Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
09/2012
09/26/2012CN102695768A Anisotropic electrically-conductive adhesive agent
09/26/2012CN102695612A Laminate plate, use therefor, and production method thereof
09/26/2012CN102695371A Manufacture method for embedded type line structure of circuit board
09/26/2012CN102695366A Wiring board with built-in electronic component and method for manufacturing the same
09/26/2012CN102695365A Printed circuit board assembly for a mobile terminal and method for fabricating the same
09/26/2012CN102695364A FPC for OLED light source, OLED light source and connecting method of OLED light source leading-out electrodes
09/26/2012CN102695363A Conductive element and method for producing the same, wiring element, information input device, and master
09/26/2012CN102695362A Connection cable for an electric connection of a measuring sensor and an evaluation electronics package
09/26/2012CN102695361A Printed circuit board
09/26/2012CN102695360A Circuit board and manufacturing method thereof
09/26/2012CN102695359A Circuit board with BGA area
09/26/2012CN102695358A Printed circuit board
09/26/2012CN102694221A Miniature embedded S-shaped bridge plane electromagnetic bandgap structure and building method thereof
09/26/2012CN102693948A Packing structure
09/26/2012CN102691878A Rolling copper foil and manufacturing method thereof
09/26/2012CN102161823B Composite material, high-frequency circuit substrate therefrom and manufacture method thereof
09/26/2012CN102093666B Halogen-free resin composite and preparation method of halogen-free copper clad laminate using same
09/26/2012CN101888748B Manufacturing method of circuit board
09/26/2012CN101735562B Epoxy resin composition, preparation method thereof, laminated material and copper-clad laminated board manufactured by adopting epoxy resin composition
09/26/2012CN101730376B Circuit structure with shielding effect and manufacturing method thereof
09/26/2012CN101686607B Four-layer circuit board capable of inhibiting warpage
09/26/2012CN101652033B PCB composite board for LED light-emitting diode
09/26/2012CN101545122B Electrolysis copper foil and circuit board
09/26/2012CN101458994B Staged capacitor construction, production method thereof, and substrate applying the same
09/26/2012CN101457049B Conductive pattern forming ink, conductive pattern, and wiring substrate
09/26/2012CN101160016B Wired circuit board
09/26/2012CN101106862B Printed circuit board and making method thereof
09/26/2012CN101048039B Optical/electrical circuit interconnect board and evaluation method thereof
09/25/2012US8274795 Portable electronic device with hollow support
09/25/2012US8274665 Image sensing and printing device
09/25/2012US8273997 Antireflective apparatus with anisotropic capacitive circuit analog sheets
09/25/2012US8273996 Z-directed connector components for printed circuit boards
09/25/2012US8273995 Concentric vias in electronic substrate
09/25/2012US8273994 BGA footprint pattern for increasing number of routing channels per PCB layer
09/25/2012US8273993 Electronic component module
09/25/2012US8273992 Wiring board
09/25/2012US8273603 Interposers, electronic modules, and methods for forming the same
09/20/2012WO2012125919A1 Composite laminate having a flexible circuit bridge and method of manufacture thereof
09/20/2012WO2012124689A1 Phosphorus-atom-containing oligomer composition, curable resin composition, substance resulting from curing same, and printed circuit board
09/20/2012WO2012124539A1 Electronic component, and method for producing same
09/20/2012WO2012124438A1 Photosensitive conductive paste and method of manufacturing conductive pattern
09/20/2012WO2012124424A1 Method for forming electronic circuit, electronic circuit, and copper-clad laminated board for forming electronic circuit
09/20/2012WO2012124307A1 Prepreg for build-up
09/20/2012WO2012122774A1 Burning-free and non-cyanide method for recycling waste printed circuit board
09/20/2012US20120236579 Flexible wiring module and flexible wiring device
09/20/2012US20120236523 Board unit and method of fabricating the same
09/20/2012US20120236514 Electrooptic substrate, electrooptic device, and electronic apparatus
09/20/2012US20120236513 Hermetically Sealed Radio-Frequency Front End
09/20/2012US20120236512 Printed circuit board and carrier
09/20/2012US20120236508 Electronic-component embedded resin substrate and electronic circuit module
09/20/2012US20120236504 Electronic device for switching currents and method for producing the same
09/20/2012US20120236230 Device substrate and method for manufacturing same
09/20/2012US20120236167 Flexible wiring structure, flexible wiring method, and imaging device
09/20/2012US20120235713 Wiring board and display apparatus
09/20/2012US20120234595 Electronic-component lead terminal and method of fabricating the same
09/20/2012US20120234593 Conductive foils having multiple layers and methods of forming same
09/20/2012US20120234592 Package and high frequency terminal structure for the same
09/20/2012US20120234591 Electromagnetic bandgap structure and printed circuit board
09/20/2012US20120234590 Printed circuit board
09/20/2012US20120234589 Wiring substrate and method of manufacturing the same
09/20/2012US20120234588 Low cost high frequency device package and methods
09/20/2012US20120234587 Printed wiring board, printed circuit board unit, electronic apparatus and method for manufacturing printed wiring board
09/20/2012US20120234586 Process for forming flexible substrates using punch press type techniques
09/20/2012US20120234585 Support for Electronic Circuits
09/20/2012US20120234584 Substrate for mounting semiconductor chip and method for producing same
09/20/2012US20120234583 Method for producing a ceramic component, ceramic component and component assembly
09/20/2012US20120234582 Mutual capacitance and magnetic field distribution control for transmission lines
09/20/2012US20120234581 Percolative Conductive Network and Conductive Polymer Composite
09/20/2012US20120234580 Circuit board
09/20/2012US20120234579 Method for contacting a chip
09/20/2012US20120234368 Substrate for photovoltaic cell
09/20/2012DE102011080855A1 Anschlussstift Pin
09/20/2012DE102011005658A1 Träger, vorzugsweise für ein elektronisches Bauteil, eine Baugruppe solcher Träger und ein Verfahren zur Herstellung einer Baugruppe solcher Träger Carrier, preferably for an electronic component, assembly of such a carrier and a method of manufacturing an assembly of such carriers
09/19/2012EP2501209A1 Printed wiring board, printed circuit board unit, electronic apparatus and method for manufacturing printed wiring board
09/19/2012EP2501208A2 Holder, in particular for an electronic component, assembly of such holders and a method for producing an assembly of such holders
09/19/2012EP2500623A1 Method for providing a reflective coating to a substrate for a light-emitting device
09/19/2012EP2499889A1 A shock damping and thermal isolation system for a surface mounted vibration sensitive device
09/19/2012EP2499887A1 Circuit board with offset via
09/19/2012EP2499280A1 Method for preventing or reducing silver migration in the crossover areas of a membrane touch switch
09/19/2012CN202444696U High-thermal conductivity combined circuit board
09/19/2012CN202444695U RCD (Resistance, Capacitance and Diode) buffer circuit printed substrate, buffer circuit board and buffer circuit
09/19/2012CN202444694U Pcb
09/19/2012CN202444693U Chip mounting PCB
09/19/2012CN202444692U Circuit board anti-electrostatic collecting frame with reinforcing device
09/19/2012CN202444691U Radio remote unit, base station and communication system
09/19/2012CN202444690U Fixing device for anti-static collection frame of circuit board
09/19/2012CN202444689U Circuit unit
09/19/2012CN202444609U Anti-interference microphone circuit and circuit board thereof
09/19/2012CN102687604A Circuit board with offset via
09/19/2012CN102687601A Production of conductor structures on plastic films by means of nano-inks
09/19/2012CN102687600A High-frequency signal line
09/19/2012CN102687599A Multi-chip wiring board and process for producing same,and wiring board and process for producing same
09/19/2012CN102687598A Flexible circuit board and manufacturing method thereof
09/19/2012CN102687211A Mounting structure of electronic component
09/19/2012CN102686777A Process for sintering nanoparticles at low temperatures
09/19/2012CN102686690A Circuit connection material, connection structure using same, and temporary pressure-bonding method
09/19/2012CN102686052A Flexible printed circuit board and manufacture method thereof
09/19/2012CN102686051A Processing method of printed circuit board (PCB) and PCB
09/19/2012CN102686036A Electronic module with guide foot and packaging method thereof
09/19/2012CN102686027A Flexible circuit board and manufacturing method thereof
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