Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883) |
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05/28/2008 | CN101187044A Stainless steel surface large area brush Pd-electroplating process |
05/28/2008 | CN101187005A Plating method |
05/28/2008 | CN101186134A Thermal barrier coating and preparation method thereof |
05/28/2008 | CN100390326C Preparation method of composite cladding material and equipment |
05/28/2008 | CN100390304C Laser strengthening and toughening method for interface between ground-mass and coating |
05/27/2008 | US7378004 Pad designs and structures for a versatile materials processing apparatus |
05/22/2008 | WO2008059971A1 Multilayer alloy coating film, heat-resistant metal member having the same, and method for producing multilayer alloy coating film |
05/22/2008 | US20080117711 Vibratingly Stirring Apparatus, and Device and Method for Processing Using the Stirring Apparatus |
05/22/2008 | US20080116079 Method of manufacturing a wiring board by utilizing electro plating |
05/22/2008 | US20080116078 Electroplating; heat treatment; durability |
05/22/2008 | US20080116077 System and method for solder bump plating |
05/22/2008 | US20080116076 Via thiosulfate conductor |
05/22/2008 | US20080116075 Method of Assessing the Risk of Whiskers Appearing on the Surface of a Metallic Deposit |
05/22/2008 | US20080116062 Electroplating system and method |
05/22/2008 | CA2669941A1 Multilayer alloy coating film, heat-resistant metal member having the same, and method for producing multilayer alloy coating film |
05/21/2008 | EP1923489A2 A multilayer printed circuit board and a process for manufacturing the same |
05/21/2008 | EP1923488A2 A process for manufacturing a multilayer printed circuit board |
05/21/2008 | EP1922742A2 Method for bonding titanium based mesh to a titanium based substrate |
05/21/2008 | CN201062288Y Thermostable copper-tin alloy electric plating body |
05/21/2008 | CN101182642A Method of electroplating combined vacuum coating preparing Au-Sn alloy solder |
05/20/2008 | US7374654 removing portions of an electrode pad formed on dielectric layers, to form recesses and forming an active portion of an organic memory cell in the recessed area |
05/20/2008 | US7374652 Plating method |
05/20/2008 | US7374651 Using electrode having controlled crystal grain size |
05/15/2008 | WO2008056403A1 Direct plating method and solution for palladium conductor layer formation |
05/15/2008 | WO2006114429A3 Plastic objects for metal-plating with improved shaping properties |
05/15/2008 | US20080110857 Method of Electrochemical Fabrication |
05/15/2008 | US20080110856 Manufacture of devices having complex structures by selective electroplating of layers that include both structural materials (metals) and support (sacrificial) materials; removal(etching, melting, or electrolytically dissolving) of the support defines a microscopicelement for an electrical device |
05/15/2008 | US20080110759 patterned features are filled with metal before significant overburden can be formed over the flat upper surface areas; constant plating voltage |
05/15/2008 | US20080110751 Microelectronic Workpiece Processing Tool Including A Processing Reactor Having A Paddle Assembly for Agitation of a Processing Fluid Proximate to the Workpiece |
05/15/2008 | US20080110486 Amorphous-crystalline tandem nanostructured solar cells |
05/15/2008 | DE10241137B4 Verfahren zur Metallisierung von Kunststoffen Process for the metallization of plastics |
05/15/2008 | DE102006035660A9 Korrosionsschutzschicht mit verbesserten Eigenschaften Anti-corrosion layer having improved properties |
05/14/2008 | EP1920180A1 Threaded joint for steel pipes |
05/14/2008 | EP1920088A1 Method for producing a composite body with an electrodeposited coating under internal compressive stress |
05/14/2008 | EP1919703A2 Compositionally modulated composite materials and methods for making the same |
05/14/2008 | CN101177803A Method for preparing nano carbon fiber |
05/14/2008 | CN101177783A Button cell cathode cover exterior conducting surface plating method |
05/14/2008 | CN100388572C Partial electric plating method for box type structure jack contact of electric connector |
05/14/2008 | CN100387758C Brazing sheet product and method of its manufacture |
05/14/2008 | CN100387757C Method for electroplating magnesium and magnesium alloy |
05/14/2008 | CN100387756C Method for improving the bonding strength between nickel or nickel alloy cast layers in laminated micro devices |
05/14/2008 | CN100387735C Method and equipment for manufacturing material of magnesium alloy |
05/13/2008 | US7372616 Complex microdevices and apparatus and methods for fabricating such devices |
05/13/2008 | US7370415 Manufacturing method of ink-jet head |
05/08/2008 | WO2008053878A1 Surface treated copper foil, surface treated copper foil with very thin primer resin layer, method for manufacturing the surface treated copper foil, and method for manufacturing the surface treated copper foil with very thin primer resin layer |
05/08/2008 | US20080107805 Fine-Grained metallic coatings having the coefficient of thermal expansion matched to the one of the substrate |
05/08/2008 | US20080105647 Methods for Electrochemically Fabricating Structures Using Adhered Masks, Incorporating Dielectric Sheets, and/or Seed layers That Are Partially Removed Via Planarization |
05/08/2008 | US20080105646 Multi-step Release Method for Electrochemically Fabricated Structures |
05/08/2008 | US20080105560 Dipping conductive substrate in electroplating solution containing metallic ions and performing electroplating process to reduce ions to nano metallic particles on conductive substrate; particles can be used as catalyst to perform chemical vapor deposition process to form carbon nanotubes on substrate |
05/08/2008 | US20080105559 Method for a surface being plated locally |
05/08/2008 | US20080105558 Electrochemically Fabricated Hermetically Sealed Microstructures and Methods of and Apparatus for Producing Such Structures |
05/08/2008 | US20080105556 Method and apparatus for electrowinning copper using the ferrous/ferric anode reaction and a flow-through anode |
05/08/2008 | US20080105555 Plating Device, Plating Method, Semiconductor Device, And Method For Manufacturing Semiconductor Device |
05/08/2008 | US20080105554 Apparatus And A Method For Tapping Metal |
05/08/2008 | US20080105553 Produces deposit including tungsten, chromium, molybdenum, tantalum, titanium, zirconium, vanadium, hafnium, and niobium refractory metals as a main component with high purity, and high density and having a smooth surface |
05/08/2008 | US20080105362 Method for Electrolytic Engineering of Nano-Particulate Layers |
05/08/2008 | DE102006042268B3 Galvanizing decoration elements laterally fastened on a base element of a multipart composite plastic component for decorating symbols or structures on panels in automobiles, comprises forming a contact element for galvanizing the elements |
05/07/2008 | EP1919266A2 Electroless plating solution, electroless plating process, and printed circuit board |
05/07/2008 | EP1918425A1 Greyish chromium surface |
05/07/2008 | EP1680535A4 Electroplating compositions and methods for electroplating |
05/07/2008 | CN101173366A Plastic rubber product plating production method |
05/07/2008 | CN101173365A Shell electroplating method and shell produced with the electroplating method |
05/07/2008 | CN100386825C Method for improving critical current density of Bi-2223 strip material |
05/07/2008 | CN100386474C Fountain bed with fluid contacting with substance |
05/06/2008 | US7368326 Methods and apparatus to reduce growth formations on plated conductive leads |
05/06/2008 | US7368176 Metal-graphite composite material having a substrate with a surface having a carbon fiber content which is 10% or less of the carbon fiber content of the material, metal-containing intermediate layer (especially a zincate), and a metal coating (aluminum or alloy); hermetically sealed; corrosion resistant |
05/06/2008 | US7368047 Method of preparing copper plating layer having high adhesion to magnesium alloy using electroplating |
05/06/2008 | US7368046 Electrodeposition of an overlay of Cu, Ag and Bi on a bearing metal layer of a Cu or Al alloy covered by Ni intermediate layer from a solution containing methanesulfonates of Ag, Cu and Bi; methanesulfonic acid; nonionic wetting agent; grain refining agent; resorcinol; and thiourea; wear resistance |
05/06/2008 | US7368045 Gate stack engineering by electrochemical processing utilizing through-gate-dielectric current flow |
05/06/2008 | US7368044 Non-conformable masks and methods and apparatus for forming three-dimensional structures |
05/01/2008 | US20080102409 Inductor for a system-on-a-chip and a method for manufacturing the same |
05/01/2008 | US20080102251 Electrodeposition of electroconductive metals on wafers, panels, magnetic heads or substrates having cavities, by applying power and electrolyte solutions to the surfaces; integrated circuits; chemical mechanical polishing |
05/01/2008 | US20080102219 coating an electroconductive metal onto the metal surface of a self-metallized polymeric film, by electrodeposition or electroless deposition; bonding strength and improved conductivity |
05/01/2008 | US20080099344 Immersing a contact electrode in a solution;contacting the surface of the conductive layer with the contact solution to define a contact region;immersing a process electrode in a process solution;contacting the surface of the conductive layer with the process solution, applying an electrical potential |
05/01/2008 | US20080099341 Process for protectively coating hydraulic microcircuits against aggressive liquids, particulary for an ink jet printhead |
05/01/2008 | US20080099340 Substrate processing apparatus and substrate processing method |
05/01/2008 | US20080099339 Forming a suspension of pre-formed nanostructure-containing material in a liquid medium; adding a charger, immersing the electrode and the multilayer structure in the suspension, applying a current to the electrode and the multilayer structure |
05/01/2008 | US20080099338 Depositing a first pattern onto a substrate using the first mask to forming a first layer, removing the first mask, depositing a second material, building additional layers adjacent to and adhered to previously formed layers; removing undesired elements of material via etching or electropolishing |
04/30/2008 | EP1915473A2 Pretreatment of magnesium substrates for electroplating |
04/30/2008 | EP1542505B1 Metal based resistance heating element and method for preparation thereof |
04/30/2008 | CN201053039Y Electrodeposition device for preparing spherical nano-crystal nickel-iron coat |
04/29/2008 | US7364649 Method of producing the keytop for pushbutton switch |
04/24/2008 | US20080096044 uniform copper plating layer on silver mesh by using a plating solution containing copper sulfate pentahydrate having a copper content of 150 to 300 g/l and can form a plating layer of satisfactory thickness by electroplating to accomplish an efficient plating job without relying on electroless plating |
04/24/2008 | US20080093221 Roll-To-Roll Electroplating for Photovoltaic Film Manufacturing |
04/24/2008 | US20080092592 Made in aluminium with at least one portion of its surface coated with a layer of either hard aluminium oxide or hard titanium oxides; has smooth and reflecting surface; lightweight and strong; scratch proof and shock resistant, antiallergic |
04/24/2008 | DE102006048909A1 Method for galvanically coating a component with a chromium layer used in vehicle construction comprises depositing chromium atoms onto the surface of the component during a cathodic current impulse and further processing |
04/23/2008 | EP1913651A1 Electrode grid |
04/23/2008 | EP1606107A4 Composite article comprising a ceramic coating |
04/23/2008 | CN101165221A Long copper row continuous moving jet tin plating method and device |
04/23/2008 | CN100383290C Method of coating metal layer on roller surface of biroller thin belt continuous casting machine |
04/22/2008 | US7361256 Electrolytic reactor |
04/17/2008 | WO2008045184A1 Polymer-free coatings for medical devices formed by plasma electrolytic deposition |
04/17/2008 | WO2008044763A1 Tab lead material and process for producing the same |
04/17/2008 | US20080087550 Includes electrolysis of a solution containing an adhesion primer in contact with a surface followed by a reaction at the surface obtained, of a solution containing a protic solvent, and a radically polymerizable monomer |
04/17/2008 | US20080087549 Comprising a nitrogen-containing biphenyl derivative; can fill through holes or via holes at a micron or sub-micron level even in a case where it consists of one component; can be prepared and handled extremely easily and can stably fill the through holes or via holes for a long time |
04/16/2008 | CN201046996Y Apparatus for preparing metal surface abrasion self-repairing coating |
04/16/2008 | CN101161866A Magnesium and method for preparing magnesium alloy surface coating |
04/10/2008 | WO2008041720A1 Process for producing metal clad laminate |
04/10/2008 | WO2008041516A1 Electroplating method |
04/10/2008 | WO2008040761A2 Electroforming method and part or layer obtained using said method |