Patents for H05K 1 - Printed circuits (98,583)
11/2012
11/22/2012US20120292091 Circuit board having bypass pad
11/22/2012US20120292090 Printed circuit board
11/22/2012US20120292089 Circuit board structure with capacitors embedded therein and method for fabricating the same
11/22/2012US20120292088 Electronic device with obliquely connected components
11/22/2012US20120292087 Method for soldering surface-mount component and surface-mount component
11/22/2012US20120292086 Interposer films useful in semiconductor packaging applications, and methods relating thereto
11/22/2012US20120292085 Flexible printed circuit and method of manufacturing the same
11/22/2012US20120292084 Flexible base material and flexible electronic device
11/22/2012US20120292083 Method of producing circuit board by additive method, and circuit board and multilayer circuit board obtained by the method
11/22/2012US20120292082 Anisotropic conductive film
11/22/2012US20120291837 Electrode Tape, Solar Cell Module and Methods for Manufacturing the Same
11/22/2012US20120291259 Mounting arrangement and method for light emitting diodes
11/22/2012DE19681566B3 Kupferlegierungsfolien für flexible Stromwege Copper alloy films for flexible flow paths
11/22/2012DE112011100335T5 Leiterplatten-Randstecker PCB edge connector
11/22/2012DE112010003907T5 Geräteschnittstellenkarte mit Hohlraum-Rückseite für Ultrahoch-Frequenzanwendungen Device Interface card with cavity-back for ultra-high-frequency applications
11/22/2012DE112009001730T5 Schaltungsmaterialien, Schaltungslaminate und Herstellungsverfahren hiervon Circuit materials, circuit laminates and manufacturing method thereof
11/22/2012DE102011101805A1 Schaltungsträger Circuit board
11/22/2012DE102011075901A1 Coil arrangement for use in identification transmitter i.e. remote control key, for motor car, has active and/or passive electronic component i.e. surface mount device-component, mounted on circuit board between coil and circuit board
11/22/2012DE102011075866A1 Mehrlagige Leiterplatte mit eingebettetem EMV-Kondensator Multi-layer PCB with embedded EMC capacitor
11/22/2012DE102008002507B4 Leiterplatte mit elektromagnetischer Bandabstandstruktur PCB with electromagnetic bandgap structure
11/21/2012EP2525637A1 Liquid-cooled integrated substrate and method for manufacturing liquid-cooled integrated substrate
11/21/2012EP2525633A1 Electronic circuit, method for forming same, and copper clad laminate for electronic circuit formation
11/21/2012EP2525632A1 Systems for circuit board heat transfer and method of assembling same
11/21/2012EP2525398A1 Silicon nitride substrate, circuit substrate and electronic device using same
11/21/2012EP2524953A1 Anisotropic electrically-conductive adhesive agent
11/21/2012CN202551500U Mainboard connection structure for meeting system
11/21/2012CN202551499U Flexible printed circuit board with multidirectional interfaces
11/21/2012CN202551498U Flexible printed circuit board being combined with semiconductor device
11/21/2012CN202551497U Switch and socket integrated novel circuit board
11/21/2012CN202551496U Circuit board with micro connection structure
11/21/2012CN202551495U External-force-resistant and high-reliability interconnected circuit board with bumps
11/21/2012CN202551494U High heat conductivity PCB (Printed Circuit Board) metal substrate
11/21/2012CN202551493U Printed circuit board
11/21/2012CN202551492U Circuit board for branching/ distributing device
11/21/2012CN202551491U Flexible circuit board for manufacturing continuous LED light strip
11/21/2012CN202551490U Flexible printed circuit board
11/21/2012CN202551489U Printed circuit board bored short slot
11/21/2012CN202551488U Cellphone side key FPC (flexible printed circuit)
11/21/2012CN202551487U Flexible circuit board accurate positioner
11/21/2012CN202551486U PCB (printed circuit board)
11/21/2012CN202550116U Electric connector and circuit board structure configured with electric connector
11/21/2012CN202549925U Light-emitting diode package and used PCB (Printed Circuit Board) type heat radiating base board
11/21/2012CN202549521U Surface-mounted resistor and surface mounting substrate provided with same
11/21/2012CN102792787A Multilayer wiring substrate, production method for multilayer wiring substrate, and via paste
11/21/2012CN102792786A Two-layer flexible substrate and process for producing same
11/21/2012CN102792785A Module substrate, production method for module substrate, and terminal connection board
11/21/2012CN102792784A Printed circuit board design for high speed application
11/21/2012CN102792513A Thermal sensor device with average temperature and hot spot feedback
11/21/2012CN102791769A Wire wrap compositions and methods relating thereto
11/21/2012CN102791082A Component built-in module, and manufacturing method for component built-in module
11/21/2012CN102791081A Connecting method for graphite circuit board and electronic element and product thereof
11/21/2012CN102791079A Manufacturing method of flexible circuit board and flexible circuit board manufactured by using manufacturing method
11/21/2012CN102791077A Power electronic device
11/21/2012CN102791076A PCB (Printed Circuit Board) planar transformer
11/21/2012CN102791075A Manufacture method of loader with three-dimensional inductance and structure of loader
11/21/2012CN102791074A Flexible printed circuit and method of manufacturing the same
11/21/2012CN102790161A Light emitting diode carrier
11/21/2012CN102790018A Semiconductor package, core layer material, buildup layer material, and sealing resin composition
11/21/2012CN102786771A Resin liquid, metal substrate adopting the resin liquid, and manufacturing method of the metal substrate
11/21/2012CN102785447A Method of producing flexible laminate sheet
11/21/2012CN102785420A Heat-stabilised poly(ethylene naphthalate) film for flexible electronic and opto-electronic devices
11/21/2012CN102785419A Heat-stabilised poly(ethylene naphthalate) film for flexible electronic and opto-electronic devices
11/21/2012CN102396037B Composition for forming conductor layer, conductor substrate, and method for producing conductor substrate
11/21/2012CN102109757B Negative, design method for same, and circuit substrate made of same
11/21/2012CN102036470B Low-thermal-resistance and high-radiation metal-base circuit board
11/21/2012CN101958292B Printed circuit board, encapsulation piece and manufacture methods thereof
11/21/2012CN101925254B Flexible printing substrate and computer using flexible printing substrate
11/21/2012CN101874336B Circuit configuration for eliminating emc interference
11/21/2012CN101849445B Ceramic substrate, method for producing ceramic substrate, and method for producing substrate for power module
11/21/2012CN101846882B Photocuring thermocuring resin composition, dry membrane, cured product and printed circuit board
11/21/2012CN101768328B Bonding film and used resin thereof
11/21/2012CN101634872B Adapter and mainboard
11/21/2012CN101533824B Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same
11/21/2012CN101119610B Circuit wired board
11/21/2012CN101081903B Prepreg and conductive layer-laminated substrate for printed wiring board
11/20/2012US8315678 Systems, methods, and apparatus for multilayer superconducting printed circuit boards
11/20/2012US8315068 Integrated circuit die stacks having initially identical dies personalized with fuses and methods of manufacturing the same
11/20/2012US8315061 Electronic circuit with elongated strip layer and method for the manufacture of the same
11/20/2012US8315060 Electronic component module and method of manufacturing the electronic component module
11/20/2012US8315059 Screw less fixing assembly for interface card
11/20/2012US8315056 Heat-radiating substrate and method of manufacturing the same
11/20/2012US8314349 Lead pin and wiring substrate with lead pin, and method of manufacturing the same
11/20/2012US8314348 Multilayer printed wiring board and method of manufacturing multilayer printed wiring board
11/20/2012US8314347 Wiring board with lead pins and method of producing the same
11/20/2012US8314346 Wiring board for light-emitting element
11/20/2012US8314345 Device mounting board and semiconductor module
11/20/2012US8314344 Wiring board and manufacturing method of the same
11/20/2012US8314343 Multi-layer board incorporating electronic component and method for producing the same
11/20/2012US8314342 Winding applied single vacuum pressure impregnation insulation system, a winding applied global vacuum pressure impregnation insulation system and an electrical rotating machine having said insulation systems
11/20/2012US8314340 Multilayer printed wiring board and method for manufacturing multilayer printed wiring board
11/20/2012US8314339 Circuit board with kneaded conductive paste
11/20/2012US8314338 Wired circuit board and connection structure between wired circuit boards
11/20/2012US8314203 Polyimide film
11/20/2012US8313940 Self-addressable self-assembling microelectronic systems and devices for molecular biological analysis and diagnostics
11/20/2012US8313836 Copolymer of styrene and maleic anhydride comprising an epoxy resin composition and a co-cross-linking agent
11/20/2012US8313831 Thermoplastic polyimide resin film, multilayer body and method for manufacturing printed wiring board composed of same
11/20/2012US8313825 Curable resin films
11/15/2012WO2012155135A2 Scalable high-bandwidth connectivity
11/15/2012WO2012153901A1 Wholly aromatic polyester amide copolymer resin, polymer film including the wholly aromatic polyester amide copolymer resin, flexible metal-clad laminate including the polymer film, and flexible printed circuit board including the flexible metal-clad laminate
11/15/2012WO2012153842A1 Through wiring substrate, electronic device package, and electronic component