | CN101465368B Display device and method for production thereof |
| 07/27/2011 | CN101454876B Method for removing damaged dielectric material |
| 07/27/2011 | CN101447466B Boiling enhanced heat exchange structure of chips and fabrication method thereof |
| 07/27/2011 | CN101443884B Nanometer molding method |
| 07/27/2011 | CN101436002B Exposure apparatus, method for manufacturing device, and method for controlling exposure apparatus |
| 07/27/2011 | CN101430469B Active-matrix device, electro-optical display device, and electronic apparatus |
| 07/27/2011 | CN101419988B P-NiO/n-MgxZn1-xO p-n junction diode with gradient forbidden band width and manufacturing method thereof |
| 07/27/2011 | CN101409975B Method for controlling and accelerating plasma glow start |
| 07/27/2011 | CN101401199B Method for producing partial SOI structures comprising zones connecting a superficial layer and a substrate |
| 07/27/2011 | CN101401196B Vertical EEPROM device |
| 07/27/2011 | CN101393867B Substrate processing method |
| 07/27/2011 | CN101388341B Impurity control in hdp-cvd dep/etch/dep processes |
| 07/27/2011 | CN101375403B Semiconductor device and manufacturing method thereof |
| 07/27/2011 | CN101373703B Cap-opening mechanism and semiconductor processing device and cap-opening control method thereof |
| 07/27/2011 | CN101373694B Ion implantation apparatus |
| 07/27/2011 | CN101364598B Semiconductor device and method of manufacturing the same |
| 07/27/2011 | CN101354428B Trolley for probe card and operation method of probe card using the same |
| 07/27/2011 | CN101339925B 半导体装置 Semiconductor device |
| 07/27/2011 | CN101325246B Method for manufacturing organic LED low temperature polysilicon and laser annealing crystallizing system |
| 07/27/2011 | CN101325208B Solid-state image capturing device, manufacturing method for solid-state image capturing device, and electronic information device |
| 07/27/2011 | CN101320745B Optical component, solid imaging device and manufacturing method |
| 07/27/2011 | CN101320693B Method for forming semiconductor device |
| 07/27/2011 | CN101308326B Sensitized material, light resistance material and semiconductor assembly manufacture method |
| 07/27/2011 | CN101290890B Circuit board with internally embedded conductive wire and manufacturing method therefor |
| 07/27/2011 | CN101288152B Bonding apparatus |
| 07/27/2011 | CN101276733B Method for fabricating plasma reactor parts |
| 07/27/2011 | CN101276214B Automated process control using optical metrology with a photonic nanojet |
| 07/27/2011 | CN101276153B Exposure drawing device |
| 07/27/2011 | CN101266960B Soldering structure and method using zn |
| 07/27/2011 | CN101258453B Producing system, producing method, managing device, managing method and program |
| 07/27/2011 | CN101256959B Fin type FET and manufacturing method thereof |
| 07/27/2011 | CN101246861B Package board |
| 07/27/2011 | CN101241918B Display substrate and method of manufacturing the same |
| 07/27/2011 | CN101241868B Encapsulation technology for internal buried semiconductor component and its encapsulation structure |
| 07/27/2011 | CN101228292B Method for silicon nitride chemical vapor deposition |
| 07/27/2011 | CN101226928B Stack type chip packaging structure and manufacturing method thereof |
| 07/27/2011 | CN101223483B Removing solution for photosensitive composition |
| 07/27/2011 | CN101222814B Method for shaping a magnetic field in a magnetic field-enhanced plasma reactor |
| 07/27/2011 | CN101198726B Metal oxide film, laminate, metal member and process for producing the same |
| 07/27/2011 | CN101193490B Magnetic confinement of a plasma |
| 07/27/2011 | CN101145505B Substrate processing apparatus and substrate processing method |