Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588)
09/2012
09/12/2012EP2496552A1 Difunctional, amine-based surfactants, and their precursors, preparation, compositions and use
09/12/2012CN102666758A Coating compositions with alkoxy-containing aminofunctional silicone resins
09/12/2012CN102666724A Epoxy resin composition for semiconductor encapsulation, cured product thereof, and semiconductor device using epoxy resin composition
09/12/2012CN102666723A Single-component epoxy resin composition and use thereof
09/12/2012CN102666722A One-pack type liquid epoxy resin composition and adhesion method using same
09/12/2012CN102666649A Epoxy resin compositions
09/12/2012CN102666642A Resin composition for semiconductor encapsulation and semiconductor device using the resin composition
09/12/2012CN102666641A Multifunctional additives in engineering thermoplastics
09/12/2012CN102666639A Epoxy resin composition and surface mounting device coated with said composition
09/12/2012CN102666637A Toughened epoxy resin formulations
09/12/2012CN102664381A Fire-proof and explosion-proof wrapping head for cable and manufacturing method thereof
09/12/2012CN102660117A Resin material, composite well repair material and well repair process
09/12/2012CN102660107A Post-treatment agent and method for using same to treat eucalyptus/PES (polyether sulfone) composite powder formed part formed by selective laser sintering
09/12/2012CN102660106A Phenylthiocarbamide (PTC) composite material and PTC chip prepared by same and preparation method
09/12/2012CN102660078A High glowing filament temperature-resistant polypropylene composition
09/12/2012CN102659999A Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate
09/12/2012CN102659998A Vinyl ester resin, vinyl ester resin compound and preparation method thereof
09/12/2012CN102115569B Dielectric material composition and circuit substrate
09/11/2012US8263714 Epoxy resin composition, cured article thereof, semiconductor sealing material, novel phenol resin, novel epoxy resin, method for producing novel phenol resin, and method for producing novel epoxy resin
09/11/2012US8263687 Coating system
09/11/2012US8263216 Epoxy resin composition for fiber-reinforced composite material, prepreg, and fiber-reinforced composite material
09/11/2012CA2565138C Polyetheralkanolamine dispersants
09/11/2012CA2556586C Thiol ester compositions and processes for making and using same
09/11/2012CA2416020C Volume-modified casting compounds based on polymeric matrix resins
09/07/2012WO2012118208A1 Matrix resin composition, prepreg, method for producing prepreg, and fiber-reinforced composite material
09/07/2012WO2012117759A1 Thermosetting composition, adhesive film, and multilayer printed circuit board
09/06/2012US20120225982 Compositions of a metal amidine complex and second compound, coating compositions comprising same
09/06/2012US20120225975 Method for Treating Reinforcing Fibre and Method for Producing a Reinforced Composite Article from the Treated Fibre
09/06/2012US20120225212 Storage Stable Epoxy Resin Compositions for Electrical Laminates
09/06/2012US20120225187 Epoxy resin curing indicator composition
09/05/2012EP2495281A1 Epoxy resin imbibed polymer particles
09/05/2012EP2493998A2 Thermal interface material with epoxidized nutshell oil
09/05/2012EP2493982A1 Thermoplastic polyurethane composition with high insulation resistance
09/05/2012CN102656247A Thermal interface material with epoxidized nutshell oil
09/05/2012CN102656234A Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminate
09/05/2012CN102656230A Use of guanidine derivatives as curing accelerators for epoxy resins
09/05/2012CN102656221A High magnesium surface concentration nanocalcite composites
09/05/2012CN102655884A Composition containing polyethylene glycol for shaving
09/05/2012CN102653623A Epoxy resin imbibed polymer particles
09/05/2012CN102653598A Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers
09/05/2012CN102653149A Flexible halogen-free high-thermal conductivity resin-coated copper foil and preparation method thereof
09/05/2012CN102199334B Method for preparing polybenzimidazole functionalized carbon tube-enhanced acidification polyether amine compound
09/05/2012CN102181130B Commodity raw material prepared from solidago and preparation method thereof
09/05/2012CN102174173B Flame-retardant latent epoxy curing agent and halogen-free flame-retardant one-component epoxy resin composition
09/05/2012CN102161815B Epoxy resin composition and semiconductor device using thereof
09/05/2012CN102153837B High-performance high-temperature-resistant modified epoxy resin
09/05/2012CN102140111B Methyl tri(2-chloropropyl)silane compound and preparation method thereof
09/05/2012CN102030913B Method for preparing novel epoxy resin film
09/05/2012CN101851386B Epoxy resin compound
09/05/2012CN101831143B High-performance liquid epoxy resin composition for packaging LEDs
09/05/2012CN101821817B Polymer concrete electrical insulation system
09/05/2012CN101815755B Compositions comprising cationic fluorinated ether, silanes, and related methods
09/05/2012CN101787178B Heat-conduction electric insulation composite material component and manufacturing method thereof
09/05/2012CN101608052B Conductive die-bonding agent for LED (light emitting diode)
09/05/2012CN101469106B Flame-retardant reinforced PBT composition
09/05/2012CN101319087B F-level heat-proof solvent-impregnated resin suitable for subatmospheric pressure and normal temperature
09/05/2012CN101319086B F level heating solvent-free solvent-impregnated resin suitable for subatmospheric pressure
09/05/2012CN101304637B Wiring forming method of printed circuit board
09/05/2012CN101104730B Low-fluorine anti-flaming polycarbonate/styryl resin composition
09/04/2012US8257796 Amine functional adducts and curable compositions comprising same
09/04/2012CA2492405C Insulation product, such as a thermal insulation product, and production method thereof
08/2012
08/30/2012WO2012113145A1 Flame retardant polymer compositions comprising stabilized hypophosphite salts
08/30/2012US20120220684 Curable formulation
08/30/2012US20120219497 Random ethylene oxide and non-random alkylene oxide(s) polymers
08/30/2012US20120217532 Resin composition for optical semiconductor element housing package, and optical semiconductor light-emitting device obtained using the same
08/29/2012EP2492924A1 Insulating sheet, circuit board, and process for production of insulating sheet
08/29/2012EP2491088A2 Impact resistant two-component epoxy-based substance curing at room temperature
08/29/2012CN102649868A Resin composition for optical semiconductor element housing package, and optical semiconductor light-emitting device obtained using the same
08/29/2012CN102649867A Burdening procedure for preparing mixed glue solution for copper foil-coated substrate
08/29/2012CN102649837A Phosphorus epoxy resin and composition and cured material having the same
08/29/2012CN102120828B Swelling solution for removing through-hole residues of epoxy resin circuit board
08/29/2012CN102070877B Low-intensity magnetic field-induced ordered carbon nanotube/epoxy resin composite material and preparation method thereof
08/29/2012CN101914265B Non-halogen phosphorus-containing flame retardant high-frequency epoxy resin composition and application thereof to bonding sheet and copper-clad plate
08/29/2012CN101851392B Epoxy resin blend
08/29/2012CN101805419B Fluorine-containing photoinitiator and application thereof
08/29/2012CN101778882B 环氧树脂组合物 The epoxy resin composition
08/29/2012CN101696317B Epoxy resin composite taking spherical silicon powder as filler, preparation method and application thereof
08/29/2012CN101679751B Curable epoxy resin composition and cured body thereof
08/29/2012CN101652425B Resin composition, prepreg, laminated board, multilayer printed wiring board and semiconductor device
08/23/2012WO2012111765A1 Curable resin composition and colour conversion material using same
08/23/2012WO2012111743A1 Epoxy resin composition, prepreg, and fiber-reinforced composite material
08/23/2012WO2012111652A1 Liquid sealing resin composition and semiconductor device obtained using liquid sealing resin composition
08/23/2012WO2012111543A1 Resin composition, prepreg, and metal-foil-cladded laminate board
08/23/2012WO2012111356A1 Two-liquid mixing first and second liquids and method for producing printed circuit board
08/23/2012WO2012110230A1 Improved structural adhesives
08/23/2012WO2012110193A2 Curable polymer materials
08/23/2012US20120214953 Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers
08/23/2012US20120214906 Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers
08/23/2012US20120214905 Process of recycling powder coat material and component made thereof
08/23/2012US20120211704 Endless flexible members with a polymeric release agent for imaging devices
08/23/2012DE102011012079A1 Liquid hardener useful e.g. for hardening of hardenable polymer resins, preferably epoxy resins, comprises cyanamide and at least one urea derivative
08/23/2012DE102011011609A1 Härtbare polymere Massen The curable polymeric compositions
08/23/2012CA2826672A1 Epoxy resin composition, prepreg, and fiber-reinforced composite material
08/23/2012CA2823064A1 Curable polymeric mass
08/22/2012EP2489689A1 Composition for formation of cured epoxy resin, and cured products thereof
08/22/2012CN102648247A Coating compositions
08/22/2012CN102648229A Adducts based on divinylarene oxides
08/22/2012CN102644554A Novel carbon fiber wind driven generator and preparation method thereof
08/22/2012CN102643543A Composite dielectric material, copper-clad foil prepreg manufactured and copper-clad foil laminated board by using composite dielectric material
08/22/2012CN102643517A Method for preparing composite material by blending PHQEP/montmorillonite and modified epoxy resin
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