Patents for H05K 1 - Printed circuits (98,583)
04/2008
04/22/2008US7361027 Contact structure, display device and electronic device
04/22/2008US7360874 Ink-jet printer, ink-jet head and method of manufacturing the ink-jet head
04/22/2008US7360716 Method of determining at least one marking element on a substrate
04/22/2008US7360441 Board deflection metrology using photoelectric amplifiers
04/22/2008US7360308 Coaxial via structure for optimizing signal transmission in multiple layer electronic device carriers
04/22/2008CA2412030C Perimeter anchored thick film pad
04/17/2008WO2008045644A2 Printed circuit board and a method for imbedding a battery in a printed circuit board
04/17/2008WO2008044974A1 Surface mounted bus bar
04/17/2008WO2008044698A1 Wiring member and process for producing the same
04/17/2008WO2008044573A1 Capacitor layer-forming material, method for producing capacitor layer-forming material, and printed wiring board comprising built-in capacitor obtained by using the capacitor layer-forming material
04/17/2008WO2008044483A1 Composite electric element
04/17/2008WO2008044382A1 Circuit board and process for producing the same
04/17/2008WO2008013850A3 Staggered memory layout for improved cooling in reduced height enclosure
04/17/2008WO2007131256A3 Method for fixing an electronic component on a printed circuit board and system comprising a printed circuit board and at least one electronic component
04/17/2008WO2007092603A3 Printed circuit connector
04/17/2008US20080090467 Electrical Connector with Improved Crosstalk Compensation
04/17/2008US20080090466 Electrical Connector with Improved Crosstalk Compensation
04/17/2008US20080090429 Stress metal springs; contactors; electroplating
04/17/2008US20080090406 Via attached to a bond pad utilizing a tapered interconnect
04/17/2008US20080090335 Circuit module and manufacturing method thereof
04/17/2008US20080090331 Semiconductor device manufacturing method and manufacturing apparatus
04/17/2008US20080090095 Base metal layer on one plane of an insulating film, a copper film layer on the base metal layer made of a chrome-molybdenum-nickel alloy
04/17/2008US20080090091 Polyimide Based Compositions Comprising Doped Polyaniline and Methods and Compositions Relating Thereto
04/17/2008US20080089046 Printed Wiring Board for Mounting Electronic Components and Semiconductor Device Using Same
04/17/2008US20080089045 Printed circuit boards having pads for solder balls and methods for the implementation thereof
04/17/2008US20080089043 Module incorporating a capacitor, method for manufacturing the same, and capacitor used therefor
04/17/2008US20080089042 Electronic circuit arrangement for control purposes
04/17/2008US20080089041 Connection apparatus for circuit board, ink jet type recording apparatus using the same, ic chip and ink cartridge having ic chip
04/17/2008US20080089039 Method for Micropacking of Electrical or Electrochemical Devices and Micropackage
04/17/2008US20080088975 Method for forming an electrical interconnect to a spring layer in an integrated lead suspension
04/17/2008US20080088670 Printhead Assembly Having A Plurality Of Connected Printhead Modules
04/17/2008US20080088601 Circuit layout on a touch panel
04/17/2008US20080088002 Chip package structure
04/17/2008US20080087461 Combination Impedance/Back Drill Coupon
04/17/2008US20080087460 Apparatus and method for a printed circuit board that reduces capacitance loading of through-holes
04/17/2008US20080087459 Circuitized substrate with internal resistor, method of making said circuitized substrate, and electrical assembly utilizing said circuitized substrate
04/17/2008US20080087458 Control board and control apparatus
04/17/2008US20080087456 Circuit board assemblies with combined fluid-containing heatspreader-ground plane and methods therefor
04/17/2008DE19962702B4 Prüfsockel einer BGA-Vorrichtung A test socket BGA device
04/17/2008DE112006001295T5 Leiterplatte Circuit board
04/17/2008DE102006061388B3 Automotive instrument panel has plastic outer molded skin separated by polymer layer from internal electrical/electronic system
04/17/2008DE102006047199A1 Anordnung mit einem Basiselement und mindestens einem ersten flexiblen Leiterbahnträger und einem zweiten flexiblen Leiterbahnträger Assembly having a base member and at least a first flexible conductor carrier, and a second flexible conductor track carrier
04/16/2008EP1912488A2 Control board and control apparatus
04/16/2008EP1912485A1 Solder mounting structure, method for manufacturing such solder mounting structure and use of such solder mounting structure
04/16/2008EP1912484A1 Solder mounting structure, method for manufacturing such solder mounting structure and use of such solder mounting structure
04/16/2008EP1912286A1 Composite porous resin base material and method for manufacturing same
04/16/2008EP1912264A1 Opto-electronic element
04/16/2008EP1912106A1 Multifunctional operating element
04/16/2008EP1911860A1 Surface treated copper foil, process for producing surface treated copper foil, and surface treated copper foil with very thin primer resin layer
04/16/2008EP1911334A1 Method and system for electrically coupling an information carrier to a contact element
04/16/2008EP1792527B1 Device and method for influencing vibration of a planar element
04/16/2008EP1568099B1 A circuit that taps a differential signal
04/16/2008CN201047557Y Light emitting diode module
04/16/2008CN101164392A Communications jack with printed wiring board having paired coupling conductors
04/16/2008CN101163805A Clad member and printed-circuit board
04/16/2008CN101163769A Adhesive sheet with base used for flexible printed circuit board, method for producing same, multilayer flexible printed circuit board, and rigid-flex printed circuit board
04/16/2008CN101163374A Electronic component and capacitor
04/16/2008CN101163373A Connection member, electric substrate, optical scanning device, and image forming apparatus
04/16/2008CN101162716A Substrate with built-in electronic component and method for manufacturing the same
04/16/2008CN101162324A Backlight assembly, liquid crystal display having the same and method thereof
04/16/2008CN101161607A Ceramic basilar plate and its manufacture method
04/16/2008CN101161606A Method for preparing ceramic sheet
04/16/2008CN100382334C LSI package, interposer, interface module and signal processing LSI monitoring circuit
04/16/2008CN100382309C Molecule component
04/16/2008CN100382299C Hybrid integrated circuit device and method of manufacturing the same
04/16/2008CN100382285C Printing circuit board and production method and electronic parts
04/16/2008CN100382264C Semiconductor device and electronic equipment using the same
04/16/2008CN100382199C Circuit module having interleaved groups of circuit chips
04/16/2008CN100381919C Coupling structure of electronic components
04/16/2008CN100381905C Light emitting diode array module for providing backlight and backlight unit having the same
04/15/2008US7359693 Enclosure and substrate structure for a tuner module
04/15/2008US7359217 Pivoting apparatus with a shielding function
04/15/2008US7359215 Flexible display device
04/15/2008US7359213 Circuit board
04/15/2008US7359207 Laminated printed circuit board fixture assembly and method
04/15/2008US7359024 Structure of liquid crystal display device for easy assembly and disassembly
04/15/2008US7358604 Multichip circuit module and method for the production thereof
04/15/2008US7358591 Capacitor device and semiconductor device having the same, and capacitor device manufacturing method
04/15/2008US7358446 Power distribution system
04/15/2008US7358445 Circuit substrate and apparatus including the circuit substrate
04/15/2008US7358444 Folded substrate with interposer package for integrated circuit devices
04/15/2008US7358189 Copper clad laminate
04/15/2008US7358037 Binder diffusion transfer patterning of a thick film paste layer
04/15/2008US7357884 Conductive ink composition
04/15/2008US7357853 Electroplating composite substrates
04/15/2008US7357648 Electronic device with integral connectors
04/15/2008US7357646 Removable electronic assembly that requires validation
04/15/2008US7356921 Method for forming a conductive layer pattern
04/15/2008US7356917 Method for manufacturing multi-layer printed circuit board
04/15/2008US7356916 Circuit-formed substrate and method of manufacturing circuit-formed substrate
04/15/2008CA2470991C Flip-chip mounted opto-electronic circuit
04/15/2008CA2445219C Method and apparatus for field programming radio frequency identification devices
04/15/2008CA2248712C High density connector arrangement for a circuit board module
04/12/2008CA2606079A1 Transponder embedded in a flexible multi-layer support
04/10/2008WO2008042076A2 Nano and meso shell-core control of physical properties and performance of electrically insulating composites
04/10/2008WO2008041780A1 Copper microparticle, method for production of copper microparticle, insulating material, wiring structure, method for production of wiring circuit board, and electronic/electric device
04/10/2008WO2008041633A1 Correcting tool for use with printed-circuit board, and printed-circuit board unit
04/10/2008WO2008041453A1 Thermosetting resin composition and prepreg and laminate obtained with the same
04/10/2008WO2008041426A1 Polyamideimide resin, adhesive agent, material for flexible substrate, flexible laminate, and flexible print wiring board
04/10/2008WO2008041027A1 Distortion-tolerant processing