Patents for H05K 1 - Printed circuits (98,583) |
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11/28/2012 | CN202565577U Printed circuit board (PCB) mainboard and mobile terminal |
11/28/2012 | CN202565576U Short-circuited element, circuit board module and light source module |
11/28/2012 | CN202565575U Lithium battery pack protector |
11/28/2012 | CN202565574U Dual-selection printed circuit board (PCB) package |
11/28/2012 | CN202565573U Structure for installing multi-layer soft circuit board gold fingers |
11/28/2012 | CN202565572U Circuit substrate and printing material container |
11/28/2012 | CN202565571U Wire bundle welding disk with circular through holes |
11/28/2012 | CN202565570U Novel circuit board |
11/28/2012 | CN202565569U High-reliability PCB |
11/28/2012 | CN202565568U Flexible plate connecting two-dimensional space |
11/28/2012 | CN202565567U Fixing rubber column and sound and light control switch for fire fighting with the same |
11/28/2012 | CN202565566U Semi-solidified white solder-resisting film used for LED soft lamp strip |
11/28/2012 | CN202556820U High-strength epoxy glass cloth laminated sheet double-face copper-clad plate |
11/28/2012 | CN102804940A Layout of contact pads of a system in package, comprising circuit board and electronic integrated elements |
11/28/2012 | CN102804935A Circuit board, circuit board connecting structure, and display panel assembly |
11/28/2012 | CN102804934A System in package, printed circuit board provided with such system in package |
11/28/2012 | CN102804352A Wiring layer structure and process for manufacture thereof |
11/28/2012 | CN102803576A Roughened copper foil, method for producing same, and copper clad laminate and printed circuit board |
11/28/2012 | CN102803575A Copper Foil And A Method For Producing Same |
11/28/2012 | CN102803333A Epoxy resin composition, prepreg and cured products thereof |
11/28/2012 | CN102802364A Method for arranging metal palladium layer in conducting layer of printed circuit board and layered structure thereof |
11/28/2012 | CN102802363A Printed circuit board and manufacturing method thereof |
11/28/2012 | CN102802362A Production process of composite circuit board and novel composite circuit board |
11/28/2012 | CN102802354A Electronic subassembly |
11/28/2012 | CN102802353A Flexible plate connecting method and ultrasonic probe |
11/28/2012 | CN102802352A Easy-to-be-electroplated COB (chip on board) substrate and manufacturing method thereof |
11/28/2012 | CN102802351A Through hole reducing welding pad for PCB design and method thereof |
11/28/2012 | CN102802350A Circuit board assembly and test-assisting circuit board thereof |
11/28/2012 | CN102802349A High-heat-conductivity printed circuit board |
11/28/2012 | CN102802348A High-pressure-resistant aluminum-based printed circuit board for LED (Light Emitting Diode) and manufacturing method of high-pressure-resistant aluminum-based printed circuit board |
11/28/2012 | CN102802347A Directional heat conduction PCB (printed circuit board) and electronic equipment |
11/28/2012 | CN102802346A Liquid-metal printed circuit board and preparation method thereof |
11/28/2012 | CN102802345A Circuit board and multifunctional integration system |
11/28/2012 | CN102802344A Multilayer printed wiring board and method for manufacturing multilayer printed wiring board |
11/28/2012 | CN102802343A Metal printed circuit board having aperture reflection plane and manufacturing method |
11/28/2012 | CN102802342A Printed circuit board for preventing local overheating |
11/28/2012 | CN102802341A Multilayer substrate |
11/28/2012 | CN102802340A Structure of single-scrapped contiguous circuit board |
11/28/2012 | CN102802339A Printed circuit board (PCB) |
11/28/2012 | CN102800788A Light-emitting diode (LED) packaging structure and silver plating substrate |
11/28/2012 | CN102800598A Substrate for embedding active element and embedding method |
11/28/2012 | CN102796346A Modified epoxy resin and method for preparing base material based on modified epoxy resin |
11/28/2012 | CN102796281A Heat resistant filling material used for brominated modified epoxy copper clad laminate and brominated epoxy resin composition used for copper clad laminate |
11/28/2012 | CN102206397B Resin composition as well as semi-solidified rubber sheet, laminating board and circuit board containing same |
11/28/2012 | CN102131347B Circuit substrate and manufacturing method thereof |
11/28/2012 | CN102047771B Electronic device and method for testing a circuit board |
11/28/2012 | CN102047770B Electronic device and method for testing a circuit board |
11/28/2012 | CN102047769B Electronic device and method for testing a circuit board |
11/28/2012 | CN102047347B Circuit connection material and circuit connection structure |
11/28/2012 | CN102040801B Epoxy resin composition as well as film and substrate |
11/28/2012 | CN102026498B Method for manufacturing circuit board, circuit board and chip packaging structure |
11/28/2012 | CN102007822B Printed circuit board removing bonding sheet around signal transmission line |
11/28/2012 | CN101945536B Circuit substrate and manufacturing process thereof, circuit device and manufacturing process thereof |
11/28/2012 | CN101919320B Method for producing wiring board and wiring board |
11/28/2012 | CN101896058B Electromagnetic shielding method and electromagnetic shielding film |
11/28/2012 | CN101845287B Intermediate temperature-cured epoxy adhesive for coverlay of flexible printed circuit and preparation method thereof |
11/28/2012 | CN101845199B Modified maleic anhydride-epoxy resin composite |
11/28/2012 | CN101819877B Detachable capacitor device |
11/28/2012 | CN101815401B Circuit board and a fabricating method thereof |
11/28/2012 | CN101781442B Halogen-free resin glue and film manufactured from same |
11/28/2012 | CN101772996B Shielding film for printed wiring board and printed wiring board |
11/28/2012 | CN101552026B Printed circuit board |
11/28/2012 | CN101511934B Resin composition, prepreg and laminate |
11/28/2012 | CN101394708B Circuit board and design method therefor |
11/28/2012 | CN101115353B Multilayered printed wiring board and method for manufacturing the same |
11/28/2012 | CN101061760B Flexible printing circuit board and its production method |
11/27/2012 | US8320135 Multilayer printed circuit board |
11/27/2012 | US8320134 Embedded component substrate and manufacturing methods thereof |
11/27/2012 | US8320133 Rigid/flexible circuit board |
11/27/2012 | US8320132 Computer motherboard |
11/27/2012 | US8319230 Stackable optoelectronics chip-to-chip interconnects and method of manufacturing |
11/27/2012 | US8319117 Printed circuit board |
11/27/2012 | US8319116 Rib reinforcement of plated thru-holes |
11/27/2012 | US8319115 Wiring board and manufacturing method thereof |
11/27/2012 | US8319114 Surface mount power module dual footprint |
11/27/2012 | US8319113 Printed circuit board with reduced dielectric loss |
11/27/2012 | US8319112 Environmental protection coating system and method |
11/27/2012 | US8319111 Wiring board having wiring laminate portion with via conductors embedded in resin insulating layers |
11/27/2012 | US8319110 Dual-layer flexible printed circuit |
11/27/2012 | US8319109 Electro-optical device and electronic apparatus |
11/27/2012 | US8316536 Multi-level circuit substrate fabrication method |
11/27/2012 | CA2462130C Multi-layer wiring board, ic package, and method of manufacturing multi-layer wiring board |
11/26/2012 | DE202012007971U1 Elektronische Schaltung für eine haustechnische Vorrichtung An electronic circuit for home automation device |
11/22/2012 | WO2012158525A1 Load control device having an electrically isolated antenna |
11/22/2012 | WO2012158395A1 Daughter card assemblies |
11/22/2012 | WO2012157469A1 Copper foil complex, copper foil used in copper foil complex, molded body, and method for producing molded body |
11/22/2012 | WO2012157458A1 Display device |
11/22/2012 | WO2012157375A1 Circuit connection material, circuit member connection structure, and circuit member connection structure manufacturing method |
11/22/2012 | WO2012157299A1 Glass ceramic composition |
11/22/2012 | WO2012157152A1 Wiring substrate, multi-pattern wiring substrate, and manufacturing method therefor |
11/22/2012 | WO2012156422A1 Multilayered printed circuit board with embedded emc capacitor |
11/22/2012 | WO2012156087A1 Circuit carrier |
11/22/2012 | WO2012155365A1 Backlight module and display device |
11/22/2012 | US20120295453 Tall mezzanine connector |
11/22/2012 | US20120293974 Electronic device module |
11/22/2012 | US20120293973 Multilayered wiring board and method for fabricating the same |
11/22/2012 | US20120292622 Pixel structure and electrical bridging structure |
11/22/2012 | US20120292094 Metal core board for vehicle-mountable junction box |
11/22/2012 | US20120292093 Circuit board and radiating heat system for circuit board |
11/22/2012 | US20120292092 Method of manufacturing circuit board and circuit board manufactured by the method |