Patents
Sitemap › C08 - Organic macromolecular compounds; Their preparation or chemical working-up; Compositions based thereon › C08L - Compositions of macromolecular compounds › C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588)
07/2012
07/18/2012CN102585445A Plastic packaging material for preparing green and environment-friendly diode and injection moulding method
07/18/2012CN102585444A Composite material, dielectric substrate based on composite material and manufacturing method for composite material
07/18/2012CN102585443A Light high-strength buoyancy material and preparation method thereof
07/18/2012CN102585442A Underwater resin matrix light high-strength composite material and preparation method thereof
07/18/2012CN102585441A Performance-controllable epoxy-polyketone grouting material as well as preparation method and application thereof
07/18/2012CN102585440A High-CTI (comparative tracking index) halogen-free flame retardant resin composition for copper-clad laminate
07/18/2012CN102585439A Solid thermally expansible material
07/18/2012CN102585438A Epoxy resin composition for encapsulation and electronic component device
07/18/2012CN102585437A High heat-resisting epoxy resin compound and bonding sheet and copper clad laminate made from same
07/18/2012CN102585292A Epoxy resin reaction-type microcapsule fire retardant and preparation method thereof
07/18/2012CN102585290A Method for preparing melamine cyanurate with large particle size and wide distribution
07/18/2012CN102585289A Dendritic macromolecular functional titanium dioxide micro particle toughening agent and epoxy resin
07/18/2012CN102585266A Method for preparing high-dielectric constant composite film of copper phthalocyanine oligomer/polymer
07/18/2012CN102585259A Preparation method of expanded graphite flake/thermosetting resin composite material
07/18/2012CN102585257A Heating solidifying method of epoxy resin for preparing fan blade
07/18/2012CN102585238A Polymer type halogen-free fire retardant poly(9,10-dihydro-9-oxa-10-(2,5-dihyroxyphenyl) phosphaphenanthrene-10-oxide) thiophenylphosphonate (PDPTP) and preparation method thereof
07/18/2012CN102585168A Preparation method of polymer dispersed liquid crystal film
07/18/2012CN102585167A Preparation method of epoxy resin
07/18/2012CN102585165A Method for inhibiting accumulation of surface charge of epoxy resin and composite materials thereof
07/18/2012CN102582096A Arc continuous fiber composite material plate and preparation process and device thereof
07/18/2012CN102276874B Oligomer flame retardant with main chain containing phosphorus silicon boron and preparation method thereof
07/18/2012CN102002210B Halogen-free resin composite and glue sheet and substrate which are prepared from same
07/18/2012CN101967287B Oleoylchloride thermosetting epoxy asphalt compatibilizer and preparation method thereof
07/18/2012CN101967285B Thermosetting epoxy asphalt compatibilizer and preparation method thereof
07/18/2012CN101809057B Polyester composition for production of thermally cured film
07/18/2012CN101790564B Saturated polyester resin composition and hot melt adhesive composition
07/18/2012CN101775209B Polymer film sound absorbing material and preparation method thereof
07/18/2012CN101775192B Injection moulding-based high-efficiency heavy-duty transmission nut material, method and device
07/18/2012CN101717548B High-polarity polypropylene material and application thereof as inner and outer decorative parts of automobile
07/18/2012CN101679608B One-pack type cyanate/epoxy composite resin composition
07/18/2012CN101617427B Polyelectrolyte composition, polyelectrolyte membrane, membrane electrode assembly, and solid polymer electrolyte fuel cell
07/18/2012CN101597436B Silicon tiny powder surface treating and modifying method, epoxy resin combination and preparation method thereof
07/18/2012CN101527195B Variable impedance material
07/18/2012CN101393411B Electroconductive endless belt
07/18/2012CN101370870B Epoxy resin molding material for sealing and electronic component device
07/18/2012CN101233167B Solid thermally expansible material
07/18/2012CN101208386B Epoxy resin composition for sealing semiconductor device
07/18/2012CN101173061B Flame retardant, hardening moulding materials
07/17/2012US8222324 Process for producing modified epoxy resin
07/17/2012US8221875 Varnish, prepreg, and substrate thereof
07/12/2012WO2012093895A2 Resin composition, prepreg using same, and printed wiring board
07/12/2012WO2012093860A2 Prepreg and printed wiring board including same
07/12/2012WO2012093631A1 Polymer microparticle-dispersed resin composition and method for producing same
07/12/2012WO2012093591A1 Curable epoxy resin composition
07/12/2012WO2012093590A1 Curable epoxy resin composition
07/12/2012US20120178853 Solventless one liquid type cyanate ester-epoxy composite resin composition
07/12/2012US20120178851 Resin with high heat transfer
07/12/2012US20120175159 Resin composition for use in release film
07/12/2012US20120174811 Graded property barriers for attenuation of shock
07/12/2012CA2822596A1 Polymer microparticle-dispersed resin composition and method for producing same
07/11/2012EP2474426A2 Method of making models
07/11/2012CN1942518B Compositions for producing universal pigment preparations
07/11/2012CN102576585A Insulating sheet, circuit board, and process for production of insulating sheet
07/11/2012CN102575085A Epoxy resin composition for semiconductor encapsulation, semiconductor device, and release agent
07/11/2012CN102575084A Multilayer resin sheet and method for producing same, method for producing multilayer resin sheet cured product, and highly thermally conductive resin sheet laminate and method for producing same
07/11/2012CN102575061A Composition, in particular a blocking agent composition for fixing blanks to ophthalmic or optical lenses
07/11/2012CN102575031A Fire-retardant composite materials
07/11/2012CN102575004A Polyamide compound and epoxy resin composition containing same
07/11/2012CN102574987A Solvent-free and one-pack type cyanic ester/epoxy composite resin composition
07/11/2012CN102574984A A latent curing agent and epoxy compositions containing the same
07/11/2012CN102574952A Transparent high-refractive-index resin composition
07/11/2012CN102558914A Surface activation modification technology for environment-friendly magnesium hydroxide flame retardant special for insulating materials
07/11/2012CN102558895A Viscose glue product with high heat-conducting performance and manufacturing method thereof
07/11/2012CN102558861A Halogen-free phosphate-free high-heat-resistance thermosetting resin composition as well as bonding sheet and copper clad laminate prepared from same
07/11/2012CN102558858A Resin compound for copper-coated laminated boards and prepreg
07/11/2012CN102558855A Modified nylon resin composition
07/11/2012CN102558815A Modified polycarbonate material for processing of shell of capacitor of locomotive
07/11/2012CN102558814A Modified polymeric carbon ester material for preparing capacitor housing
07/11/2012CN102558769A Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated with an encapsulant prepared from the composition
07/11/2012CN102558768A Housing of array induction-type petroleum well logging device and preparation method thereof
07/11/2012CN102558767A Polymer resin composition, insulating film manufactured using the polymer resin composition, and method of manufacturing the insulating film
07/11/2012CN102558766A Hyper branched polymer modified epoxy resin
07/11/2012CN102558765A Halogen-free fire-retardant high heat conducting insulating resin composition and heat dissipation metal-base copper clad plate
07/11/2012CN102558764A High-adhesion humidity-resistant organic polymer slurry
07/11/2012CN102558759A Cyanate ester resin composition and prepreg and laminated material manufactured by using same
07/11/2012CN102558580A Dissoluble light-cured resin and dissoluble ultraviolet (UV) printing ink and preparing method thereof
07/11/2012CN102558505A Thermosetting resin composition and prepreg and laminate obtained with the same
07/11/2012CN102555316A Fiber fabric with high buckling resistance and method for preparing fiber composite material part with high buckling resistance
07/11/2012CN101974199B Low-shrinkage phenolic moulding compound
07/11/2012CN101974198B Heat-resisting phenolic moulding compound
07/11/2012CN101812186B Microencapsulation expansion type flame retardant and application in epoxy resin composite material thereof
07/11/2012CN101177518B Epoxy ester resin water dispersion and method for manufacturing rust-inhibiting primer using the same as foundation
07/10/2012US8217115 Liquid resin composition, semiconductor wafer having adhesive layer, semiconductor element having adhesive layer, semiconductor package, process for manufacturing semiconductor element and process for manufacturing semiconductor package
07/10/2012US8217099 Thermosetting resin composition
07/10/2012US8217088 Use of nanoporous polymer foams as thermal insulation materials
07/05/2012WO2012091557A1 Composite materials and shaped articles
07/05/2012WO2012091320A2 Epoxy resin compound and radiant heat circuit board using the same
07/05/2012WO2012091300A1 Thermoplastic resin composition, and molded article including same
07/05/2012WO2012091000A1 Curable epoxy resin composition
07/05/2012WO2012090932A1 Sealant composition for photoelectric conversion element
07/05/2012WO2012064717A3 Curable and cured compositions
07/05/2012US20120172546 Phosphorus containing novalac phenol resins, methods for manufacturing the same, and formulae containing the same
07/05/2012US20120172505 Transparent silicone epoxy composition
07/05/2012US20120172494 Method for producing wood fibre-plastics composite products
07/05/2012US20120172493 Curable epoxy resin compositions and composites made therefrom
07/05/2012US20120168969 Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated with an encapsulant prepared from the composition
07/05/2012US20120168968 Epoxy resin composition for encapsulating a semiconductor device, method of encapsulating a semiconductor device, and semiconductor device
07/05/2012US20120168215 Curable resin composition
07/04/2012CN202298616U 一种编织套管型frp筋 A woven sleeve type frp ribs
07/04/2012CN102549097A Thermosetting adhesive composition, thermosetting adhesive sheet, method for producing same, and reinforced flexible printed wiring board
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