Patents for H05K 1 - Printed circuits (98,583)
09/2012
09/05/2012CN202425193U Aluminium-based circuit board
09/05/2012CN202425192U Water-proof structure of rigid-flex circuit board
09/05/2012CN202425191U Thick-gold electro-plated battery flexible circuit board
09/05/2012CN202425190U Stepped circuit board
09/05/2012CN202425189U Flexible printed circuit board (FPC) cable binding of capacitance-type touch screen
09/05/2012CN202425188U PCB with rhombic meshy gummosis slots
09/05/2012CN202425187U Welding point structure of novel LED backlight source
09/05/2012CN202425186U Pcb
09/05/2012CN202425185U Novel LED circuit board
09/05/2012CN202425184U Multilayer flexible circuit board
09/05/2012CN202423383U Light emitting diode (LED) encapsulation structure
09/05/2012CN202423382U LED (Light Emitting Diode) ceramic substrate
09/05/2012CN202422780U Bus bar and PCB (printed circuit board)
09/05/2012CN202422010U Connection structure for flexible circuit board of keyboard
09/05/2012CN202421665U Mechanism for assembling flexible circuit boards of liquid crystal display module
09/05/2012CN1901181B Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
09/05/2012CN102656957A Process for producing electric circuits on a given surface
09/05/2012CN102656956A Flexible printed circuit board and method of manufacturing thereof
09/05/2012CN102656955A A method of manufacturing substrates having asymmetric buildup layers
09/05/2012CN102656954A Method for connecting a plurality of elements of a circuit board, circuit board, and use of such a method
09/05/2012CN102656687A Via structure integrated in electronic substrate
09/05/2012CN102656630A Circuit board, manufacturing method of circuit board, suspension substrate, suspension, device-mounted suspension, and hard disk drive
09/05/2012CN102656244A 各向异性导电性粘接剂 Anisotropic conductive adhesive
09/05/2012CN102656234A Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminate
09/05/2012CN102655715A Flexible printed circuit board (PCB) and manufacturing method thereof
09/05/2012CN102655714A Manufacturing process of metal substrate high-conductivity metal base circuit board
09/05/2012CN102655713A Manufacturing process of high-conduction metal-based circuit board of metal substrate
09/05/2012CN102655711A Novel circuit board
09/05/2012CN102655710A Power module DBC (Direct Bonding Copper) board with heat radiation structure
09/05/2012CN102655709A Structure for improving target position holes on PCB (printed circuit board)
09/05/2012CN102190777B Epoxy resin curing composition
09/05/2012CN102088819B Novel electronic circuit substrate and manufacturing process thereof
09/05/2012CN102013418B Novel PCB (Printed Circuit Board) carrier tape for SIM card package
09/05/2012CN101964159B Display module for mobile communication device
09/05/2012CN101952902B Conductive paste, electromagnetic wave-shielding film using same, and electromagnetic wave-shielding flexible printed wiring board
09/05/2012CN101932191B Measuring equipment and amplifying circuit, impedance component and multilayer printed circuit board thereof
09/05/2012CN101932190B Measuring equipment and amplifying circuit, impedance component and multi-layer printed circuit board thereof
09/05/2012CN101932189B Measuring equipment and amplifying circuit, impedance component and multilayer printed circuit board thereof
09/05/2012CN101909406B Board interconnection structure
09/05/2012CN101888747B Method for manufacturing printed-circuit board
09/05/2012CN101883470B Prepreg for printed board and laminated plate adhered with metal foil
09/05/2012CN101826409B Side control structure of electronic structure and circuit board manufacturing method thereof
09/05/2012CN101763927B Slide potentiometer and circuit board and potentiometer main body thereof
09/05/2012CN101690428B Ceramic substrate and its manufacture method
09/05/2012CN101533587B 等离子体显示装置 The plasma display apparatus
09/05/2012CN101510515B Circuit board, manufacturing method thereof and chip packaging structure
09/05/2012CN101467248B Heat dissipating wiring board and method for manufacturing same
09/05/2012CN101304637B Wiring forming method of printed circuit board
09/05/2012CN101232995B 覆金属聚酰亚胺膜 Metal-clad polyimide film
09/04/2012US8259460 Submount for electronic components
09/04/2012US8259455 Device for protecting the pins of an electronic component
09/04/2012US8259454 Interconnect structure including hybrid frame panel
09/04/2012US8259295 Fabrication method of semiconductor integrated circuit device
09/04/2012US8258973 Transferable patient care equipment support
09/04/2012US8258694 Method for manufacturing flexible display device having an insulative overcoat and flexible display device having the same
09/04/2012US8258411 Printed circuit board with improved via design
09/04/2012US8258410 Construction of reliable stacked via in electronic substrates—vertical stiffness control method
09/04/2012US8258409 Circuit board and circuit device
09/04/2012US8258407 Wiring board and method of preventing high voltage damage
09/04/2012US8258406 Electrophoretic display device
09/04/2012US8258405 Sensor for a hardware protection system for sensitive electronic-data modules protecting against external manipulations
09/04/2012US8258216 Thermosetting resin compositions and articles
09/04/2012US8257655 Gas detecting arrangement
09/04/2012US8257618 Conductor composition V
09/04/2012US8257617 Functional paste
09/04/2012US8257094 Connection terminal and transmission line
09/04/2012US8256106 Method for fabricating circuit board structure with capacitors embedded therein
09/04/2012CA2769923A1 Multi-plate board-embedded capacitor and methods for fabricating the same
08/2012
08/30/2012WO2012116310A1 Ultrathin laminates
08/30/2012WO2012116107A1 A non-deleterious technique for creating continuous conductive circuits upon the surfaces of a non-conductive substrate
08/30/2012WO2012115556A1 A method for mounting connection pins in a component carrier, a die tool for mounting connection pins, a component carrier forming a module for an electronic assembly, and such an assembly
08/30/2012WO2012115555A1 A connection pin for mounting in a component carrier, a method for producing an electronic assembly comprising a motherboard with stackable modules comprising a component carrier, and such an electronic assembly
08/30/2012WO2012114988A1 Biaxially oriented polyethylene terephthalate film
08/30/2012WO2012114680A1 Metal-clad laminate plate and printed wiring plate
08/30/2012WO2012114309A1 Thermally conductive and electrically insulative polymer compositions containing a low thermally conductive filler and uses thereof
08/30/2012WO2012113762A1 High current-carrying printed circuit board and method for producing said printed circuit board
08/30/2012WO2012113228A1 Single board and communication equipment
08/30/2012US20120218728 Carrier Device, Arrangement Comprising such a Carrier Device, and Method for Patterning a Layer Stack Comprising at Least One Ceramic Layer
08/30/2012US20120218703 Circuit Board Assemblies and Data Processing Systems Including the Same
08/30/2012US20120218700 Electronic devices with ultraviolet blocking layers and processes of forming the same
08/30/2012US20120218219 Displays with minimized borders
08/30/2012US20120217987 Non-destructive determination of the moisture content in an electronic circuit board using comparison of capacitance measurements acquired from test coupons, and design structure/process therefor
08/30/2012US20120217050 Contact
08/30/2012US20120217049 Wiring board with built-in imaging device
08/30/2012US20120217048 Electronic modules having grounded electromagnetic shields
08/30/2012US20120217047 Metal-based circuit board
08/30/2012US20120217046 Conductive substrate for formation of led package structures thereon
08/30/2012US20120217045 Thermosetting resin composition, method for forming protective film for flexible wiring board, and flexible wiring board
08/30/2012US20120217044 High pin count, small son/qfn packages having heat-dissipating pad
08/30/2012US20120217043 Method of manufacturing a printed circuit board
08/30/2012US20120217042 Device for reflecting accelerated electrons
08/30/2012DE112010000447T5 Elektronische Schaltungsvorrichtung An electronic circuit device
08/30/2012DE102010048036A1 Printed circuit board for use in electronic device, such as medical device or electronic component, has one or multiple wiring layers and protection device
08/30/2012DE102010037390B4 Mehrlagige Leiterplatte mit Leiterplattensicherung Multi-layer PCB with PCB fuse
08/30/2012CA2828271A1 Ultrathin laminates
08/29/2012EP2493274A1 Metal layer structure of multilayer flexible borad and making method thereof
08/29/2012EP2493273A1 Device-mounting structure and device-mounting method
08/29/2012EP2493272A1 Device mounting structure and device mounting method
08/29/2012EP2492924A1 Insulating sheet, circuit board, and process for production of insulating sheet
08/29/2012EP2491771A1 Coupling device, assembly having a coupling device, and method for producing an assembly having a coupling device