Patents for H05K 1 - Printed circuits (98,583)
05/2012
05/02/2012EP2447990A1 Base plate
05/02/2012EP2447989A1 Semiconductor package and semiconductor package mounting structure
05/02/2012EP2447887A2 Integrated PCB UHF RFID matching network/antenna
05/02/2012EP2447596A2 Light emitting device and illumination device
05/02/2012EP2447595A1 Light emitting module
05/02/2012EP2445716A1 High performance, high temperature lightweight film, tape or sheath for wire insulation
05/02/2012EP1964174B1 Enhanced substrate using metamaterials
05/02/2012EP1291577B1 Small portable flashlight
05/02/2012CN202210923U Multi-row core step type cooling fin
05/02/2012CN202210906U Circuit board and constant-pressure pump using same
05/02/2012CN202210905U Pcb
05/02/2012CN202210904U Power supply printed wiring board
05/02/2012CN202210903U Structure for improving multilayer circuit board stitching and glue filling
05/02/2012CN202210902U Dustproof printed circuit board
05/02/2012CN202210901U Printed circuit board for protecting welding spot
05/02/2012CN202210900U Circuit board in lamp holder of electrodeless lamp
05/02/2012CN202210899U Circuit board of solar lawn lamp
05/02/2012CN202210898U Convex copper structure of circuit board
05/02/2012CN202210535U Flexible circuit board for LED
05/02/2012CN102440083A Printed circuit board for providing ambient light
05/02/2012CN102440082A Motherboard with connector for extender
05/02/2012CN102440081A High impedance trace
05/02/2012CN102438826A Flexible metal-clad laminate and manufacturing method thereof
05/02/2012CN102438413A Second-order ladder groove bottom graphical printed board and processing method thereof
05/02/2012CN102438407A Packaging design method of PCB board of machine plug-in type electronic component and PCB board
05/02/2012CN102438404A Preparation method of embedded resistor for printed circuit board
05/02/2012CN102438402A Electronic apparatus
05/02/2012CN102438401A Multilayer printed wiring board
05/02/2012CN102438400A Adjustable resistor in multi-layer base plate and forming method thereof
05/02/2012CN102438399A Metal PCB (Printed Circuit Board) space-free jointed board and cutting method thereof
05/02/2012CN102438398A Electronics arrangement and control equipment
05/02/2012CN102438397A Circuit carrier and method for producing a circuit carrier
05/02/2012CN102438396A Anodized heat-radiating substrate and method of manufacturing the same
05/02/2012CN102438395A Goldfinger structure of module board
05/02/2012CN102438394A Flexible circuit board
05/02/2012CN102438393A Printed board fixing apparatus
05/02/2012CN102438392A System and method for controlling impedance in a flexible circuit
05/02/2012CN102437484A Network jack with protective circuit, computer mainboard and jack circuit board
05/02/2012CN102437435A Module
05/02/2012CN102433000A Composition for preparing thermosetting resin, cured product of the composition, prepreg and prepreg laminate having the cured product, and metal clad laminate and printed circuit board having the prepreg or the prepreg laminate
05/02/2012CN102432999A Composition for preparing thermosetting resin, cured product of the composition, prepreg and prepreg laminate having the cured product, and metal clad laminate and printed circuit board having the prepreg or the prepreg laminate
05/02/2012CN101888741B Printed circuit board and notebook computer
05/02/2012CN101836518B Ceramic multilayer substrate
05/02/2012CN101754636B Circuit board and electronic device with the same
05/02/2012CN101653050B Enhanced localized distributive capacitance for circuit boards
05/02/2012CN101343412B Prepreg and laminate
05/02/2012CN101292576B A component adapted for being mounted on a substrate and a method of mounting a surface mounted device
05/01/2012USRE43330 Circuit board via arrangement for differential signal connector
05/01/2012US8169792 Multilayer printed wiring board
05/01/2012US8169791 Electronic module and method for producing such a module
05/01/2012US8169767 Boron nitride agglomerated powder and devices comprising the powder
05/01/2012US8168895 Printed wiring board
05/01/2012US8168894 Light emitting diode (LED) circuit board with multi-directional electrical connection
05/01/2012US8168893 Multilayer wiring board with concave portion for accomodating electronic component
05/01/2012US8168892 Soldermask-less printed wiring board
05/01/2012US8168891 Differential trace profile for printed circuit boards
05/01/2012US8168890 Printed circuit board and component package having the same
05/01/2012US8168889 Thermosetting conductive paste and multilayer ceramic part having an external electrode formed using the same
05/01/2012US8168731 Curable resin composition, cured product thereof, printed wiring board, epoxy resin, and process for producing the same
05/01/2012US8168288 Multilayer ceramic substrate and method for manufacturing the same
05/01/2012US8167628 Polymer substrate for flexible display having enhanced flexibility
05/01/2012US8166649 Method of forming an electroded sheet
04/2012
04/26/2012WO2012054459A1 Bonding and electrically coupling components
04/26/2012WO2012053728A1 Printed circuit board and method for manufacturing the same
04/26/2012WO2012053580A1 Metal core substrate and electrical connection box using said metal core substrate
04/26/2012WO2012053092A1 Printed wiring board and connector, and method for manufacturing printed wiring board
04/26/2012US20120099285 Laminated substrate with coils
04/26/2012US20120099283 Display device
04/26/2012US20120099282 Electronic Device and Flexible Printed Wiring Board
04/26/2012US20120098111 High current capacity inner leads for semiconductor devices, interposer and leadframe
04/26/2012US20120097442 Printed circuit board incorporating fibers
04/26/2012US20120097441 Electronic element and method for assembling the same to circuit board
04/26/2012US20120097440 Method for electronic component layout of circuit board and printed circuit board structure
04/26/2012US20120097439 Modified polyimide and method for producing modified polyimide
04/26/2012US20120097438 Printed Circuit Board and Method For Fabricating The Same
04/26/2012US20120097437 Resin Composition, and Prepreg and Printed Circuit Board Prepared Using the Same
04/26/2012US20120097436 Printed circuit board
04/26/2012US20120097435 Photosensitive modified polyimide resin composition and use thereof
04/26/2012US20120097434 Electroconductive element, electroconductive element manufacturing method, wiring element, information input device, display device, and electronic apparatus
04/26/2012US20120097433 Signal line and circuit substrate
04/26/2012US20120097432 Electrode array
04/26/2012US20120097431 Lightweight circuit board with conductive constraining cores
04/26/2012US20120097430 Packaging substrate and method of fabricating the same
04/26/2012US20120097429 Package substrate and fabrication method thereof
04/26/2012US20120097428 Signal line path and manufacturing method therefor
04/26/2012US20120097427 Laminated film and molded body
04/26/2012US20120097426 Structure for shorting line connecting signal lines of flat panel display device
04/26/2012DE102011116584A1 Elektrisches bauteil zur oberflächenbestückung Electrical component for surface mount
04/26/2012DE102010049333A1 Endless band shaped structure for retaining e.g. power LEDs, has reflecting film covering strip guard structure, where reflecting film is left blank in punched receiving areas utilized for retaining electronic parts
04/26/2012DE102010042721A1 Ausgangswerkstoff einer Sinterverbindung und Verfahren zur Herstellung der Sinterverbindung Starting material compound and a sintering process for producing the sintered compound
04/26/2012DE102010042702A1 Ausgangswerkstoff einer Sinterverbindung und Verfahren zur Herstellung der Sinterverbindung Starting material compound and a sintering process for producing the sintered compound
04/26/2012DE102007017529B4 Modul für eine elektronische Steuervorrichtung mit vereinfachtem Aufbau, Verfahren zur Herstellung sowie Verwendung eines solchen Moduls Module for an electronic control device having a simplified structure, methods of making and use of such a module
04/25/2012EP2444530A1 Copper foil and a method for producing same
04/25/2012CN202206716U U型折弯散热片 U-bend fins
04/25/2012CN202206712U 带有电子元件的立式散热片 Vertical fins with electronic components
04/25/2012CN202206711U 铜铝复合阶梯形散热片 TLF stepped fins
04/25/2012CN202206710U 双向阶梯形散热片 Bidirectional stepped fins
04/25/2012CN202206708U 设有电子元件托台的散热片 The pallet is provided with an electronic component heat sink
04/25/2012CN202206659U 内埋元件的双层线路板 Buried double circuit board components
04/25/2012CN202206658U 高密度高速度的印制电路板 High-speed high-density printed circuit boards