Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
10/2012
10/31/2012CN102111953B Printed circuit board (PCB) and manufacturing method thereof
10/31/2012CN102017829B Unit with power circuit mounted therein, and motor drive apparatus
10/31/2012CN101489351B Built-in solid electrolytic capacitor for circuit board and circuit board using the built-in solid electrolytic capacitor of circuit board
10/31/2012CN101341633B Capacitor interconnection
10/30/2012US8300420 Circuit substrate for mounting electronic component and circuit substrate assembly having same
10/30/2012US8300365 Electronic substrate and magnetic disk apparatus
10/30/2012US8300199 Flexible printed circuit board and liquid crystal display device including the same
10/30/2012US8300035 Liquid crystal display device
10/30/2012US8299647 Switchable current supply for auxiliary current circuits in a current converter
10/30/2012US8299598 Grid array packages and assemblies including the same
10/30/2012US8299371 Circuitized substrate with dielectric interposer assembly and method
10/30/2012US8299370 Wiring board and method of manufacturing the same
10/30/2012US8299369 Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery
10/30/2012US8299368 Interconnection element for electric circuits
10/30/2012US8299367 Notch positioning type soldering structure and method for preventing pin deviation
10/30/2012US8299366 Wiring board and method for manufacturing the same
10/30/2012US8299365 Self-aligned composite M-MOx/dielectric cap for Cu interconnect structures
10/30/2012US8297222 Fully automated paste dispense system for dispensing small dots and lines
10/30/2012US8296942 Process for preparing a heatsink system and heatsink system obtainable by said process
10/29/2012CA2772749A1 Keypad having a curved shape
10/26/2012WO2012145237A1 Led array having embedded led and method therefor
10/26/2012WO2012144492A1 Led substrate, light-emitting module, method for producing led substrate, and method for producing light-emitting module
10/26/2012WO2012144435A1 Structure for connecting element to conductive member
10/26/2012WO2012144238A1 Wiring substrate
10/26/2012WO2012144170A1 Tape attachment device, tape attachment method, and display device
10/26/2012WO2012144115A1 Ceramic wiring board, multi-pattern ceramic wiring board, and method for producing same
10/26/2012WO2012144114A1 Wiring board, multi-pattern wiring board, and method for producing same
10/26/2012WO2012143873A1 Electrical device
10/26/2012WO2012142866A1 Double layer printed circuit board and mobile communication terminal
10/26/2012WO2012142712A1 Overmoulding method and overmoulded electronic device
10/26/2012WO2012118262A9 Wholly aromatic polyester amide copolymer resin, film containing resin, flexible metal foil laminate containing film, and flexible printed circuit board employing flexible metal foil laminate
10/26/2012CA2831931A1 Overmoulding method and overmoulded electronic device
10/25/2012US20120268904 Flexible printed circuit board
10/25/2012US20120268875 Mounting structure of circuit board having thereon multi-layered ceramic capacitor, method thereof, land pattern of circuit board for the same, packing unit for multi-layered ceramic capacitor taped horizontally and aligning method thereof
10/25/2012US20120268005 Substrate for organic electroluminescense device and method of manufacturing organic electroluminscense device employing same
10/25/2012US20120267778 Circuit board, semiconductor element, semiconductor device, method for manufacturing circuit board, method for manufacturing semiconductor element, and method for manufacturing semiconductor device
10/25/2012US20120267674 Mounting substrate, light emitting body, and method for manufacturing mounting substrate
10/25/2012US20120267158 Construction of reliable stacked via in electronic substrates - vertical stiffness control method
10/25/2012US20120267157 Printed circuit board and method of fabricating the same
10/25/2012US20120267156 Multilayer stacked circuit arrangement with localized separation section
10/25/2012US20120267155 Circuit substrate
10/25/2012US20120267154 Low Resistance, Multi-Contact Point Pin
10/25/2012US20120267153 Coupling device, assembly having a coupling device, and method for producing an assembly having a coupling device
10/25/2012US20120267152 Substrate and method of manufacturing substrate
10/25/2012US20120267151 Metal microparticle dispersion, process for production of electrically conductive substrate, and electrically conductive substrate
10/25/2012US20120267150 Functional element, sensor element, electronic apparatus, and method for producing a functional element
10/25/2012US20120267149 Method of manufacturing power module substrate and power module substrate
10/25/2012US20120267148 Circuit board
10/25/2012US20120267147 Method for Producing an Electronic Component and Electronic Component
10/25/2012DE112010005092T5 Leiterplatte Circuit board
10/25/2012DE102012206468A1 Verfahren und Vorrichtungen, um flexible (Flex-)Schaltkreise von optischen Sende-Empfängermodulen davor zu schützen, während der Herstellung und des Zusammenbaus der Module beschädigt zu werden To methods and apparatus to protect flexible (Flex) circuits of optical transceiver modules before, during manufacture and assembly of the modules is damaged
10/25/2012DE102008003372B4 Verfahren zur Herstellung eines mehrlagigen zwei- oder dreidimensionalen Schaltungsträgers A method for producing a two or three dimensional multi-layer circuit substrate
10/25/2012DE102007017546B4 Mehrzahl von Multichipmodulen und Verfahren zur Herstellung Plurality of multichip modules, and methods for preparing
10/24/2012EP2515623A2 Differential transmission circuit and information processing system
10/24/2012EP2515622A2 Light emitting device array
10/24/2012EP2515354A1 Led device, manufacturing method thereof, and light-emitting device
10/24/2012EP2515352A1 A manufacture method for a surface mounted power led support and its product
10/24/2012EP2514991A2 Holding element
10/24/2012EP2514590A1 Adhesive-free composite made of a polyarylene ether ketone foil and of a metal foil
10/24/2012EP2514282A1 Circuit board having a plurality of circuit board layers arranged one over the other having bare die mounting for use as a gearbox controller
10/24/2012EP2513969A1 Via structure integrated in electronic substrate
10/24/2012EP2513554A1 Lamp having a plurality of light-emitting diodes
10/24/2012CN202503864U Heat dissipation apparatus for circuit board
10/24/2012CN202503820U Circuit board
10/24/2012CN202503819U Electronic apparatus and chip module thereof
10/24/2012CN202503818U Magnetic core embedded PCB
10/24/2012CN202503817U Circuit board
10/24/2012CN202503816U PCB board structure of radio frequency transceiver
10/24/2012CN202503815U Point discharge proof high voltage resistance aluminum substrate
10/24/2012CN202503814U Heavy copper printed circuit board with inner layer and outer layer
10/24/2012CN202503813U Circuit board
10/24/2012CN202503812U Semi-flexible printed circuit board used for static bending
10/24/2012CN202503811U Flexible printed circuit board with reinforcing liner plates pasted at both surfaces
10/24/2012CN202503810U Flexible printed circuit board with end portion arc chamfer angles
10/24/2012CN202503809U Self-destruction protective cover for circuit board
10/24/2012CN202503808U Circuit board with protection film for protecting binding area
10/24/2012CN202503807U Surge protector printed circuit according with RS422 or RS485 communication protocols
10/24/2012CN202503806U Surge protector printed circuit according with RS232 communication protocols
10/24/2012CN202503805U Surge protector printed circuit of simulation/data signals
10/24/2012CN202503804U Single-side double-layer circuit board
10/24/2012CN202499834U Adhesive film
10/24/2012CN1988083B Thin-film capacitor and method for fabricating the same, electronic device and circuit board
10/24/2012CN102754535A Method for manufacturing an electronic box
10/24/2012CN102754534A Electronic component, conductive paste, and method for manufacturing electronic component
10/24/2012CN102754533A Device for screening an electronic module
10/24/2012CN102754214A Systems and methods for a continuous-well decoupling capacitor
10/24/2012CN102753733A Laminate for flexible wiring
10/24/2012CN102752963A Unit circuit board replacing method for integrated substrate and integrated substrate
10/24/2012CN102752962A Substrate provided with metal layer and manufacturing method thereof
10/24/2012CN102752958A Multilayered printed circuit board and method for manufacturing the same
10/24/2012CN102752957A Metal core printed circuit board and electronic package structure
10/24/2012CN102752956A Flexible laminate board and flexible print wiring board
10/24/2012CN102752955A Multilayer stacked circuit arrangement with localized separation section
10/24/2012CN102752954A Flexible printed circuit board and electronic device using flexible printed circuit board
10/24/2012CN102752953A Printed circuit board and assembly for lighting equipment
10/24/2012CN102751256A Packaging substrate of embedded passive assembly and manufacture method of packaging substrate
10/24/2012CN102749518A Structure for measuring bump resistance and package substrate comprising the same
10/24/2012CN102748726A LED (light-emitting diode) flexible circuit board and hose lamp with same
10/24/2012CN102226033B Epoxy resin composition as well as prepreg and metal-foil-clad laminated board manufactured by using same
10/24/2012CN101868747B Printed circuit board element and method for the production thereof
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