Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
12/2014
12/31/2014CN204069514U Pcb板蚀刻机 Pcb board etching machine
12/31/2014CN204069513U 一种电动立式pcb电路板板材加工机 An electric circuit board pcb vertical sheet metal processing machines
12/31/2014CN204069512U 辅助识别模板 Auxiliary recognition template
12/31/2014CN204069511U 一种新型多层式自动压烤整平处理装置 A new multi-grilled automatic leveling pressure treatment device
12/31/2014CN204069510U 一种用于印刷电路板的打点装置 A printed circuit board means for RBI
12/31/2014CN204069509U 一种pcb板边包胶装置 One kind of plastic bag pcb board edge device
12/31/2014CN204069508U 一种pcb托盘 One kind pcb tray
12/31/2014CN204069507U Fpc线路板补强钢片pnl自动化设备 Fpc board reinforcing steel pnl automation equipment
12/31/2014CN204069506U 一种用于软性线路板的折曲装置 A flexible circuit board means for bending
12/31/2014CN204069505U Pcb自动扫码冷却除静电传输机构 Pcb automatic scan code transmission mechanism in addition to static cooling
12/31/2014CN204069504U 功放板固定治具 Fixed fixture amplifier board
12/31/2014CN204069494U 布线基板 Wiring board
12/31/2014CN104255086A 基板的制造方法、基板以及掩蔽膜 Producing a substrate, the substrate and the masking film
12/31/2014CN104254944A 高频信号线路及其制造方法 High-frequency signal line and its manufacturing method
12/31/2014CN104254823A 透明导电基板的制造方法、透明导电基板及静电电容式触摸面板 The method of producing a transparent conductive substrate, a transparent conductive substrate and a capacitive touch panel
12/31/2014CN104254572A 导电性聚酰胺基材 Polyamide substrate conductivity
12/31/2014CN104254423A 偏流板和喷流装置 Deflectors and jet device
12/31/2014CN104254214A 一种多层印制电路板制造工艺 A multi-layer printed circuit board manufacturing process
12/31/2014CN104254213A 多层电路板及其制作方法 Multi-layer circuit board and its manufacturing method
12/31/2014CN104254212A 一种电路板的制作方法 A method of manufacturing a circuit board
12/31/2014CN104254211A 电子元件装配系统和电子元件装配方法 Electronic component mounting system and an electronic component mounting method
12/31/2014CN104254210A Pcb板及防止层顺序错误流入铣边之后工序的制作方法 Pcb board and prevent the wrong order inflow layer after milling process production methods
12/31/2014CN104254209A 一种笔记本电脑用柔性线路板屏蔽膜压合工艺 One kind of laptop with flexible circuit board shielding film lamination process
12/31/2014CN104254208A 一种线路板短槽孔制作方法 A circuit board manufacturing method of short slots
12/31/2014CN104254207A 一种线路板金属化板边的制作方法 A circuit board manufacturing method of the plate edge of the metal
12/31/2014CN104254206A 具有台阶槽印刷电路板的加工方法 A printed circuit board having a stepped groove machining method
12/31/2014CN104254203A 电路布置以及用于制造所述电路布置的方法 The circuit arrangement and manufacturing method for the circuit arrangement
12/31/2014CN104254202A 具有内埋电子元件的电路板及其制作方法 With embedded electronic components and circuit board production methods
12/31/2014CN104254197A 电路板及其制作方法 Board and its production method
12/31/2014CN104254196A 一种非对称铜厚双面铝基板及其加工方法 An asymmetric double-sided copper thick aluminum plate and processing method
12/31/2014CN104254193A 布线基板及其制造方法 Wiring board and manufacturing method thereof
12/31/2014CN104254191A 无芯层封装基板及其制作方法 No core package substrate and manufacturing method thereof
12/31/2014CN104254190A 电路板及其制作方法 Board and its production method
12/31/2014CN104254189A Pcb板的固定板及其加工方法 Pcb board fixed plate and processing method
12/31/2014CN104253304A 电化铝箔烫印法生产电子标签天线 Foil stamping foil production RFID antenna
12/31/2014CN104253054A 半导体装置 Semiconductor device
12/31/2014CN104249210A 多点焊治具 Multi-spot welding fixture
12/31/2014CN104249208A 波峰焊装置及其喷嘴 Wave device and nozzle
12/31/2014CN102638947B 银浆跨线印制线路板生产工艺 Silver Cross line PCB production process
12/31/2014CN102595770B 电子装置、插入件以及制造电子装置的方法 Electronic device, the insert and a method of manufacturing an electronic device
12/31/2014CN102548755B 挠性金属层积体的制造方法 The method of producing a flexible laminate of a metal layer
12/31/2014CN102517617B 表面粗化铜板的装置、以及表面粗化铜板 Surface roughened copper plate means, and a surface roughened copper plate
12/31/2014CN102510683B 线路板的制造方法 The method of manufacturing circuit board
12/31/2014CN102484950B 树脂多层基板以及该树脂多层基板的制造方法 The method of manufacturing a multilayer resin substrate and the resin multilayer substrate
12/31/2014CN102484186B 具有带有辐射出射侧和绝缘层的至少一个第一半导体本体的光电子模块及其制造方法 Optoelectronic module and its manufacturing method having a radiation exit side and with the insulating layer is at least one first semiconductor body
12/31/2014CN102382581B 电路连接用粘接膜及用途、结构体及制造方法和连接方法 Circuit-connecting adhesive film use, structure and method of manufacture and the connection method
12/31/2014CN102378569B 元件表面粘着工艺及其元件贴片系统与供料装置 Surface mount technology components and component placement systems and feeding device
12/31/2014CN102365396B 包含抑制剂的无空隙亚微米结构填充用金属电镀组合物 Inhibitor containing submicron structure without voids filled with the metal plating composition
12/31/2014CN102325427B 印刷线路板阻焊油的涂布工艺及涂布装置 Coating process and the printed circuit board solder oil coating device
12/31/2014CN102295894B 电路连接用粘接膜及用途、结构体及制造方法和连接方法 Circuit-connecting adhesive film use, structure and method of manufacture and the connection method
12/31/2014CN102295893B 电路连接用粘接膜及用途、结构体及制造方法和连接方法 Circuit-connecting adhesive film use, structure and method of manufacture and the connection method
12/31/2014CN102121126B 一种带导轮架的pcb电镀装置 Pcb plating unit with a guide wheel frame
12/30/2014US8924609 Reconfigurable modular computing device
12/30/2014US8923007 Multi-diameter unplugged component hole(s) on a printed circuit board (PCB)
12/30/2014US8922859 Light source device, method of assembling light source device, optical scanning device, and image forming apparatus
12/30/2014US8922370 Locking device with embedded circuit board
12/30/2014US8922304 Laminated electronic devices with conical vias
12/30/2014US8922234 Probe card and method for manufacturing probe card
12/30/2014US8921971 Fibrous laminate interface for security coatings
12/30/2014US8921707 Suspension substrate, suspension, head suspension, and hard disk drive
12/30/2014US8921706 Component-embedded substrate, and method of manufacturing the component-embedded substrate
12/30/2014US8921705 Wiring board and fabrication method therefor
12/30/2014US8921704 Patterned conductive polymer with dielectric patch
12/30/2014US8921703 Circuit board, structural unit thereof and manufacturing method thereof
12/30/2014US8921701 Modular insulator for busbar support and method of assembling
12/30/2014US8921458 Resin composition, molded object and substrate material both obtained from the resin composition, and circuit board including the substrate material
12/30/2014US8921157 Printed substrate manufacturing equipment and manufacturing method
12/30/2014US8919249 Screen printing device and screen printing method
12/30/2014US8919248 Screen printing machine
12/30/2014US8918991 Process for providing electrical connections with reduced via capacitance on circuit boards
12/30/2014US8918990 Method of forming a solderless printed wiring board
12/30/2014US8918988 Methods for controlling wafer curvature
12/25/2014US20140380262 Method of designing power supply network
12/25/2014US20140378072 Radio frequency transistor and matching circuit grounding and thermal management apparatus
12/25/2014US20140377534 Circuit substrate and manufacturing method thereof
12/25/2014US20140377455 Method for Fabricating Blackened Conductive Patterns
12/25/2014US20140377454 Method of improving sheet resistivity of printed conductive inks
12/25/2014US20140377453 Insulating Adhesive Composition for Metal-Based Copper Clad Laminate (MCCL), Coated Metal Plate Using Same, and Method for Manufacturing Same
12/25/2014US20140376201 Guarded printed circuit board islands
12/25/2014US20140376200 Reliable device assembly
12/25/2014US20140376197 Method of transferring and electrically joining a high density multilevel thin film to a circuitized and flexible organic substrate and associated devices
12/25/2014US20140376196 Method for producing a printed circuit board consisting of at least two printed circuit board regions, and printed circuit board
12/25/2014US20140376195 Methods of forming dual sided coreless package structures with land side capacitor
12/25/2014US20140376193 Electric component module and method of manufacturing the same
12/25/2014US20140376190 Electronic system with heat extraction and method of manufacture thereof
12/25/2014US20140376183 Cooling device including etched lateral microchannels
12/25/2014US20140374395 Modular power conversion system and method
12/25/2014US20140374375 Inkjet system for printing a printed circuit board
12/25/2014US20140374153 Printed circuit board and method for manufacturing same
12/25/2014US20140374150 Package substrate and method for manufacturing package substrate
12/25/2014US20140374142 Metal-plated laminated board, and printed wiring board
12/25/2014US20140374141 Fabricating a conductive trace structure and substrate having the structure
12/25/2014US20140374005 Formation of conductive circuit
12/25/2014US20140373350 Method for the Production of a Circuit Board Involving the Removal of a Subregion thereof, and Use of such a Method
12/25/2014US20140373346 Electronic component mounting system and electronic component mounting method
12/25/2014US20140373345 Vehicle vision system camera with coaxial cable connector
12/24/2014CN204047020U 一种led灯电子板插件安装线 One kind of led light electronic board plug-in installed lines
12/24/2014CN204047019U 一种防止芯片引脚变形的装置 A device to prevent deformation of the chip pin
12/24/2014CN204046961U 一种电路板黄色阻焊油墨塞孔装置 A circuit board solder resist ink yellow jack device
12/24/2014CN204046960U 一种过锡炉夹具 An over tin stove fixture
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