| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 07/20/2011 | CN102132386A Method and apparatus for etching silicon-containing film |
| 07/20/2011 | CN102132385A Solution for removal of residue after semiconductor dry processing and residue removal method using same |
| 07/20/2011 | CN102132384A Ultraviolet light irradiation device |
| 07/20/2011 | CN102132383A Cobalt deposition on barrier surfaces |
| 07/20/2011 | CN102132382A Surface treated aluminum nitride baffle |
| 07/20/2011 | CN102132381A Process gas delivery for semiconductor process chamber |
| 07/20/2011 | CN102132380A Polysilicon deposition apparatus |
| 07/20/2011 | CN102132379A Methods for deposition of ternary oxide gate dielectrics and structures formed thereby |
| 07/20/2011 | CN102132378A Laser material removal methods and apparatus |
| 07/20/2011 | CN102132377A Methods of fabricating complex two-dimensional conductive silicides |
| 07/20/2011 | CN102132376A Adhesive injection device |
| 07/20/2011 | CN102132212A Positive-type photosensitive resin composition, method for producing resist pattern, and electronic component |
| 07/20/2011 | CN102132211A Manufacturing method for substrate for mask blank, mask blank, photo mask, and semiconductor device |
| 07/20/2011 | CN102132165A Test device and test method |
| 07/20/2011 | CN102131955A Coating chamber with a moveable shield |
| 07/20/2011 | CN102131954A Magnetron sputter cathode, and filming apparatus |
| 07/20/2011 | CN102131953A Sputtering target for oxide semiconductor, comprising ingao3(zno) crystal phase and process for producing the sputtering target |
| 07/20/2011 | CN102131883A Photosensitive adhesive composition, and film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer and semiconductor device using the photosensitive adhesive composition |
| 07/20/2011 | CN102131882A Photosensitive adhesive composition, photosensitive film adhesive, adhesive pattern, semiconductor wafer with adhesive, semiconductor device and electronic component |
| 07/20/2011 | CN102131878A Adhesive tape or sheet |
| 07/20/2011 | CN102131617A Polishing head and polishing apparatus |
| 07/20/2011 | CN102131353A Method of joining components, composite of components of an electrical circuit and electrical circuit |
| 07/20/2011 | CN102130510A Signal transmission arrangement |
| 07/20/2011 | CN102130267A Encapsulation structure for light-emitting diode |
| 07/20/2011 | CN102130238A Method for cutting sapphire substrate LED chip |
| 07/20/2011 | CN102130237A Method for cutting sapphire substrate LED chip |
| 07/20/2011 | CN102130222A Manufacturing method of optical device |
| 07/20/2011 | CN102130214A Wet-method etching monitoring method |
| 07/20/2011 | CN102130209A Positioning device, sticking system and sticking method |
| 07/20/2011 | CN102130184A High-robustness back biased diode applied to high-voltage static protection |
| 07/20/2011 | CN102130183A Low voltage bidirectional protection diode |
| 07/20/2011 | CN102130182A Current regulation diode chip and manufacturing method thereof |
| 07/20/2011 | CN102130181A Lateral super junction device with high substrate-drain breakdwon and built-in avalanche clamp diode |
| 07/20/2011 | CN102130180A Low hydrogen concentration charge-trapping layer structures for non-volatile memory and methods of forming the same |
| 07/20/2011 | CN102130177A Transistors, methods of manufacturing a transistor, and electronic devices including a transistor |
| 07/20/2011 | CN102130174A MOS (Metal Oxide Semiconductor) device structure and manufacturing method thereof |
| 07/20/2011 | CN102130171A Semiconductor component and manufacturing method thereof |
| 07/20/2011 | CN102130169A Power MOS (Metal Oxide Semiconductor) device structure with shielding grid and manufacturing method thereof |
| 07/20/2011 | CN102130168A Isolated LDMOS (Laterally Diffused Metal Oxide Semiconductor) device and manufacturing method thereof |
| 07/20/2011 | CN102130167A Double diffused drain metal oxide semiconductor (DDDMOS) device and method for manufacturing same |
| 07/20/2011 | CN102130166A Dddmos device |
| 07/20/2011 | CN102130165A Source region of LDMOS (Laterally Diffused Metal Oxide Semiconductor) device and manufacturing method thereof |
| 07/20/2011 | CN102130163A ESD (electrostatic discharge) high-voltage DMOS (diffused metal oxide semiconductor) device and manufacturing method thereof |
| 07/20/2011 | CN102130162A Laterally diffused MOSFET (LDMOS) and method for manufacturing same |
| 07/20/2011 | CN102130161A Power field-effect tube and method for manufacturing same |
| 07/20/2011 | CN102130160A Groove-shaped channel AlGaN/GaN-reinforced high electron mobility transistor (HEMT) component and manufacturing method thereof |
| 07/20/2011 | CN102130159A 高电子迁移率晶体管 High electron mobility transistor |
| 07/20/2011 | CN102130158A Step-like groove-grid high electron mobility transistor |
| 07/20/2011 | CN102130157A Semiconductor device with metal carrier and manufacturing method |
| 07/20/2011 | CN102130155A Silicon control rectifier structure and manufacturing method thereof |
| 07/20/2011 | CN102130154A Silicon-controlled rectifier structure and manufacturing method thereof |
| 07/20/2011 | CN102130153A Silicon-on-insulator N-type transverse insulated gate bipolar transistor and preparation method thereof |
| 07/20/2011 | CN102130152A Self-aligned bipolar transistor and manufacturing method thereof |
| 07/20/2011 | CN102130147A Display, method of manufacturing display and electronic device |
| 07/20/2011 | CN102130136A Pixel structure and bigrid pixel structure |
| 07/20/2011 | CN102130135A Nonvolatile semiconductor memory device and method of manufacturing the same |
| 07/20/2011 | CN102130134A 3d nonvolatile memory device and method for fabricating the same |
| 07/20/2011 | CN102130133A SONOS (Silicon-Oxide-SION-Oxide-Poly Silicon) device and production method thereof |
| 07/20/2011 | CN102130132A EEPROM (electronically erasable programmable read-only memory) device and manufacturing method thereof |
| 07/20/2011 | CN102130131A Flash memory and manufacturing method and operating method thereof |
| 07/20/2011 | CN102130130A Memory element and manufacturing method thereof |
| 07/20/2011 | CN102130129A Layout structure of static random access memory (SRAM) and manufacturing method thereof |
| 07/20/2011 | CN102130127A Dram device and manufacturing method thereof |
| 07/20/2011 | CN102130126A Dynamic random access memory and manufacturing method thereof |
| 07/20/2011 | CN102130125A Semiconductor devices and methods of fabricating the same |
| 07/20/2011 | CN102130124A Chip structure for preventing latch-up effect and method thereof |
| 07/20/2011 | CN102130123A Terminal structure for power MOS transistor and manufacturing method thereof |
| 07/20/2011 | CN102130122A Domain structure of silicon germanium heterojunction triode |
| 07/20/2011 | CN102130120A Diode and manufacturing method thereof |
| 07/20/2011 | CN102130119A Diode and preparation method thereof |
| 07/20/2011 | CN102130118A Spiral inductor structure |
| 07/20/2011 | CN102130117A Spiral lamellar inductance structure and preparation method thereof |
| 07/20/2011 | CN102130103A External storage device and method of manufacturing external storage device |
| 07/20/2011 | CN102130102A Electronic device and method of producing the same |
| 07/20/2011 | CN102130101A Semiconductor device and method of forming bump structure with multi-layer UBM around bump formation area |
| 07/20/2011 | CN102130100A Package |
| 07/20/2011 | CN102130099A Package |
| 07/20/2011 | CN102130096A Test structure and test method for coupling capacitance of metal redundant fillers in integrated circuit |
| 07/20/2011 | CN102130095A Test pad structure and preparation method thereof, and wafer packaging structure and preparation method thereof |
| 07/20/2011 | CN102130093A Wiring circuit structure and manufacturing method for semiconductor device using the structure |
| 07/20/2011 | CN102130092A Fuse device and preparation method thereof |
| 07/20/2011 | CN102130091A Composite through-hole interconnecting structure for integrated circuit chip and preparation method thereof |
| 07/20/2011 | CN102130090A Chip package and method for fabricating the same |
| 07/20/2011 | CN102130089A Chip package and method for fabricating the same |
| 07/20/2011 | CN102130088A Semiconductor packaging structure and making method thereof |
| 07/20/2011 | CN102130087A Three-dimensional integrated circuit metallic conductor rail and preparation method thereof |
| 07/20/2011 | CN102130085A Semiconductor package with electrical connection structure and manufacturing method thereof |
| 07/20/2011 | CN102130084A Semiconductor chip assembly with a post/base heat spreader and a signal post |
| 07/20/2011 | CN102130083A Array-type fine-pitch connector |
| 07/20/2011 | CN102130078A Heat-conducting insulated composite film and chip stacking structures |
| 07/20/2011 | CN102130073A Advanced quad flat non-leaded package structure and manufacturing method thereof |
| 07/20/2011 | CN102130072A 承载板及其制法 Bearing plate Jiqizhifa |
| 07/20/2011 | CN102130071A Chip package and fabrication method thereof |
| 07/20/2011 | CN102130066A Wafer-level chip scale package and method for fabricating and using the same |
| 07/20/2011 | CN102130065A Manufacturing method of gates of EEPROM (Electrically Erasable Programmable Read-Only Memory) and gates manufactured by using same |
| 07/20/2011 | CN102130064A Method for regulating height of isolation structures in EEPROM |
| 07/20/2011 | CN102130063A Semiconductor device and production method thereof |
| 07/20/2011 | CN102130062A Manufacturing method of memory |
| 07/20/2011 | CN102130061A Method for making integrated silicon on insulator (SOI) laterally diffused metal oxide semiconductor (LDMOS) device with double vertical channels |
| 07/20/2011 | CN102130060A Method for producing high-voltage grid drive chip for directly driving power device |