Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883) |
---|
07/03/2008 | US20080156653 aqua solution added with copper ions, hydroxyl ions, a complexing agent and an additive selected from the group consisting of sodium phosphate, sodium hypophosphite, phosphoric acid and dissolvable salts derivative from phosphoric acid or hypophosphite acid |
07/03/2008 | US20080156652 aqua solution added with copper ions, hydroxyl ions, a complexing agent and an additive selected from the group consisting of sodium phosphate, sodium hypophosphite, phosphoric acid and dissolvable salts derivative from phosphoric acid or hypophosphite acid |
07/03/2008 | US20080156651 Method of forming phase change layer, method of manufacturing a storage node using the same, and method of manufacturing phase change memory device using the same |
07/03/2008 | DE102005010095B4 Metallband mit niedrigem Ummagnetisierungsverlust und biaxialer Textur sowie Herstellungsverfahren dafür Metal band with low core loss and biaxial texture and manufacturing method thereof |
07/02/2008 | EP1939329A1 Kit for the manufacture of a process reactor for forming metallic layers on one or more substrate |
07/02/2008 | EP1937875A2 Electroplating composition for coating a substrate surface with a metal |
07/02/2008 | EP1875279B1 A method of forming mirrors on a conducting substrate |
07/02/2008 | CN101210334A Technique for treating plastic surface |
07/02/2008 | CN101210327A Plastic surface copper plating agent and using method thereof |
07/02/2008 | CN101210305A Tungsten alloy composite plating coat material and manufacturing method thereof |
07/02/2008 | CN101209605A Surface processing copper foil |
07/02/2008 | CN100398700C Surface cladding treatment method of ferro-manganese aluminium alloy |
07/01/2008 | US7393594 Laminated metal thin plate formed by electrodeposition and method of producing the same |
06/26/2008 | WO2008076724A2 Method of forming yttrium-modified platinum aluminide diffusion coating |
06/26/2008 | WO2008075723A1 Metal strip, connector and metal strip manufacturing method |
06/26/2008 | US20080149489 Multistep immersion of wafer into liquid bath |
06/26/2008 | US20080149487 Via Plating Method of System in Package and System Thereof |
06/26/2008 | DE10131393B4 Herstellung von Gasseparatoren für Brennstoffzellen und dabei verwendete Apparatur Production of gas separators for fuel cells and apparatus used therein |
06/25/2008 | EP1936009A1 Plating method |
06/25/2008 | CN101206374A Infrared waveband ultra-material based on dendritic structure |
06/25/2008 | CN101205624A Method for brushing pattern on surface of electroplating products |
06/25/2008 | CN101204863A Thermal barrier coating system and method for coating a component |
06/25/2008 | CN101204861A Titanium alloy parts protection and its preparation method and uses of hydrogen prevention crisp |
06/25/2008 | CN100397718C 压配合端子 Press-fit terminal |
06/25/2008 | CN100396823C Method and device for preparing coating or film using supersonic, water-heating and electrodeposition technology |
06/25/2008 | CN100396822C Method and equipment for controlling local electric current to obtain uniform electroplating thickness |
06/25/2008 | CN100396476C Glue squeezing device and method for making conductive foamed material and foamed nickel using the device |
06/24/2008 | US7391116 Fretting and whisker resistant coating system and method |
06/24/2008 | US7390383 Paddles and enclosures for enhancing mass transfer during processing of microfeature workpieces |
06/24/2008 | US7390382 Reactors having multiple electrodes and/or enclosed reciprocating paddles, and associated methods |
06/19/2008 | WO2008072617A1 Ni-PLATED STEEL SHEET AND METHOD FOR PRODUCING THE SAME |
06/19/2008 | WO2008072418A1 Male terminal, and its manufacturing method |
06/19/2008 | WO2008071298A1 Method fr the galvanic coating of workpieces in an electrolyte bath containing zinc |
06/19/2008 | WO2008071239A1 Apparatus and process for single-side wet chemical and electrolytic treatment of goods |
06/19/2008 | US20080142370 a mixture of acids, water soluble sulfur compounds, carbocyclic halogen compounds and polymers, used for electrodeposition of copper onto metal or plastic surfaces; printed circuits |
06/19/2008 | US20080142369 holders for electronics formed by adhering a patterned layer of to a previously formed layer or substrate and repeating the adhesion operation several times to form a multilayer configuration containing electrodes, conductor and dielectrics |
06/19/2008 | US20080142368 Resistive film on aluminum tube |
06/19/2008 | US20080142367 Overcome the deleterious effect of superficial coating or oxide layers that interfere with the plating or etching of certain metal substrates; metal plating and etching of readily oxidizable substrates |
06/19/2008 | DE10259187B4 Metallisierung von Kunststoffsubstraten und Lösung zum Beizen und Aktivieren Metallization of plastic substrates and solution for pickling and activating |
06/19/2008 | DE102007020449A1 Device for the wet chemical, electrochemical or electrolytic treatment or for cleaning the lower side of a flat material comprises a treatment chamber with an overflow edge which forms a gap with a support for the material |
06/19/2008 | DE102006060255A1 Verfahren zur galvanischen Beschichtung von Werkstücken in einem zinkhaltigen Elektrolytbad A method for electroplating of workpieces in a zinc-containing electrolyte |
06/19/2008 | DE102006058753A1 Procedure for the electrolytic coating of surfaces of precision components, comprises coating the surface by an electrolytic solution and positioning an electrode in a small distance to the surface to be coated |
06/18/2008 | EP1932952A1 Method of surface treatment for the inhibition of wiskers |
06/18/2008 | EP1932057A2 Method of forming conductive tracks |
06/18/2008 | CN101203631A Sn-plated copper alloy bar having excellent fatigue characteristics |
06/18/2008 | CN101203627A Capsule element with tin as main constituent, capsule forming method and solder processing method |
06/18/2008 | CN101202147A Addition magnetic field device for plating magnetic field brush |
06/18/2008 | CN101201545A Pholithography and wafer forming by the same |
06/18/2008 | CN101200126A Thermal-barrier coating and method for making same |
06/17/2008 | USRE40386 Chrome plated parts and chrome plating method |
06/12/2008 | WO2008070568A2 Apparatus and method for electroplating on a solar cell substrate |
06/12/2008 | US20080140052 Article to be Inserted in a Body Cavity Having Biologically Inhibiting Surfaces and Use and Preparation of the Article |
06/12/2008 | US20080138694 High-Temperature Fuel Cell System |
06/12/2008 | US20080135415 Electrodeposition technique and apparatus to form selenium containing layers |
06/12/2008 | US20080135414 Fuel cells; dielectrics |
06/12/2008 | US20080135089 Graded hybrid amorphous silicon nanowire solar cells |
06/12/2008 | DE10314502B4 Verfahren zum elektrolytischen Beschichten einer Halbleiterstruktur A method for electrolytic coating of a semiconductor structure |
06/11/2008 | EP1930925A1 Process for partially galvanising a decorative or functional component made by injection moulding |
06/11/2008 | EP1929068A1 Process for producing metal foams having uniform cell structure |
06/11/2008 | EP1658393B1 Device and method for separating metals and/or metal alloys from metallo-organic electrolytes |
06/11/2008 | CN101195925A Magnesium and method for electroplating copper on magnesium alloy surface |
06/11/2008 | CN101195924A Plating product and method for producing the same |
06/11/2008 | CN101195923A Plating diamond tool with glass hard high-strength tyre case material and production method thereof |
06/11/2008 | CN101195208A Plating diamond tool with glass hard high-wearing feature and production method thereof |
06/10/2008 | US7384535 Determining the quantity of brightener and leveler in a metal plating bath using plating bath samples of known and different quantity of the brightener and the leveler, but where the quantity differs from the quantity in the other bath samples |
06/10/2008 | US7384532 Platable coating and plating process |
06/10/2008 | US7384531 Aperture through the insulating layer exposes spring metal layer at an interconnect site with an interconnect mask around the site; conductive material is electroplated on the spring metal layer at the interconnect site to form a plated interconnect; the mask is then removed |
06/10/2008 | US7384530 Methods for electrochemically fabricating multi-layer structures including regions incorporating maskless, patterned, multiple layer thickness depositions of selected materials |
06/10/2008 | US7383844 Meniscus, vacuum, IPA vapor, drying manifold |
06/10/2008 | US7383843 Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer |
06/05/2008 | WO2008017423A3 Thermoplastic product and method for the production of a composite product with selective electroplating |
06/05/2008 | US20080131721 Low hydrogen embrittlement zinc/nickel plating for high strength steels |
06/05/2008 | US20080131708 Method for Imparting Hydrogen Resistance to Articles |
06/05/2008 | US20080128288 Patternable rough surfaced substrate; thin etch stop layer of nickel; copper overlying etch stop; selectively etch to form wiring patterns; insulating layer; form contact openings; electroless plating metal onto rough insulator; electrolytic plating conductive wiring pattern over electroless layer |
06/05/2008 | US20080128286 Electrochromic device based on layer by layer deposition |
06/05/2008 | US20080128284 Molybdenum, copper, or iron oxides; nucleation pulse applied to an aqueous solution forming a plurality of chains of metal oxide nanoparticles; reduced in hydrogen gas to metal wire; sensors, biosensors, wiring of semiconductor quantum dots |
06/05/2008 | US20080128019 Method of metallizing a solar cell substrate |
06/05/2008 | DE112006001905T5 Käfig für Wälzlager und Wälzlager Cage for rolling bearings |
06/04/2008 | EP1038990B1 Method of reducing elution of lead in lead containing copper alloys for drinking water service |
06/04/2008 | CN101193501A Method for controlling plating layer thickness distribution in FPC making process |
06/04/2008 | CN101193489A Plating part and its making method |
06/04/2008 | CN101191246A Plating method for metal material |
06/04/2008 | CN101190786A Nano metal particle and its nano carbon tube and its luminous element preparation method |
06/04/2008 | CN100392155C Bath for galvanic deposition of gold and gold alloys, and use thereof |
06/03/2008 | US7381318 Method of manufacturing biaxially textured metallic layer featured by electroplating on the surface of single-crystalline or quasi-single-crystalline metal surface, and articles therefrom |
05/29/2008 | WO2008062779A1 Resin composition for metal plating, molded article thereof, and metal-plated molded article |
05/29/2008 | WO2008061555A1 Process for providing aluminium cookware with a copper coating |
05/29/2008 | US20080124535 Surface-Structured Substrate And Production Thereof |
05/29/2008 | US20080121618 Method of Electrochemical Fabrication |
05/29/2008 | US20080121528 Forming an anodized layer having a thickness greater than a desired thickness; forming an electroconductive layer; removing conductive layer in a selected area to expose and remove the anodized layer until it has desired thickness; etching |
05/29/2008 | US20080121526 Wafer substrate carrier; cell for confining chemical; anode having adjustable shape in cell; wherein space is formed between wafer or substrate held by carrier and anode having a height which can be selectively varied by adjusting shape; electrochemical plating and electrochemical mechanical polishing |
05/29/2008 | US20080121263 Thermoelectric elements, method for manufacturing same, and use of same |
05/29/2008 | DE10360206B4 Verfahren zum selektiven galvanischen Abscheiden in einer integrierten Schaltungsanordnung, insbesondere auf Kupfer, und integrierte Schaltungsanordnung A method of selectively electrodepositing in an integrated circuit arrangement, in particular copper, and integrated circuit arrangement |
05/29/2008 | CA2670266A1 Process for providing aluminium cookware with a copper coating |
05/28/2008 | EP1925696A2 Iron-gold barcode nanowire and manufacturing method thereof |
05/28/2008 | EP1749122A4 Surface enhanced spectroscopy-active composite nanoparticles |
05/28/2008 | CN101187051A Nano tungsten carbide and nano Teflon electric brush plating liquor preparation process and uses |
05/28/2008 | CN101187047A Method for preparing Al2O3 film on medical use nickel-titanium alloy surface by micro-arc oxidation |
05/28/2008 | CN101187046A Electroplating preparation method for copper cladded aluminum wire or copper cladded magnesium alloy wire |
05/28/2008 | CN101187045A Positioning method for lead wire frame breadth direction in electroplating |