Patents for H05K 1 - Printed circuits (98,583)
12/2012
12/13/2012WO2012169408A1 Circuit board and electronic device provided with same
12/13/2012WO2012169249A1 Liquid crystal polymer-copper clad laminate and copper foil used for liquid crystal polymer-copper clad laminate
12/13/2012WO2012169104A1 Electronic device, structure, and heat sink
12/13/2012WO2012169074A1 Method for forming metallic film
12/13/2012WO2012168941A1 Flexible transparent conductive coatings by direct room temperature evaporative lithography
12/13/2012WO2012168666A1 Microcircuit module and smart card comprising same
12/13/2012WO2012168018A1 Printed circuit board and control device for a vehicle transmission comprising the printed circuit board
12/13/2012WO2012167514A1 Liquid crystal display and chip on film thereof
12/13/2012US20120314390 Multilayer circuit board
12/13/2012US20120314389 Wiring board and method for manufacturing same
12/13/2012US20120314384 Low-stress tsv design using conductive particles
12/13/2012US20120314382 Stretchable circuit assemblies
12/13/2012US20120314381 Antenna designing method and data card single board of wireless terminal
12/13/2012US20120314380 Injection molded control panel with in-molded decorated plastic film that includes an internal connector
12/13/2012US20120314379 Wiring device and display device
12/13/2012US20120314374 Heat dissipating high power systems
12/13/2012US20120314369 Package carrier and package structure
12/13/2012US20120314113 Photographing apparatus and electronic device
12/13/2012US20120313729 Lc composite component and structure for mounting lc composite component
12/13/2012US20120313135 Mounting board and structure of the same
12/13/2012US20120313134 Glass substrate coated with a high-index layer under an electrode coating, and organic light-emitting device comprising such a substrate
12/13/2012US20120312591 Printed Circuit Board and Method of Manufacturing the Same
12/13/2012US20120312590 Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate
12/13/2012US20120312589 Laser Resin Activation to Provide Selective Via Plating for Via Stub Elimination
12/13/2012US20120312588 Circuit board
12/13/2012US20120312587 Patterned conductive element
12/13/2012US20120312586 Flexible printed board
12/13/2012US20120312585 Soft Electrode Material and Manufacturing Method Thereof
12/13/2012US20120312584 Package substrate and fabrication method thereof
12/13/2012US20120312583 Method of manufacturing interconnection member and electronic device, interconnection member, multilayered interconnections, electronic device, electronic device array and display device using the method
12/13/2012DE202012010826U1 Flexible Folien-Leiterplatte Flexible film circuit board
12/13/2012DE102011105190A1 Plastic part for use in automotive industry, has connector forming part of conductive connection that is formed between surface of molding layer and conductive layer, and contact element arranged in recess of molding layer
12/13/2012DE102011077206A1 Leiterplatte und Steuergerät für ein Getriebe eines Fahrzeugs mit der Leiterplatte Printed circuit board and the control unit for a transmission of a vehicle with the circuit board
12/13/2012DE102011077188A1 Layer structure i.e. prefabricated component, for contacting e.g. motor with connection line in onboard network of motor car, has conductor contactable with layer contact region on surface of layer i.e. polyurethane film
12/13/2012DE102010038492B4 Anordnung und Verfahren zum Anlöten eines elektronischen SMT-Bauelementes mit kreisrunden Kontaktfüßen Apparatus and method for soldering an electronic SMT component with circular contact pads
12/13/2012DE10156262B4 Bedieneinheit Operating unit
12/13/2012CA2838112A1 Non-combustible film, dispersion liquid for non-combustible films, method for producing non-combustible film, solar cell back sheet, flexible board, and solar cell
12/12/2012EP2533617A1 Printed circuit board assembly chip package component and welding component
12/12/2012EP2533616A1 Metal core substrate for in-vehicle electrical junction box
12/12/2012EP2532710A1 Phenol resin composition, process for production thereof, curable resin composition, cured products tehreof, and printed wiring board
12/12/2012CN202603046U Printed circuit board used for welding helical antenna and wireless terminal
12/12/2012CN202603045U Three-dimensional metal-matrix PCB assembly structure and corresponding light emitting light fixture thereof
12/12/2012CN202603044U Connection type circuit board
12/12/2012CN202603043U Soft and hard circuit board combined type led display screen module
12/12/2012CN202603042U Camera shooting module connecting structure
12/12/2012CN202603041U Novel printed circuit board (PCB)
12/12/2012CN202603040U Connection device of electric wires welded on circuit board and circuit board
12/12/2012CN202603039U Novel printed circuit board
12/12/2012CN202603038U Circuit board for backlight module
12/12/2012CN202603037U Printed circuit board (PCB)
12/12/2012CN202603036U Printed wiring board
12/12/2012CN202603035U PCB with aluminum piece binding post fixing structure
12/12/2012CN202603034U Current-limiting function module
12/12/2012CN202603033U Communication function module
12/12/2012CN202603032U High-conductivity PCB board
12/12/2012CN202603031U Heavy-current PCB board with anti-creeping function
12/12/2012CN202603030U Copper foil bubble improvement PCB (printed circuit board)
12/12/2012CN202602272U Plastic package direct-current motor circuit board
12/12/2012CN202601720U Light-emitting diode device
12/12/2012CN202601605U Heat radiation system
12/12/2012CN202601095U Flexible display device
12/12/2012CN102823059A Electronic apparatus
12/12/2012CN102822961A Circuit board, semiconductor device, manufacturing method for circuit board, and manufacturing method for semiconductor device
12/12/2012CN102822953A Metal support flexible board, metal support carrier tape for tape automated bonding using same, metal support flexible circuit board for mounting led, and copper foil-laminated metal support flexible circuit board for forming circuit
12/12/2012CN102822304A Resin composition for adhesive agent, adhesive agent and adhesive sheet each comprising same, and printed circuit board comprising same as adhesive agent layer
12/12/2012CN102822275A Liquid composition and metal-based circuit board
12/12/2012CN102822228A Epoxy resin composition for prepreg, prepreg, and multilayer printed circuit board
12/12/2012CN102822112A Metal base substrate and manufacturing method thereof
12/12/2012CN102821559A Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate
12/12/2012CN102821550A Nanostructure composite LED (Light Emitting Diode) ceramic substrate and manufacturing method thereof
12/12/2012CN102821546A Circuit board assembly for contact image sensors and manufacturing method thereof
12/12/2012CN102821545A Multilayer wiring board, manufacturing method thereof, and semiconductor device
12/12/2012CN102821544A Jointed printed circuit board
12/12/2012CN102821543A Printed circuit board laminating structure and laminating method
12/12/2012CN102821542A Power signal wall through connecting device avoiding short circuit
12/12/2012CN102821541A Transparent multi-layer circuit board
12/12/2012CN102821540A Printed circuit board capable of inhibiting electromagnetic interference
12/12/2012CN102821539A Electromagnetic-radiation-proof printed circuit board
12/12/2012CN102821538A Printed circuit board easy in installing
12/12/2012CN102821537A Printed circuit board with shielding case
12/12/2012CN102821536A Cooling printed circuit board
12/12/2012CN102821535A Printed circuit board
12/12/2012CN102820501A Ultra wideband antenna-oriented crossed H-shaped slot fractal UC-EBG (Uniplanar Compact Electromagnetic bandgap) structure and design method thereof
12/12/2012CN102820406A Manufacturing method of LED (light emitting diode) packaging structure
12/12/2012CN102056398B Circuit board structure and making method thereof
12/12/2012CN102051026B Halogen-free flame-retardant epoxy resin composition and application thereof
12/12/2012CN102036505B Welding pad structure of circuit board and manufacturing method of welding pad structure
12/12/2012CN101998753B 线路板及其制造方法 Circuit board and its manufacturing method
12/12/2012CN101857735B Silicon dioxide eutectic filling material and preparation method of laminate
12/12/2012CN101682981B Control device of a motor vehicle
12/12/2012CN101640974B Printed circuit board and method for manufacturing the same
12/12/2012CN101592760B Opto-electric hybrid module and manufacturing method thereof
12/12/2012CN101541528B Bilayer copper clad laminate
12/12/2012CN101437914B Adhesive sheet, and connecting structure for circuit member and semiconductor device which use the adhesive sheet
12/11/2012US8331103 Wiring board, method of manufacturing same, tuner module, and electronic device
12/11/2012US8331102 Printed circuit board
12/11/2012US8331101 Chip component mounted wiring board
12/11/2012US8331097 Cloth comprising separable sensitive areas
12/11/2012US8331096 Fingerprint acquisition expansion card apparatus
12/11/2012US8330054 Printed circuit board and magnetic head driving device including the same