Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
04/2010
04/21/2010EP1018146B1 Package for electrical components
04/21/2010CN201440772U Electronic part positioning post
04/21/2010CN201440755U Array circuit board
04/21/2010CN201440754U Motor plate connected body
04/21/2010CN201440753U Grounded C-shaped interlinked welding pad
04/21/2010CN201440752U Flexible circuit board
04/21/2010CN201440751U 柔性印刷电路板 A flexible printed circuit board
04/21/2010CN1700373B Stratified electronic apparatus
04/21/2010CN1695404B High-pressure discharge lamp operation device and illumination appliance having the same
04/21/2010CN1607897B Technique for interconnecting multilayer circuit boards
04/21/2010CN101697663A Circuit board and method for assembling surface joint elements and circuit board
04/21/2010CN101697313A Novel magnetic ring transformer
04/21/2010CN101697305A Electronic device
04/21/2010CN101297610B Bending-type rigid printed wiring board and process for producing the same
04/21/2010CN101236943B Heat-radiation no-chip board film base plate with built-in chip and its making method
04/21/2010CN101212857B Printed circuit board with identifiable production information
04/21/2010CN101133689B Multi-layered printed circuit board comprising conductive test surfaces, and method for determining a misalignment of an inner layer
04/20/2010USRE41242 Package substrate
04/20/2010US7703064 Multilayered circuit board design support method, program, and apparatus for suppressing thermal diffusion from solid-layer conductor to through hole
04/20/2010US7701726 Method of manufacturing a wiring substrate and semiconductor device
04/20/2010US7701722 Flexible printed wiring board
04/20/2010US7701695 Ultra low inductance multi layer ceramic capacitor
04/20/2010US7701505 Image-taking apparatus
04/20/2010US7701069 Solder interface locking using unidirectional growth of an intermetallic compound
04/20/2010US7701045 Point-to-point connection topology for stacked devices
04/20/2010US7700884 Column grid array using compliant core
04/20/2010US7700185 Insulation material, film, circuit board and method of producing them
04/20/2010US7699672 Grouped element transmission channel link with pedestal aspects
04/20/2010US7699624 Dial module and process for manufacturing the same, LED display element, display module, movement module, connector module and meter employing the same
04/20/2010US7699538 Hermetically sealing member having optical transmission means, optoelectronic apparatus, and optical transmission method
04/15/2010WO2010042593A1 Improved patch panel assembly for use with data networks
04/15/2010WO2010042591A1 Improved patch panel assembly for use with data networks
04/15/2010WO2010042573A1 Substrate for lighting device and production thereof
04/15/2010WO2010041661A1 Electrostatic discharge protector
04/15/2010WO2010041644A1 Polyamideimide resin, adhesive composition using the resin, ink for printed circuit board using the adhesive composition, cover lay film, adhesive sheet and printed circuit board
04/15/2010WO2010041621A1 Substrate having built-in functional element, method for manufacturing same, and electronic device
04/15/2010WO2010041510A1 Flexible conductor-clad laminate, flexible printed wiring board for cof, and methods for manufacturing same
04/15/2010WO2010041324A1 Circuit board, circuit board assembly and misinsertion detecting device
04/15/2010WO2009112898A3 Antenna for use in earphone and earphone with integrated antenna
04/15/2010US20100094607 Method of reducing solder wicking on a substrate
04/15/2010US20100091468 Flexible printed circuit board for use in surface-mount technology
04/15/2010US20100090781 Sheet-like composite electronic component and method for manufacturing same
04/15/2010US20100090339 Structures and Methods for Wafer Packages, and Probes
04/15/2010US20100089891 Method of preparing an antenna
04/15/2010US20100089791 Dosage form package and a frangible electrical circuit sheet therefor
04/15/2010US20100089789 Dosage form package and a frangible electrical circuit sheet therefor
04/15/2010US20100089632 printed wiring board and a method of production thereof
04/15/2010US20100089631 Wiring board and manufacturing method of the same
04/15/2010US20100089630 Crossover
04/15/2010US20100089629 Electronic component device and method for producing the same
04/15/2010US20100089628 Component built-in circuit substrate and method of producing the same
04/15/2010US20100089627 Multilayer three-dimensional circuit structure and manufacturing method thereof
04/15/2010US20100089626 Composite, prepreg, laminated plate clad with metal foil, material for connecting circuit board, and multilayer printed wiring board and method for manufacture thereof
04/15/2010US20100089625 Component having a ceramic base with a metalized surface
04/15/2010US20100089624 Multilayer ceramic substrate and process for producing the same
04/15/2010US20100089623 Conductive laminated body and method for preparing the same
04/15/2010US20100089622 Barrier Film for Flexible Copper Substrate and Sputtering Target for Forming Barrier Film
04/15/2010US20100089621 Nucleation layer for thin film metal layer formation
04/15/2010US20100089619 Circuit board of communication product and manufacturing method thereof
04/15/2010US20100088887 Circuit board and method for manufacturing the same
04/15/2010DE202010000045U1 Leiterplattenanordnung Printed circuit board assembly
04/15/2010DE102009026262A1 Platine Circuit board
04/15/2010DE102009001741A1 Kommunikationsgerätespezifische Platine und dazugehöriges Fertigungsverfahren Device-specific communication board and associated manufacturing processes
04/15/2010DE102008060645A1 Leiterplatte mit ausgerichteten Nanostrukturen PCB with aligned nanostructures
04/15/2010DE102008051531A1 Electromagnetic disturbance's propagation suppressing device for use in electrical system, has electrically conductive ring structure and electrically conductive surface electrically connected with each other
04/15/2010DE102008050983A1 Method for manufacturing a solderable multilayer-structure by manufacturing electrically conductive first layer on an electrically insulated substrate and activating a surface of the first layer
04/15/2010DE102008050798A1 Method for positioning and fixing e.g. semiconductor chip, on e.g. direct copper Bonding substrate, involves pressing components together such that electrical connection and mechanical fixing of components are obtained
04/15/2010DE102008042810A1 Verfahren zur Herstellung eines mit elektrischen Elementen versehenen Substrats A method for preparing a substrate provided with electric elements
04/14/2010EP2175703A1 Plasma display device
04/14/2010EP2174910A1 High conductive paste composite and method of producting the same
04/14/2010EP2174324A1 Conductive patterns and methods of using them
04/14/2010EP1550358B1 Printed board comprising at least one stiff area and at least one flexible area, and method for the production of stiff-flexible printed boards
04/14/2010EP1503216B1 Sheet-form connector and production method and application therefor
04/14/2010CN201438809U electromagnetic interference suppression module
04/14/2010CN201438789U 电路板 Board
04/14/2010CN201438788U Printed circuit board and module with surface mount component
04/14/2010CN201438787U 电路板 Board
04/14/2010CN201438786U Circuit board connected with external heat dissipation device
04/14/2010CN201438785U LED printed circuit pressure plate
04/14/2010CN201438784U Irregular cutting circuit board
04/14/2010CN201438783U Multiple-printed-panel for motor circuit board
04/14/2010CN201438782U Multiple-printed-panel for circuit board
04/14/2010CN201438769U LED display isolating power supply
04/14/2010CN1925720B Wiring board and capacitor
04/14/2010CN1874651B Wired circuit board and production method thereof
04/14/2010CN1806301B High-frequency heating device
04/14/2010CN1741707B Printed circuit board including embedded capacitor having high dielectric constant and method of fabricating same
04/14/2010CN101695221A Technique for accommodating electronic components on a multilayer signal routing device
04/14/2010CN101695216A Printed circuit board and manufacturing method thereof
04/14/2010CN101695215A Copper foil with low profile bond enhancement
04/14/2010CN101437358B Protection film for printed circuit board and procedure for processing circuit board using the protection film
04/14/2010CN101414592B Image sensor encapsulation
04/14/2010CN101326864B Padless substrate for surface mounted components
04/14/2010CN101090075B Manufacturing method for vertical built-in capacity substrate and its structure
04/13/2010US7697301 Printed circuit board having embedded electronic components and manufacturing method thereof
04/13/2010US7696852 Electronic transformer/inductor devices and methods for making same
04/13/2010US7696617 Package for semiconductor devices
04/13/2010US7696614 Driver module structure
04/13/2010US7696613 Multilayered wiring substrate including wiring layers and insulating layers and method of manufacturing the same
04/13/2010US7696526 Surface mount optoelectronic component
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