| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 07/28/2011 | US20110180402 Vacuum Processing Apparatus |
| 07/28/2011 | US20110180212 Plasma Processing Chamber for Bevel Edge Processing |
| 07/28/2011 | US20110180132 Texturing and damage etch of silicon single crystal (100) substrates |
| 07/28/2011 | US20110179861 Capacitive humidity detector with nanoporous hydrophilic dielectric |
| 07/28/2011 | US20110179852 Molecule Detection Device Formed in a Semiconductor Structure |
| 07/28/2011 | DE19927286B4 Verwendung einer Schleiflösung zum chemisch-mechanischen Polieren einer Edelmetall-Oberfläche Use of a grinding solution for chemical mechanical polishing a noble metal surface |
| 07/28/2011 | DE112009002118T5 Verfahren zum Formen von aluminiumdotierten Metall-Carbonitrid-Gate-Elektroden A process for forming aluminum-doped metal carbonitride gate electrodes |
| 07/28/2011 | DE112009001988T5 Verfahren zur Bestimmung einer Anwendungsgrenze einer elektrostatischen Haltevorrichtung A method for determining an application limit of a electrostatic chuck |
| 07/28/2011 | DE112009001334T5 Photovoltaische Zelle hohen Wirkungsgrads und Herstellungsverfahren frei von Metalldisulfidsperrmaterial A photovoltaic cell high efficiency and manufacturing processes free from Metalldisulfidsperrmaterial |
| 07/28/2011 | DE112004002266B4 Dielektrischer Film mit sehr geringer Dielektrizitätskonstante für Kupferverbindungen Dielectric film with a very low dielectric constant for copper compounds |
| 07/28/2011 | DE112004001402B4 Vorrichtung zum thermischen Behandeln eines Substrats An apparatus for thermally treating a substrate |
| 07/28/2011 | DE10394372B4 Verfahren zur Herstellung einer Halbleitervorrichtung A process for producing a semiconductor device |
| 07/28/2011 | DE10350162B4 Halbleiterbauteil Semiconductor device |
| 07/28/2011 | DE10333248B4 Verwendung einer zweiten Belichtung zum Unterstützen einer PSM-Belichtung beim Drucken eines engen Bereichs angrenzend an eine grosse Struktur Using a second exposure for supporting PSM exposure when printing a narrow range adjacent to a large structure |
| 07/28/2011 | DE10330047B4 Halbleitersensor für eine dynamische Größe Semiconductor sensor dynamic quantity |
| 07/28/2011 | DE10323242B4 Verfahren zur Herstellung einer Halbleitervorrichtung mit epitaktisch gefülltem Graben und Halbleitervorrichtung mit epitaktisch gefülltem Graben A method of manufacturing a semiconductor device having epitaxially filled trench and the semiconductor device with epitaxially filled trench |
| 07/28/2011 | DE102011008457A1 Siliziumplättchen-Stapelpaket auf Waferebene Silicon wafer stack package at the wafer level |
| 07/28/2011 | DE102010005904A1 Verfahren zur Herstellung einer Halbleiterscheibe A process for producing a semiconductor wafer |
| 07/28/2011 | DE102010005771A1 Verbesserung der Ebenheit durch Freischnitte an den Prägen Improve the flatness by free cuts on the embossing |
| 07/28/2011 | DE102010005202A1 Magazine cartridge for receiving photovoltaic wafer and/or solar cell stack in wafer magazine in production plant, has holding units vertically protruding from bottom, holding wafer and/or stack and designed as side walls |
| 07/28/2011 | DE102010001077A1 Method for manufacturing surface-mountable sensor chip e.g. differential pressure sensor chip, involves mounting sensor chip on film, by providing gel into recess of chip, where recess corresponds to aperture in film |
| 07/28/2011 | DE102009047027B3 Vorrichtung zum Herstellen von Materialscheiben Apparatus for producing slices of material |
| 07/28/2011 | DE102008063432B4 Verfahren zum Einstellen der Verformung, die in einem Transistorkanal eines FET hervorgerufen wird, durch für die Schwellwerteinstellung vorgesehenes Halbleitermaterial A method of adjusting the deformation, which is caused in a transistor channel of a FET, by provided for the threshold value setting semiconductor material |
| 07/28/2011 | DE102008042772B4 Verfahren zum elektrischen Verbinden eines LED-Feldes und LED-Verbindungsvorrichtung A method for electrically connecting a LED array and LED connecting device |
| 07/28/2011 | DE102008011799B4 Halbleitervorrichtung und Verfahren zum Herstellen einer Halbleitervorrichtung A semiconductor device and method of manufacturing a semiconductor device |
| 07/28/2011 | DE102007057686B4 Verfahren und Halbleiterbauelement mit einer Schutzschicht zum Reduzieren der Verspannungsrelaxation in einer Doppelverspannungsbeschichtungstechnik The method and semiconductor device with a protective layer to reduce the stress relaxation in a dual tension coating technique |
| 07/28/2011 | DE102007025342B4 Höheres Transistorleistungsvermögen von N-Kanaltransistoren und P-Kanaltransistoren durch Verwenden einer zusätzlichen Schicht über einer Doppelverspannungsschicht Higher transistor performance of N-channel transistors and P-channel transistors by using an additional layer over a double strain layer |
| 07/28/2011 | DE102006012447B4 Verfahren zur Herstellung einer Transistorstruktur A process for producing a transistor structure |
| 07/28/2011 | DE102005030585B4 Halbleiterbauelement mit einem vertikalen Entkopplungskondensator und Verfahren zu seiner Herstellung A semiconductor device with a vertical decoupling capacitor and process for its preparation |
| 07/28/2011 | DE102005016439B4 Halbleiterbauelementpackung und Herstellungsverfahren Semiconductor device package and manufacturing method |
| 07/28/2011 | DE102004059620B4 Halbleitervorrichtung Semiconductor device |
| 07/28/2011 | DE102004030920B4 Verfahren zum Bilden einer Grabenisolationsschicht in einem Halbleiterbauelement A method of forming a grave insulating layer in a semiconductor device |
| 07/28/2011 | DE102004024643B4 Werkstückteilungsverfahren unter Verwendung eines Laserstrahls Workpiece dividing method using a laser beam |
| 07/28/2011 | DE10194689B4 Nichtflüchtige Halbleiterspeicher mit zwei Speichereinheiten und Verfahren zu deren Herstellung A non-volatile semiconductor memory comprising two memory units and methods for their preparation |
| 07/28/2011 | CA2787091A1 Electrode array and method of fabrication |
| 07/28/2011 | CA2786882A1 Flip-chip mounting structure and flip-chip mounting method |
| 07/28/2011 | CA2782310A1 Method of removing/preventing redeposition of protein soils |
| 07/28/2011 | CA2777675A1 Silicon carbide semiconductor device and method of manufacturing thereof |
| 07/27/2011 | EP2348546A2 Composition for forming n-type diffusion layer, method for forming n-type diffusion layer, and method for producing photovoltaic cell |
| 07/27/2011 | EP2348545A2 Manufacturing method for flexible device, flexible device, solar cell, and light emitting device |
| 07/27/2011 | EP2348544A2 Buffer layer manufacturing method and photoelectric conversion device |
| 07/27/2011 | EP2348530A1 Silicon carbide semiconductor device |
| 07/27/2011 | EP2348527A1 Method for annealing a structure |
| 07/27/2011 | EP2348526A2 Substrate for electronic device, stack for electronic device, electronic device, and method for manufacturing the same |
| 07/27/2011 | EP2348525A1 Wiring forming method |
| 07/27/2011 | EP2348524A2 Method and apparatus for recovering pattern on silicon substrate |
| 07/27/2011 | EP2348087A1 Adhesive composition, circuit connecting material and connecting structure of circuit member |
| 07/27/2011 | EP2348080A1 Polishing composition and polishing method using the same |
| 07/27/2011 | EP2347439A2 Front end of line plasma mediated ashing processes and apparatus |
| 07/27/2011 | EP2347438A1 Method of nonstoichiometric cvd dielectric film surface passivation for film roughness control |
| 07/27/2011 | EP2347437A1 Integrated capacitor with array of crosses |
| 07/27/2011 | EP2347436A1 Integrated capacitor with alternating layered segments |
| 07/27/2011 | EP2347435A1 Integrated capacitor with grid plates |
| 07/27/2011 | EP2347434A1 Composite substrate for a semiconductor chip |
| 07/27/2011 | EP2347433A1 Method for the mechanical characterisation of production machines for fracturable materials |
| 07/27/2011 | EP1926843B1 Doping of particulate semiconductor materials |
| 07/27/2011 | EP1908099B1 Semi-conductor substrate and method and masking layer for producing a free-standing semi-conductor substrate by means of hydride-gas phase epitaxy |
| 07/27/2011 | EP1860477B1 Projection optical system, exposure equipment and device manufacturing method |
| 07/27/2011 | EP1860207B1 Process for target production |
| 07/27/2011 | EP1844495B1 Manufacturing method for semiconductor chips |
| 07/27/2011 | EP1756244B1 Cerium oxide abrasive and slurry containing the same |
| 07/27/2011 | EP1745515B1 Tuneable semiconductor device |
| 07/27/2011 | EP1728287B1 Combination insulator and organic semiconductor formed from self-assembling block co-polymers |
| 07/27/2011 | EP1711958B1 Method for forming a capacitor with a locally increased dielectric constant and an interlayer dielectric with a low dielectric constant |
| 07/27/2011 | EP1700341B1 Wafer with optical control modules in ic fields |
| 07/27/2011 | EP1599908B1 Method of manufacturing a non-volatile memory cell with a lateral select gate |
| 07/27/2011 | EP1599578B1 Methods for preventing gluconoylation of proteins |
| 07/27/2011 | EP1470207B1 Aqueous stripping and cleaning composition |
| 07/27/2011 | EP1436846B1 Mos devices and corresponding manufacturing methods and circuits |
| 07/27/2011 | EP1323185B1 Method of fabricating an oxide layer on a silicon carbide layer utilizing n2o |
| 07/27/2011 | EP1275139B1 Uv pretreatment process of ultra-thin oxynitride for formation of silicon nitride films |
| 07/27/2011 | EP1177479B1 Streamlined ic mask layout optical and process correction through correction reuse |
| 07/27/2011 | CN201910439U Center positioning table for glass substrate in production line of manufacturing solar battery |
| 07/27/2011 | CN201910423U N-type silicon-on-insulator transverse device capable of improving current density |
| 07/27/2011 | CN201910414U Ultrathin wafer moving device |
| 07/27/2011 | CN201910413U Automatic transmission device for supports and automatic loading system for supports |
| 07/27/2011 | CN201910412U Silicon wafer conveying and guiding structure |
| 07/27/2011 | CN201910411U Silicon wafer carrier frame |
| 07/27/2011 | CN201910410U Modified reinforced structure for sheet placing rack |
| 07/27/2011 | CN201910409U Multi-row trimming and forming die for integrated circuit |
| 07/27/2011 | CN201910408U Removing device of oxide film at 8-inch wafer notch |
| 07/27/2011 | CN201910407U Etching equipment |
| 07/27/2011 | CN201910406U Correcting and flattening device for high-precision strip positioning system of marking machine |
| 07/27/2011 | CN201910405U Vacuum processing system for processing SOI (silicon on insulator) structure |
| 07/27/2011 | CN1988143B Semiconductor device and manufacturing method of the same |
| 07/27/2011 | CN1983025B Fabrication method for photomask, fabrication method for device and monitoring method for photomask |
| 07/27/2011 | CN1979877B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 07/27/2011 | CN1971939B Repairing pixel defect of display device |
| 07/27/2011 | CN1933098B Mask for continuous transverse crystallizing technology and method using the same mask |
| 07/27/2011 | CN1893108B Flat panel display and method of fabricating the same |
| 07/27/2011 | CN1886032B Multilayered structure forming method |
| 07/27/2011 | CN1873918B Diffusion process method of ion implantation in use for gate electrode capable of switching off thyristor |
| 07/27/2011 | CN1692450B Non-volatile memory and write method of the same |
| 07/27/2011 | CN102138226A Method and arrangement for producing a functional layer on a semiconductor component |
| 07/27/2011 | CN102138218A Resin composition, gate insulating layer and organic thin film transistor |
| 07/27/2011 | CN102138217A Power MOSFET with a gate structure of different material |
| 07/27/2011 | CN102138212A Semiconductor device, electronic apparatus using semiconductor device and method for manufacturing semiconductor device |
| 07/27/2011 | CN102138211A Body contact for SRAM cell comprising double-channel transistors |
| 07/27/2011 | CN102138210A Shallow trench isolating structure having an air gap, a cmos image sensor employing the same, and a production method therefor |
| 07/27/2011 | CN102138209A Method of adjusting velocity of transfer member, method of transferring substrate using the method, and substrate-processing apparatus |