Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883)
07/2008
07/03/2008US20080156653 aqua solution added with copper ions, hydroxyl ions, a complexing agent and an additive selected from the group consisting of sodium phosphate, sodium hypophosphite, phosphoric acid and dissolvable salts derivative from phosphoric acid or hypophosphite acid
07/03/2008US20080156652 aqua solution added with copper ions, hydroxyl ions, a complexing agent and an additive selected from the group consisting of sodium phosphate, sodium hypophosphite, phosphoric acid and dissolvable salts derivative from phosphoric acid or hypophosphite acid
07/03/2008US20080156651 Method of forming phase change layer, method of manufacturing a storage node using the same, and method of manufacturing phase change memory device using the same
07/03/2008DE102005010095B4 Metallband mit niedrigem Ummagnetisierungsverlust und biaxialer Textur sowie Herstellungsverfahren dafür Metal band with low core loss and biaxial texture and manufacturing method thereof
07/02/2008EP1939329A1 Kit for the manufacture of a process reactor for forming metallic layers on one or more substrate
07/02/2008EP1937875A2 Electroplating composition for coating a substrate surface with a metal
07/02/2008EP1875279B1 A method of forming mirrors on a conducting substrate
07/02/2008CN101210334A Technique for treating plastic surface
07/02/2008CN101210327A Plastic surface copper plating agent and using method thereof
07/02/2008CN101210305A Tungsten alloy composite plating coat material and manufacturing method thereof
07/02/2008CN101209605A Surface processing copper foil
07/02/2008CN100398700C Surface cladding treatment method of ferro-manganese aluminium alloy
07/01/2008US7393594 Laminated metal thin plate formed by electrodeposition and method of producing the same
06/2008
06/26/2008WO2008076724A2 Method of forming yttrium-modified platinum aluminide diffusion coating
06/26/2008WO2008075723A1 Metal strip, connector and metal strip manufacturing method
06/26/2008US20080149489 Multistep immersion of wafer into liquid bath
06/26/2008US20080149487 Via Plating Method of System in Package and System Thereof
06/26/2008DE10131393B4 Herstellung von Gasseparatoren für Brennstoffzellen und dabei verwendete Apparatur Production of gas separators for fuel cells and apparatus used therein
06/25/2008EP1936009A1 Plating method
06/25/2008CN101206374A Infrared waveband ultra-material based on dendritic structure
06/25/2008CN101205624A Method for brushing pattern on surface of electroplating products
06/25/2008CN101204863A Thermal barrier coating system and method for coating a component
06/25/2008CN101204861A Titanium alloy parts protection and its preparation method and uses of hydrogen prevention crisp
06/25/2008CN100397718C 压配合端子 Press-fit terminal
06/25/2008CN100396823C Method and device for preparing coating or film using supersonic, water-heating and electrodeposition technology
06/25/2008CN100396822C Method and equipment for controlling local electric current to obtain uniform electroplating thickness
06/25/2008CN100396476C Glue squeezing device and method for making conductive foamed material and foamed nickel using the device
06/24/2008US7391116 Fretting and whisker resistant coating system and method
06/24/2008US7390383 Paddles and enclosures for enhancing mass transfer during processing of microfeature workpieces
06/24/2008US7390382 Reactors having multiple electrodes and/or enclosed reciprocating paddles, and associated methods
06/19/2008WO2008072617A1 Ni-PLATED STEEL SHEET AND METHOD FOR PRODUCING THE SAME
06/19/2008WO2008072418A1 Male terminal, and its manufacturing method
06/19/2008WO2008071298A1 Method fr the galvanic coating of workpieces in an electrolyte bath containing zinc
06/19/2008WO2008071239A1 Apparatus and process for single-side wet chemical and electrolytic treatment of goods
06/19/2008US20080142370 a mixture of acids, water soluble sulfur compounds, carbocyclic halogen compounds and polymers, used for electrodeposition of copper onto metal or plastic surfaces; printed circuits
06/19/2008US20080142369 holders for electronics formed by adhering a patterned layer of to a previously formed layer or substrate and repeating the adhesion operation several times to form a multilayer configuration containing electrodes, conductor and dielectrics
06/19/2008US20080142368 Resistive film on aluminum tube
06/19/2008US20080142367 Overcome the deleterious effect of superficial coating or oxide layers that interfere with the plating or etching of certain metal substrates; metal plating and etching of readily oxidizable substrates
06/19/2008DE10259187B4 Metallisierung von Kunststoffsubstraten und Lösung zum Beizen und Aktivieren Metallization of plastic substrates and solution for pickling and activating
06/19/2008DE102007020449A1 Device for the wet chemical, electrochemical or electrolytic treatment or for cleaning the lower side of a flat material comprises a treatment chamber with an overflow edge which forms a gap with a support for the material
06/19/2008DE102006060255A1 Verfahren zur galvanischen Beschichtung von Werkstücken in einem zinkhaltigen Elektrolytbad A method for electroplating of workpieces in a zinc-containing electrolyte
06/19/2008DE102006058753A1 Procedure for the electrolytic coating of surfaces of precision components, comprises coating the surface by an electrolytic solution and positioning an electrode in a small distance to the surface to be coated
06/18/2008EP1932952A1 Method of surface treatment for the inhibition of wiskers
06/18/2008EP1932057A2 Method of forming conductive tracks
06/18/2008CN101203631A Sn-plated copper alloy bar having excellent fatigue characteristics
06/18/2008CN101203627A Capsule element with tin as main constituent, capsule forming method and solder processing method
06/18/2008CN101202147A Addition magnetic field device for plating magnetic field brush
06/18/2008CN101201545A Pholithography and wafer forming by the same
06/18/2008CN101200126A Thermal-barrier coating and method for making same
06/17/2008USRE40386 Chrome plated parts and chrome plating method
06/12/2008WO2008070568A2 Apparatus and method for electroplating on a solar cell substrate
06/12/2008US20080140052 Article to be Inserted in a Body Cavity Having Biologically Inhibiting Surfaces and Use and Preparation of the Article
06/12/2008US20080138694 High-Temperature Fuel Cell System
06/12/2008US20080135415 Electrodeposition technique and apparatus to form selenium containing layers
06/12/2008US20080135414 Fuel cells; dielectrics
06/12/2008US20080135089 Graded hybrid amorphous silicon nanowire solar cells
06/12/2008DE10314502B4 Verfahren zum elektrolytischen Beschichten einer Halbleiterstruktur A method for electrolytic coating of a semiconductor structure
06/11/2008EP1930925A1 Process for partially galvanising a decorative or functional component made by injection moulding
06/11/2008EP1929068A1 Process for producing metal foams having uniform cell structure
06/11/2008EP1658393B1 Device and method for separating metals and/or metal alloys from metallo-organic electrolytes
06/11/2008CN101195925A Magnesium and method for electroplating copper on magnesium alloy surface
06/11/2008CN101195924A Plating product and method for producing the same
06/11/2008CN101195923A Plating diamond tool with glass hard high-strength tyre case material and production method thereof
06/11/2008CN101195208A Plating diamond tool with glass hard high-wearing feature and production method thereof
06/10/2008US7384535 Determining the quantity of brightener and leveler in a metal plating bath using plating bath samples of known and different quantity of the brightener and the leveler, but where the quantity differs from the quantity in the other bath samples
06/10/2008US7384532 Platable coating and plating process
06/10/2008US7384531 Aperture through the insulating layer exposes spring metal layer at an interconnect site with an interconnect mask around the site; conductive material is electroplated on the spring metal layer at the interconnect site to form a plated interconnect; the mask is then removed
06/10/2008US7384530 Methods for electrochemically fabricating multi-layer structures including regions incorporating maskless, patterned, multiple layer thickness depositions of selected materials
06/10/2008US7383844 Meniscus, vacuum, IPA vapor, drying manifold
06/10/2008US7383843 Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer
06/05/2008WO2008017423A3 Thermoplastic product and method for the production of a composite product with selective electroplating
06/05/2008US20080131721 Low hydrogen embrittlement zinc/nickel plating for high strength steels
06/05/2008US20080131708 Method for Imparting Hydrogen Resistance to Articles
06/05/2008US20080128288 Patternable rough surfaced substrate; thin etch stop layer of nickel; copper overlying etch stop; selectively etch to form wiring patterns; insulating layer; form contact openings; electroless plating metal onto rough insulator; electrolytic plating conductive wiring pattern over electroless layer
06/05/2008US20080128286 Electrochromic device based on layer by layer deposition
06/05/2008US20080128284 Molybdenum, copper, or iron oxides; nucleation pulse applied to an aqueous solution forming a plurality of chains of metal oxide nanoparticles; reduced in hydrogen gas to metal wire; sensors, biosensors, wiring of semiconductor quantum dots
06/05/2008US20080128019 Method of metallizing a solar cell substrate
06/05/2008DE112006001905T5 Käfig für Wälzlager und Wälzlager Cage for rolling bearings
06/04/2008EP1038990B1 Method of reducing elution of lead in lead containing copper alloys for drinking water service
06/04/2008CN101193501A Method for controlling plating layer thickness distribution in FPC making process
06/04/2008CN101193489A Plating part and its making method
06/04/2008CN101191246A Plating method for metal material
06/04/2008CN101190786A Nano metal particle and its nano carbon tube and its luminous element preparation method
06/04/2008CN100392155C Bath for galvanic deposition of gold and gold alloys, and use thereof
06/03/2008US7381318 Method of manufacturing biaxially textured metallic layer featured by electroplating on the surface of single-crystalline or quasi-single-crystalline metal surface, and articles therefrom
05/2008
05/29/2008WO2008062779A1 Resin composition for metal plating, molded article thereof, and metal-plated molded article
05/29/2008WO2008061555A1 Process for providing aluminium cookware with a copper coating
05/29/2008US20080124535 Surface-Structured Substrate And Production Thereof
05/29/2008US20080121618 Method of Electrochemical Fabrication
05/29/2008US20080121528 Forming an anodized layer having a thickness greater than a desired thickness; forming an electroconductive layer; removing conductive layer in a selected area to expose and remove the anodized layer until it has desired thickness; etching
05/29/2008US20080121526 Wafer substrate carrier; cell for confining chemical; anode having adjustable shape in cell; wherein space is formed between wafer or substrate held by carrier and anode having a height which can be selectively varied by adjusting shape; electrochemical plating and electrochemical mechanical polishing
05/29/2008US20080121263 Thermoelectric elements, method for manufacturing same, and use of same
05/29/2008DE10360206B4 Verfahren zum selektiven galvanischen Abscheiden in einer integrierten Schaltungsanordnung, insbesondere auf Kupfer, und integrierte Schaltungsanordnung A method of selectively electrodepositing in an integrated circuit arrangement, in particular copper, and integrated circuit arrangement
05/29/2008CA2670266A1 Process for providing aluminium cookware with a copper coating
05/28/2008EP1925696A2 Iron-gold barcode nanowire and manufacturing method thereof
05/28/2008EP1749122A4 Surface enhanced spectroscopy-active composite nanoparticles
05/28/2008CN101187051A Nano tungsten carbide and nano Teflon electric brush plating liquor preparation process and uses
05/28/2008CN101187047A Method for preparing Al2O3 film on medical use nickel-titanium alloy surface by micro-arc oxidation
05/28/2008CN101187046A Electroplating preparation method for copper cladded aluminum wire or copper cladded magnesium alloy wire
05/28/2008CN101187045A Positioning method for lead wire frame breadth direction in electroplating
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