Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883)
05/2008
05/28/2008CN101187044A Stainless steel surface large area brush Pd-electroplating process
05/28/2008CN101187005A Plating method
05/28/2008CN101186134A Thermal barrier coating and preparation method thereof
05/28/2008CN100390326C Preparation method of composite cladding material and equipment
05/28/2008CN100390304C Laser strengthening and toughening method for interface between ground-mass and coating
05/27/2008US7378004 Pad designs and structures for a versatile materials processing apparatus
05/22/2008WO2008059971A1 Multilayer alloy coating film, heat-resistant metal member having the same, and method for producing multilayer alloy coating film
05/22/2008US20080117711 Vibratingly Stirring Apparatus, and Device and Method for Processing Using the Stirring Apparatus
05/22/2008US20080116079 Method of manufacturing a wiring board by utilizing electro plating
05/22/2008US20080116078 Electroplating; heat treatment; durability
05/22/2008US20080116077 System and method for solder bump plating
05/22/2008US20080116076 Via thiosulfate conductor
05/22/2008US20080116075 Method of Assessing the Risk of Whiskers Appearing on the Surface of a Metallic Deposit
05/22/2008US20080116062 Electroplating system and method
05/22/2008CA2669941A1 Multilayer alloy coating film, heat-resistant metal member having the same, and method for producing multilayer alloy coating film
05/21/2008EP1923489A2 A multilayer printed circuit board and a process for manufacturing the same
05/21/2008EP1923488A2 A process for manufacturing a multilayer printed circuit board
05/21/2008EP1922742A2 Method for bonding titanium based mesh to a titanium based substrate
05/21/2008CN201062288Y Thermostable copper-tin alloy electric plating body
05/21/2008CN101182642A Method of electroplating combined vacuum coating preparing Au-Sn alloy solder
05/20/2008US7374654 removing portions of an electrode pad formed on dielectric layers, to form recesses and forming an active portion of an organic memory cell in the recessed area
05/20/2008US7374652 Plating method
05/20/2008US7374651 Using electrode having controlled crystal grain size
05/15/2008WO2008056403A1 Direct plating method and solution for palladium conductor layer formation
05/15/2008WO2006114429A3 Plastic objects for metal-plating with improved shaping properties
05/15/2008US20080110857 Method of Electrochemical Fabrication
05/15/2008US20080110856 Manufacture of devices having complex structures by selective electroplating of layers that include both structural materials (metals) and support (sacrificial) materials; removal(etching, melting, or electrolytically dissolving) of the support defines a microscopicelement for an electrical device
05/15/2008US20080110759 patterned features are filled with metal before significant overburden can be formed over the flat upper surface areas; constant plating voltage
05/15/2008US20080110751 Microelectronic Workpiece Processing Tool Including A Processing Reactor Having A Paddle Assembly for Agitation of a Processing Fluid Proximate to the Workpiece
05/15/2008US20080110486 Amorphous-crystalline tandem nanostructured solar cells
05/15/2008DE10241137B4 Verfahren zur Metallisierung von Kunststoffen Process for the metallization of plastics
05/15/2008DE102006035660A9 Korrosionsschutzschicht mit verbesserten Eigenschaften Anti-corrosion layer having improved properties
05/14/2008EP1920180A1 Threaded joint for steel pipes
05/14/2008EP1920088A1 Method for producing a composite body with an electrodeposited coating under internal compressive stress
05/14/2008EP1919703A2 Compositionally modulated composite materials and methods for making the same
05/14/2008CN101177803A Method for preparing nano carbon fiber
05/14/2008CN101177783A Button cell cathode cover exterior conducting surface plating method
05/14/2008CN100388572C Partial electric plating method for box type structure jack contact of electric connector
05/14/2008CN100387758C Brazing sheet product and method of its manufacture
05/14/2008CN100387757C Method for electroplating magnesium and magnesium alloy
05/14/2008CN100387756C Method for improving the bonding strength between nickel or nickel alloy cast layers in laminated micro devices
05/14/2008CN100387735C Method and equipment for manufacturing material of magnesium alloy
05/13/2008US7372616 Complex microdevices and apparatus and methods for fabricating such devices
05/13/2008US7370415 Manufacturing method of ink-jet head
05/08/2008WO2008053878A1 Surface treated copper foil, surface treated copper foil with very thin primer resin layer, method for manufacturing the surface treated copper foil, and method for manufacturing the surface treated copper foil with very thin primer resin layer
05/08/2008US20080107805 Fine-Grained metallic coatings having the coefficient of thermal expansion matched to the one of the substrate
05/08/2008US20080105647 Methods for Electrochemically Fabricating Structures Using Adhered Masks, Incorporating Dielectric Sheets, and/or Seed layers That Are Partially Removed Via Planarization
05/08/2008US20080105646 Multi-step Release Method for Electrochemically Fabricated Structures
05/08/2008US20080105560 Dipping conductive substrate in electroplating solution containing metallic ions and performing electroplating process to reduce ions to nano metallic particles on conductive substrate; particles can be used as catalyst to perform chemical vapor deposition process to form carbon nanotubes on substrate
05/08/2008US20080105559 Method for a surface being plated locally
05/08/2008US20080105558 Electrochemically Fabricated Hermetically Sealed Microstructures and Methods of and Apparatus for Producing Such Structures
05/08/2008US20080105556 Method and apparatus for electrowinning copper using the ferrous/ferric anode reaction and a flow-through anode
05/08/2008US20080105555 Plating Device, Plating Method, Semiconductor Device, And Method For Manufacturing Semiconductor Device
05/08/2008US20080105554 Apparatus And A Method For Tapping Metal
05/08/2008US20080105553 Produces deposit including tungsten, chromium, molybdenum, tantalum, titanium, zirconium, vanadium, hafnium, and niobium refractory metals as a main component with high purity, and high density and having a smooth surface
05/08/2008US20080105362 Method for Electrolytic Engineering of Nano-Particulate Layers
05/08/2008DE102006042268B3 Galvanizing decoration elements laterally fastened on a base element of a multipart composite plastic component for decorating symbols or structures on panels in automobiles, comprises forming a contact element for galvanizing the elements
05/07/2008EP1919266A2 Electroless plating solution, electroless plating process, and printed circuit board
05/07/2008EP1918425A1 Greyish chromium surface
05/07/2008EP1680535A4 Electroplating compositions and methods for electroplating
05/07/2008CN101173366A Plastic rubber product plating production method
05/07/2008CN101173365A Shell electroplating method and shell produced with the electroplating method
05/07/2008CN100386825C Method for improving critical current density of Bi-2223 strip material
05/07/2008CN100386474C Fountain bed with fluid contacting with substance
05/06/2008US7368326 Methods and apparatus to reduce growth formations on plated conductive leads
05/06/2008US7368176 Metal-graphite composite material having a substrate with a surface having a carbon fiber content which is 10% or less of the carbon fiber content of the material, metal-containing intermediate layer (especially a zincate), and a metal coating (aluminum or alloy); hermetically sealed; corrosion resistant
05/06/2008US7368047 Method of preparing copper plating layer having high adhesion to magnesium alloy using electroplating
05/06/2008US7368046 Electrodeposition of an overlay of Cu, Ag and Bi on a bearing metal layer of a Cu or Al alloy covered by Ni intermediate layer from a solution containing methanesulfonates of Ag, Cu and Bi; methanesulfonic acid; nonionic wetting agent; grain refining agent; resorcinol; and thiourea; wear resistance
05/06/2008US7368045 Gate stack engineering by electrochemical processing utilizing through-gate-dielectric current flow
05/06/2008US7368044 Non-conformable masks and methods and apparatus for forming three-dimensional structures
05/01/2008US20080102409 Inductor for a system-on-a-chip and a method for manufacturing the same
05/01/2008US20080102251 Electrodeposition of electroconductive metals on wafers, panels, magnetic heads or substrates having cavities, by applying power and electrolyte solutions to the surfaces; integrated circuits; chemical mechanical polishing
05/01/2008US20080102219 coating an electroconductive metal onto the metal surface of a self-metallized polymeric film, by electrodeposition or electroless deposition; bonding strength and improved conductivity
05/01/2008US20080099344 Immersing a contact electrode in a solution;contacting the surface of the conductive layer with the contact solution to define a contact region;immersing a process electrode in a process solution;contacting the surface of the conductive layer with the process solution, applying an electrical potential
05/01/2008US20080099341 Process for protectively coating hydraulic microcircuits against aggressive liquids, particulary for an ink jet printhead
05/01/2008US20080099340 Substrate processing apparatus and substrate processing method
05/01/2008US20080099339 Forming a suspension of pre-formed nanostructure-containing material in a liquid medium; adding a charger, immersing the electrode and the multilayer structure in the suspension, applying a current to the electrode and the multilayer structure
05/01/2008US20080099338 Depositing a first pattern onto a substrate using the first mask to forming a first layer, removing the first mask, depositing a second material, building additional layers adjacent to and adhered to previously formed layers; removing undesired elements of material via etching or electropolishing
04/2008
04/30/2008EP1915473A2 Pretreatment of magnesium substrates for electroplating
04/30/2008EP1542505B1 Metal based resistance heating element and method for preparation thereof
04/30/2008CN201053039Y Electrodeposition device for preparing spherical nano-crystal nickel-iron coat
04/29/2008US7364649 Method of producing the keytop for pushbutton switch
04/24/2008US20080096044 uniform copper plating layer on silver mesh by using a plating solution containing copper sulfate pentahydrate having a copper content of 150 to 300 g/l and can form a plating layer of satisfactory thickness by electroplating to accomplish an efficient plating job without relying on electroless plating
04/24/2008US20080093221 Roll-To-Roll Electroplating for Photovoltaic Film Manufacturing
04/24/2008US20080092592 Made in aluminium with at least one portion of its surface coated with a layer of either hard aluminium oxide or hard titanium oxides; has smooth and reflecting surface; lightweight and strong; scratch proof and shock resistant, antiallergic
04/24/2008DE102006048909A1 Method for galvanically coating a component with a chromium layer used in vehicle construction comprises depositing chromium atoms onto the surface of the component during a cathodic current impulse and further processing
04/23/2008EP1913651A1 Electrode grid
04/23/2008EP1606107A4 Composite article comprising a ceramic coating
04/23/2008CN101165221A Long copper row continuous moving jet tin plating method and device
04/23/2008CN100383290C Method of coating metal layer on roller surface of biroller thin belt continuous casting machine
04/22/2008US7361256 Electrolytic reactor
04/17/2008WO2008045184A1 Polymer-free coatings for medical devices formed by plasma electrolytic deposition
04/17/2008WO2008044763A1 Tab lead material and process for producing the same
04/17/2008US20080087550 Includes electrolysis of a solution containing an adhesion primer in contact with a surface followed by a reaction at the surface obtained, of a solution containing a protic solvent, and a radically polymerizable monomer
04/17/2008US20080087549 Comprising a nitrogen-containing biphenyl derivative; can fill through holes or via holes at a micron or sub-micron level even in a case where it consists of one component; can be prepared and handled extremely easily and can stably fill the through holes or via holes for a long time
04/16/2008CN201046996Y Apparatus for preparing metal surface abrasion self-repairing coating
04/16/2008CN101161866A Magnesium and method for preparing magnesium alloy surface coating
04/10/2008WO2008041720A1 Process for producing metal clad laminate
04/10/2008WO2008041516A1 Electroplating method
04/10/2008WO2008040761A2 Electroforming method and part or layer obtained using said method
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