H05K 1 - Printed circuits - Patents Sitemap

Patents for H05K 1 - Printed circuits (98,583)
10/2011
10/19/2011	CN102223753A Circuit board and production method thereof
10/19/2011	CN102223752A Multi-layer flexible circuit board and manufacturing method thereof
10/19/2011	CN102223751A Multilayer circuit board and assembly thereof
10/19/2011	CN102220611A Prevention mechanism for flying target falling off in printed circuit board plating production line
10/19/2011	CN101026931B Right-angled signal line making method and its circuit board
10/18/2011	US8040930 Drive circuit for semiconductor light emitting element, and light source device, lighting device, monitor device, and image display device using the drive circuit
10/18/2011	US8040690 Inner-connecting structure of lead frame and its connecting method
10/18/2011	US8040685 Stacked wiring board and method of manufacturing stacked wiring board
10/18/2011	US8040657 Ceramic multilayer substrate
10/18/2011	US8039762 Printed circuit board having a buried solder bump and a circuit layer flush with an insulating layer
10/18/2011	US8039761 Printed circuit board with solder bump on solder pad and flow preventing dam
10/18/2011	US8039760 Mounting board and method of producing the same
10/18/2011	US8039759 Method for manufacturing a printed circuit board with a thin film capacitor embedded therein having a dielectric film by using laser lift-off, and printed circuit board with a thin film capacitor embedded therein manufactured thereby
10/18/2011	US8039758 Mounting structure for electronic component
10/18/2011	US8039757 Electronic part mounting substrate and method for producing same
10/18/2011	US8039756 Multilayered wiring board, semiconductor device in which multilayered wiring board is used, and method for manufacturing the same
10/18/2011	US8039755 Method for manufacturing a printed circuit board element as well as a printed circuit board element
10/18/2011	US8039752 Heat dissipation structure of a print circuit board
10/18/2011	US8039320 Optimized circuit design layout for high performance ball grid array packages
10/18/2011	US8037596 Method for manufacturing a wiring board
10/18/2011	CA2477948C Silicone resin based composites interleaved for improved toughness
10/13/2011	WO2011127328A2 Electronic assemblies and methods of forming electronic assemblies
10/13/2011	WO2011126925A2 Debond interconnect structures
10/13/2011	WO2011125874A1 Mounting board and method for manufacturing a mounting board
10/13/2011	WO2011125821A1 Thermosetting resin composition and printed wiring board
10/13/2011	WO2011125741A1 Membrane wiring board
10/13/2011	WO2011125707A1 Antenna apparatus and wireless communication device using same
10/13/2011	WO2011125344A1 Substrate and method for manufacturing substrate
10/13/2011	WO2011125037A2 Process for producing electric circuits on a given surface
10/13/2011	WO2011043625A3 Heat radiating printed circuit board and chassis assembly having the same
10/13/2011	US20110249419 Circuit board assembly and connecting bracket thereof
10/13/2011	US20110249417 Anisotropic conductive resin, substrate connecting structure and electronic device
10/13/2011	US20110249414 System for placing electronic devices in a restricted space of a printed circuit board
10/13/2011	US20110249411 Circuit Module and Electronic Apparatus
10/13/2011	US20110249397 Mounting apparatus and system for pci card
10/13/2011	US20110248398 Wafer-level chip-scale package device having bump assemblies configured to mitigate failures due to stress
10/13/2011	US20110247874 Adhesive for bonding circuit members, circuit board and process for its production
10/13/2011	US20110247873 Adhesive for bonding circuit members, circuit board and process for its production
10/13/2011	US20110247872 Debond interconnect structures
10/13/2011	US20110247871 Multi-layer printed circuit board comprising film and method for fabricating the same
10/13/2011	US20110247870 Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the same
10/13/2011	US20110247869 Multilayer printed circuit board
10/13/2011	US20110247868 Printed circuit board
10/13/2011	US20110247867 Adhesive for bonding circuit members, circuit board and process for its production
10/13/2011	US20110247866 Conductive paste containing silver-decorated carbon nanotubes
10/13/2011	US20110247865 Method for producing multilayer wiring substrate and multilayer wiring substrate
10/13/2011	US20110247864 Thermosetting ink composition
10/13/2011	US20110247863 Flexible printed board and method of manufacturing same
10/13/2011	US20110247861 Electronic device and latching mechanism thereof
10/13/2011	US20110247860 Method of producing circuit board, and circuit board obtained using the manufacturing method
10/13/2011	US20110247859 Method for manufacturing a submillimetric electrically conductive grid, and submillimetric electrically conductive grid
10/13/2011	US20110247858 Printed Circuit Board and Method Of Manufacturing The Same
10/13/2011	DE102010014579A1 Producing electronic assembly, comprises providing electrically conductive film including support film and electrical component with electrical contact point, and forming component with electrical contact point on conductive film
10/13/2011	DE102010003927A1 Control module for motor car gear box, has contacting areas firmly bonded i.e. laser-welded, with one another such that strip guard layer extends at underside and fixed permanently adjacent to underside
10/13/2011	DE102010003923A1 Drive control module for use in motor car, has circuitry carrier attaching drive control electronics unit to components, and electromagnetic compatibility filter module arranged in recess for receiving filter module in circuitry carrier
10/13/2011	DE102010003678A1 Method for manufacturing control module for transmission control of motor car, involves providing recess in printed circuit board, and pressing functional printed circuit board module into recess
10/13/2011	CA2777350A1 Process for producing electric circuits on a given surface
10/12/2011	EP2375878A2 Light emitting device module
10/12/2011	EP2375877A2 Planar voltage protection assembly
10/12/2011	EP2374335A1 Flexible electronic product and method for manufacturing the same
10/12/2011	EP2223415B1 Circuit configuration for eliminating emc interference
10/12/2011	EP2086295B1 Printed circuit board and method of manufacturing the same
10/12/2011	EP1639872B1 Integrated electromechanical arrangement and method of production
10/12/2011	EP0952762B1 Printed wiring board and method for manufacturing the same
10/12/2011	CN202009541U Tin window structure of grounding hole of printed circuit board (PCB)
10/12/2011	CN202009540U Printed circuit board (PCB) with point discharge
10/12/2011	CN202009539U Printed circuit board-grounding positioning hole
10/12/2011	CN202009538U Antenna matching circuit board
10/12/2011	CN202009537U PCB (printed circuit board) of mobile phone
10/12/2011	CN202009536U Flexible circuit board
10/12/2011	CN202009535U Circuit board for keypads of mobile phones
10/12/2011	CN202009534U Reinforced structure for preventing break of flexible circuit board
10/12/2011	CN202009533U LED printed circuit board
10/12/2011	CN1913044B Thick film conductor composition, and its use in ltcc circuit and device
10/12/2011	CN1883237B Lighting device of discharge lamp, illumination apparatus and illumination system
10/12/2011	CN102217430A Illumination device comprising two printed circuit boards
10/12/2011	CN102217429A Method and apparatus for reacting thin films on low-temperature substrates at high speeds
10/12/2011	CN102217149A Improved patch panel assembly for use with data networks
10/12/2011	CN102217009A Method for producing substrate having patterned conductive polymer film and substrate having patterned conductive polymer film
10/12/2011	CN102215639A Semiconductor chip built-in wiring board and manufacturing method thereof
10/12/2011	CN102215637A Manufacturing method of semiconductor chip-embedded wiring substrate
10/12/2011	CN102215635A Copper foil for processing copper clad laminate, copper clad laminate and printed wiring board equipped with copper clad laminate
10/12/2011	CN102215634A Composition with catalyst particles
10/12/2011	CN102215633A Circuit board and manufacturing method thereof
10/12/2011	CN102215632A Copper foil for processing copper clad laminate, copper clad laminate and printed wiring board equipped with copper clad laminate
10/12/2011	CN102215631A Wiring substrate unit and printer including the same
10/12/2011	CN102215630A Flexible printed board and method of manufacturing same
10/12/2011	CN102215629A Printed circuit board, manufacturing method thereof as well as computer
10/12/2011	CN102215628A Super-thick circuit board
10/12/2011	CN102215627A Multilayer circuit board
10/12/2011	CN102214646A Onboard roughening structure
10/12/2011	CN102213805A Opto-electronic transceiver module with castellated electrical turn
10/12/2011	CN102212240A Printed circuit board protective film and using method thereof
10/12/2011	CN102212187A Liquid crystal thermoset oligomer or polymer and thermoset composition and plate containing the same
10/12/2011	CN101594731B Flexible printed wiring board
10/12/2011	CN101553094B A method for manufacturing a circuit board provided with an embedded typed metal conduction column
10/12/2011	CN101419949B Circuit apparatus and method of manufacturing the same
10/12/2011	CN101378622B Covering film for flexible circuit board and preparation method thereof
10/12/2011	CN101208854B Drive circuit of motor and outdoor unit of air conditioner
10/11/2011	US8035984 Substrate structures and methods for electronic circuits

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