Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
10/2012
10/24/2012CN101720165B Component built-in wiring substrate and manufacturing method thereof
10/24/2012CN101454153B Copper foil with carrier sheet, manufacturing method of copper foil with carrier sheet, surface-treated copper foil with carrier sheet, and copper laminated plate using the surface-treated copper foil
10/24/2012CN101233793B method for manufacturing solder mounting structure and braze installation method thereof
10/24/2012CN101117275B Glass fiber-reinforced prepregs, laminates, electronic circuit boards and methods for assembling a fabric
10/24/2012CN101080138B Printed wiring board, method for forming the printed wiring board, and board interconnection structure
10/23/2012US8295058 Structure for enhancing reference return current conduction
10/23/2012US8294042 Connector and manufacturing method thereof
10/23/2012US8294041 Circuit board and manufacturing method thereof
10/23/2012US8294040 Porous film and multilayer assembly using the same
10/23/2012US8294039 Surface finish structure of multi-layer substrate and manufacturing method thereof
10/23/2012US8294037 Method for arranging a component on a circuit board
10/23/2012US8294036 Electronic component and electronic component module
10/23/2012US8294035 Printed circuit board to prevent electrostatic discharge and manufacturing method thereof
10/23/2012US8294034 Circuit board and process for fabricating the same
10/23/2012US8294033 Circuit board and method of producing a circuit board
10/23/2012US8294032 Method and apparatus for aligning and installing flexible circuit interconnects
10/23/2012US8294031 Solder resist coating for rigid-flex circuit boards and method of producing the solder resist coating
10/23/2012US8293579 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
10/23/2012CA2547029C Compensation system and method for negative capacitive coupling in idc
10/23/2012CA2472336C Technique for accommodating electronic components on a multilayer signal routing device
10/22/2012DE202010017772U1 Leiterplatte mit Kühlfluidkanal PCB with coolant channel
10/18/2012WO2012141869A1 Low temperature contact structure for flexible solid state device
10/18/2012WO2012141200A1 Anisotropic conductive film, connection method, and connected structure
10/18/2012WO2012140908A1 Laminate sheet, circuit board, and semiconductor package
10/18/2012WO2012140907A1 Laminate sheet, circuit board, semiconductor package, and method for producing laminate sheet
10/18/2012WO2012093895A3 Resin composition, prepreg using same, and printed wiring board
10/18/2012WO2012081864A3 Semiconductor test apparatus
10/18/2012US20120262896 Mounting apparatus for expansion card
10/18/2012US20120262885 Signal transfer circuit
10/18/2012US20120262659 Wiring layer, semiconductor device, and liquid crystal display device using semiconductor device
10/18/2012US20120262658 Lead line structure and display panel having the same
10/18/2012US20120261832 Wiring Board, Semiconductor Device, and Method for Manufacturing Wiring Board
10/18/2012US20120261801 Wiring Board, Semiconductor Device, and Method for Manufacturing Wiring Board
10/18/2012US20120261180 Circuit Board
10/18/2012US20120261179 Interposer substrate and method of manufacturing the same
10/18/2012US20120261178 Interconnection substrate design supporting device, method of designing interconnection substrate, program, and interconnection substrate
10/18/2012US20120261177 Device packaging structure and device packaging method
10/18/2012US20120261176 Circuit board structure and packaging structure comprising the circuit board structure
10/18/2012US20120261175 Printed circuit board
10/18/2012US20120261174 Conductive connecting material, method for producing electronic component, electronic member with conductive connecting material and electronic component
10/18/2012US20120261173 Method for shielding printed circuit board and printed circuit board
10/18/2012US20120261172 Structure and pattern forming method of transparent conductive circuit
10/18/2012US20120261171 Anisotropic conductive film, joined structure, and connecting method
10/18/2012US20120261170 Electronic device having backboard assembly
10/18/2012US20120261169 Interconnect-use electronic component and method for producing same
10/18/2012US20120261168 Method for fabricating electrical circuitry on ultra-thin plastic films
10/18/2012US20120261167 Transparent Electrodes, Electrode Devices, and Associated Methods
10/18/2012US20120261166 Printed circuit board and method of manufacturing the same
10/18/2012US20120261165 Interconnect device and method of fabricating same
10/18/2012US20120260973 Busing sub-assembly for photovoltaic modules
10/17/2012EP2512036A1 Wireless terminal and implementation method for reducing peak value of specific absorption rate (sar)
10/17/2012EP2511987A2 Improved multiple direct contacting of electrical components
10/17/2012EP2511986A2 Electric assembly
10/17/2012EP2511744A1 Optical backplane interconnection system and communication device
10/17/2012EP2510025A1 Resins
10/17/2012CN202496134U Combined device of thin battery and circuit board
10/17/2012CN202496133U Integrated flexible printed circuit board
10/17/2012CN202496132U Multilayer protective frame and protective device for preventing sensitive data from being stolen
10/17/2012CN202496131U PCB wiring diagram of printed circuit board conductive pattern
10/17/2012CN202496130U Printed circuit board
10/17/2012CN202496129U Combination type printed board
10/17/2012CN202496096U Circuit board for induction cooker
10/17/2012CN202495478U LED circuit substrate and LED illuminant heat sink structure applying same
10/17/2012CN202494749U Multifunctional circuit board
10/17/2012CN1874648B Wiring board and manufacturing method of wiring board
10/17/2012CN102742370A Method for manufacturing a metallized ceramic substrate
10/17/2012CN102742369A Tile, assembly of tiles with a carrier, method of manufacturing an assembly
10/17/2012CN102742027A Assembly, method of assembling, and tile for use in assembly
10/17/2012CN102741352A Metal-resin composite
10/17/2012CN102741344A Phenol resin composition, process for production thereof, curable resin composition, cured products tehreof, and printed wiring board
10/17/2012CN102740614A Method for manufacturing multilayer printed wiring board
10/17/2012CN102740610A Surface mounted device and assembly method
10/17/2012CN102740608A Combined-type circuit board and manufacturing method thereof
10/17/2012CN102740602A Manufacture method for substrate with heat conduction graphite and product
10/17/2012CN102740600A Electronic component, electronic equipment, and soldering paste
10/17/2012CN102740599A Novel printed circuit board of central electrical appliance box
10/17/2012CN102740598A Three-layer anti-fake label PCB plate and preparation process thereof
10/17/2012CN102740597A Manufacturing method for substrate embedded with electronic element
10/17/2012CN102740596A PCB (Printed Circuit Board) microstrip printed inductor
10/17/2012CN102740595A Solar cell panel having serial connection or parallel connection structure and manufacturing method for solar cell panel
10/17/2012CN102740594A Printed circuit board and method of manufacturing the same
10/17/2012CN102740593A Circuit board for dissipating heat of LED (light emitting diode) and manufacture method of circuit board
10/17/2012CN102740592A Circuit board with improved heat dissipation performance
10/17/2012CN102740591A Double-sided aluminum base circuit board with super-high thermal conductivity and preparation method thereof
10/17/2012CN102740590A Ceramic substrate and method for manufacturing the same
10/17/2012CN102740589A Composite circuit board with fracturable structure
10/17/2012CN102740588A Printed circuit board
10/17/2012CN102740587A Selection ink printing base plate improved structure
10/17/2012CN102740586A Circuit board
10/17/2012CN102740585A Circuit board and manufacturing method thereof
10/17/2012CN102740584A Printed circuit board and processing method thereof
10/17/2012CN102740583A 电路板 Board
10/17/2012CN102740582A Multilayer printed wiring board and producing method thereof
10/17/2012CN102739267A Sound receiving interface structure and electronic device using the same
10/17/2012CN102739039A Electronic direct current conversion device, printed circuit board (PCB) and electronic direct current conversion method
10/17/2012CN102738653A Plugging mechanism and finished circuit board internally provided with same as well as plugging frame
10/17/2012CN102738609A Fixing apparatus for electronic device
10/17/2012CN102738112A Packaging substrate and method of fabricating same
10/17/2012CN102737842A Thin film capacitor, mounting substrate, and method of manufacturing the mounting substrate
10/17/2012CN102737753A Conducting paste and conducting pattern
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