| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 12/11/2012 | US8330053 Optoelectronic device and method for producing an optoelectronic device |
| 12/11/2012 | US8330052 Joined structure and method for producing the same |
| 12/11/2012 | US8330051 Multi-layer circuit board, method of manufacturing the same, and communication device |
| 12/11/2012 | US8330050 Wiring board having heat intercepting member |
| 12/11/2012 | US8330049 Circuit board module and method of manufacturing the same |
| 12/11/2012 | US8330047 Printed circuit board |
| 12/11/2012 | US8329839 Melt-processible poly(tetrafluoroethylene) |
| 12/11/2012 | US8328435 Printed circuit board positioning spacers in an optoelectronic module |
| 12/11/2012 | US8328101 Camera unit incoporating program script scanner |
| 12/11/2012 | CA2567104C Crosstalk compensation with balancing capacitance system and method |
| 12/06/2012 | WO2012166405A1 Low temperature co-fired ceramic structure for high frequency applications and process for making same |
| 12/06/2012 | WO2012166028A1 Thermo/electrical conductor arrangement for multilayer printed circuit boards |
| 12/06/2012 | WO2012165603A1 Portable electronic device, group of portable electronic devices, and method for manufacturing portable electronic device |
| 12/06/2012 | WO2012165530A1 Method for producing multi-layer substrate and multi-layer substrate |
| 12/06/2012 | WO2012165520A1 Wiring body connecting structure, wiring body, electronic device, illumination device, and method for producing electronic device |
| 12/06/2012 | WO2012165439A1 Primer layer for plating process, laminate for circuit board and production method for same, and multilayer circuit board and production method for same |
| 12/06/2012 | WO2012165317A1 Active ester resin, method for producing same, thermosetting resin composition, cured product thereof, semiconductor sealing material, prepreg, circuit board, and build-up film |
| 12/06/2012 | WO2012165265A1 Substrate, method for producing same, heat-releasing substrate, and heat-releasing module |
| 12/06/2012 | WO2012165240A1 Resin composition, prepreg and laminate |
| 12/06/2012 | WO2012165147A1 Resin composition and prepreg and metal foil clad laminate using same |
| 12/06/2012 | WO2012165111A1 Method for producing multi-layer substrate and multi-layer substrate |
| 12/06/2012 | WO2012165081A1 Condensate of amino-bearing silane coupling agent with metal alkoxide compound, material for laminate base comprising same as main component, laminate base and elecroconductive member, and processes for manufacturing same |
| 12/06/2012 | WO2012165045A1 Semiconductor device and wiring substrate |
| 12/06/2012 | WO2012165012A1 Resin composition |
| 12/06/2012 | WO2012164997A1 Laminate sheet, application therefor, and method for producing same |
| 12/06/2012 | WO2012163353A1 Linear actuator system with means for fire detection |
| 12/06/2012 | WO2012099430A3 Copper clad film for manufacturing a copper clad laminate having a carrier layer made of an aluminum material and copper clad laminate comprising same |
| 12/06/2012 | WO2012093860A3 Prepreg and printed wiring board including same |
| 12/06/2012 | US20120309233 Circuit member with enhanced performance |
| 12/06/2012 | US20120307470 Wiring substrate and method for manufacturing wiring substrate |
| 12/06/2012 | US20120307469 Multilayer wiring board, manufacturing method thereof, and semiconductor device |
| 12/06/2012 | US20120307468 Electronic apparatus |
| 12/06/2012 | US20120307466 Component-embedded substrate |
| 12/06/2012 | US20120307461 Flexible Circuit Board and Electric Device |
| 12/06/2012 | US20120307445 Printed circuit board (pcb) including a wire pattern, semiconductor package including the pcb, electrical and electronic apparatus including the semiconductor package, method of fabricating the pcb, and method of fabricating the semiconductor package |
| 12/06/2012 | US20120307444 Process for Enhanced 3D Integration and Structures Generated using the Same |
| 12/06/2012 | US20120306597 Resonant via structures in multilayer substrates and filters based on these via structures |
| 12/06/2012 | US20120306350 Pixel array substrate and display panel |
| 12/06/2012 | US20120305306 Copper nanoparticle application processes for low temperature printable, flexible/conformal electronics and antennas |
| 12/06/2012 | US20120305305 Electronic component including micro balls |
| 12/06/2012 | US20120305304 Electronic component module |
| 12/06/2012 | US20120305303 Microelectronic substrate for alternate package functionality |
| 12/06/2012 | US20120305302 Mounting structure of electronic component |
| 12/06/2012 | US20120305301 Circuit board with heat sink and method of fabricating the same |
| 12/06/2012 | US20120305300 Methods for manufacturing an electric contact pad and electric contact |
| 12/06/2012 | US20120305299 Printed circuit board with reference layer hole |
| 12/06/2012 | US20120305298 Bump with nanolaminated structure, package structure of the same, and method of preparing the same |
| 12/06/2012 | US20120305297 Method for manufacturing solder column, apparatus for manufacturing solder column, and solder column |
| 12/06/2012 | US20120305296 Low temperature co-fired ceramic structure for high frequency applications and process for making same |
| 12/06/2012 | US20120305295 Thermosetting composition |
| 12/06/2012 | US20120305294 Flexible printed wiring board having connector connecting portion |
| 12/06/2012 | US20120305293 Circuit board assembly and method of assembling circuit boards |
| 12/06/2012 | US20120305291 Primer layer for plating process, laminate for wiring board and method for manufacture thereof, multilayer wiring board and method for manufacture thereof |
| 12/06/2012 | US20120305230 Device for holding a source of light |
| 12/06/2012 | US20120305058 Collector sheet for solar cell |
| 12/06/2012 | US20120304460 Module manufacturing method |
| 12/06/2012 | DE112010004960T5 Leitpaste für Siebdruckverfahren Conductive paste for screen printing method |
| 12/06/2012 | DE102008002568B4 Elektromagnetische Bandabstandstruktur und Leiterplatte Electromagnetic bandgap structure and printed circuit board |
| 12/05/2012 | EP2530823A1 Power distribution mounting component and inverter apparatus using same |
| 12/05/2012 | EP2530103A1 Polyimide resin composition, adhesive agent and laminate each comprising same, and device |
| 12/05/2012 | EP2529606A1 Tile, assembly of tiles with a carrier, method of manufacturing an assembly |
| 12/05/2012 | EP2529605A1 Contact piece of golden finger, golden finger and connector comprising the golden finger |
| 12/05/2012 | EP2529604A1 Light source device on a printed circuit board and light source arrangement comprising a plurality of light source devices |
| 12/05/2012 | EP2529409A1 Assembly, method of assembling, and tile for use in assembly |
| 12/05/2012 | EP1754986B1 Optical communication device and optical communication device manufacturing method |
| 12/05/2012 | CN202587606U FPC (Flexible Printed Circuit) for mobile phone antenna |
| 12/05/2012 | CN202587605U PCB used for LED |
| 12/05/2012 | CN202587604U Interface circuit board of numerical control system of scraping and tumbling mill |
| 12/05/2012 | CN202587603U Circuit board for LED lamps |
| 12/05/2012 | CN202587602U PCB for touching-type LED flasher |
| 12/05/2012 | CN202587601U Printed circuit board (PCB) multi-layer board with blind holes and buried holes |
| 12/05/2012 | CN202587600U PCB provided with golden finger |
| 12/05/2012 | CN202587599U Via hole hole-filling thin film circuit |
| 12/05/2012 | CN202587598U Pad structure and printed circuit board (PCB) |
| 12/05/2012 | CN202587597U Golden finger circuit board |
| 12/05/2012 | CN202587596U Wiring substrate, cell stack and ambipolar secondary cell |
| 12/05/2012 | CN202587595U Copper-based conductive-ink all-printing printed circuit board |
| 12/05/2012 | CN202587594U Enhanced high-current-withstanding concentrating photovoltaic conversion receiver aluminium base circuit board |
| 12/05/2012 | CN202587593U Heavy current resistant optically focused photovoltaic photoelectric conversion receiver ceramic circuit board |
| 12/05/2012 | CN202587592U Button type FPC |
| 12/05/2012 | CN202587591U Multilayer PCB |
| 12/05/2012 | CN202587590U Insulated gap-filling multilayer PCB |
| 12/05/2012 | CN202587589U Pressure relief type multilayer PCB (Printed Circuit Board) |
| 12/05/2012 | CN202587588U Waterproof structure of electronic parts |
| 12/05/2012 | CN202587587U Printed circuit board (PCB) pad component and PCB |
| 12/05/2012 | CN202587586U Positioning structure with plug-in module on PCB (printed circuit board) |
| 12/05/2012 | CN202587585U Conductor and circuit board welding structure |
| 12/05/2012 | CN202587584U Circuit board having self-heating function |
| 12/05/2012 | CN202587583U Flexible circuit board improved structure |
| 12/05/2012 | CN202587582U Circuit board used in communication equipment |
| 12/05/2012 | CN202587581U Solar-energy concentrating-photovoltaic photoelectric conversion receiver aluminum circuit board |
| 12/05/2012 | CN202587580U Moulding processing hole for printed circuit board |
| 12/05/2012 | CN202587579U Welding type printed circuit board (PCB) |
| 12/05/2012 | CN202587578U Flexible flat cable assembly |
| 12/05/2012 | CN202587577U Rigid flexible substrate and electronic device possessing same |
| 12/05/2012 | CN202587576U Multilayer circuit board structure for adding line layers |
| 12/05/2012 | CN202586843U High power MOSFMT module |
| 12/05/2012 | CN202585842U Video interface connector and circuit board matched with video interface connector |
| 12/05/2012 | CN202585603U Lithium ion battery and patch board for same |
| 12/05/2012 | CN202585529U LED chip COB packaging structure, and lamp strip thereof |